Assembly and reliability of lead-free solder joints:
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Singapore
Springer
[2020]
|
| Schlagworte: | |
| Beschreibung: | xxi, 527 Seiten Illustrationen, Diagramme |
| ISBN: | 9789811539190 |
Internformat
MARC
| LEADER | 00000nam a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV046883658 | ||
| 003 | DE-604 | ||
| 005 | 20201209 | ||
| 007 | t | ||
| 008 | 200904s2020 a||| |||| 00||| eng d | ||
| 020 | |a 9789811539190 |9 978-981-15-3919-0 | ||
| 035 | |a (OCoLC)1226706944 | ||
| 035 | |a (DE-599)BVBBV046883658 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-83 | ||
| 082 | 0 | |a 621.381 |2 23 | |
| 084 | |a ZN 4125 |0 (DE-625)157354: |2 rvk | ||
| 100 | 1 | |a Lau, John H. |4 aut | |
| 245 | 1 | 0 | |a Assembly and reliability of lead-free solder joints |c John H. Lau, Ning-Cheng Lee |
| 264 | 1 | |a Singapore |b Springer |c [2020] | |
| 264 | 4 | |c © 2020 | |
| 300 | |a xxi, 527 Seiten |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 650 | 0 | 7 | |a Weichlot |0 (DE-588)4189409-1 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Zuverlässigkeit |0 (DE-588)4059245-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Bleifreies Produkt |0 (DE-588)7640225-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Löten |0 (DE-588)4036162-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Löten |0 (DE-588)4036162-7 |D s |
| 689 | 0 | 1 | |a Weichlot |0 (DE-588)4189409-1 |D s |
| 689 | 0 | 2 | |a Bleifreies Produkt |0 (DE-588)7640225-3 |D s |
| 689 | 0 | 3 | |a Zuverlässigkeit |0 (DE-588)4059245-5 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Lee, Ning-Cheng |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |z 978-981-153-920-6 |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-032293608 | ||
Datensatz im Suchindex
| _version_ | 1804181742923284480 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author | Lau, John H. Lee, Ning-Cheng |
| author_facet | Lau, John H. Lee, Ning-Cheng |
| author_role | aut aut |
| author_sort | Lau, John H. |
| author_variant | j h l jh jhl n c l ncl |
| building | Verbundindex |
| bvnumber | BV046883658 |
| classification_rvk | ZN 4125 |
| ctrlnum | (OCoLC)1226706944 (DE-599)BVBBV046883658 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01425nam a2200421zc 4500</leader><controlfield tag="001">BV046883658</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20201209 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">200904s2020 a||| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789811539190</subfield><subfield code="9">978-981-15-3919-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1226706944</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046883658</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4125</subfield><subfield code="0">(DE-625)157354:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Lau, John H.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Assembly and reliability of lead-free solder joints</subfield><subfield code="c">John H. Lau, Ning-Cheng Lee</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">Springer</subfield><subfield code="c">[2020]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2020</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xxi, 527 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Weichlot</subfield><subfield code="0">(DE-588)4189409-1</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Zuverlässigkeit</subfield><subfield code="0">(DE-588)4059245-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bleifreies Produkt</subfield><subfield code="0">(DE-588)7640225-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Löten</subfield><subfield code="0">(DE-588)4036162-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Löten</subfield><subfield code="0">(DE-588)4036162-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Weichlot</subfield><subfield code="0">(DE-588)4189409-1</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Bleifreies Produkt</subfield><subfield code="0">(DE-588)7640225-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Zuverlässigkeit</subfield><subfield code="0">(DE-588)4059245-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lee, Ning-Cheng</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Online-Ausgabe</subfield><subfield code="z">978-981-153-920-6</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032293608</subfield></datafield></record></collection> |
| id | DE-604.BV046883658 |
| illustrated | Illustrated |
| index_date | 2024-07-03T15:18:55Z |
| indexdate | 2024-07-10T08:56:30Z |
| institution | BVB |
| isbn | 9789811539190 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032293608 |
| oclc_num | 1226706944 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | xxi, 527 Seiten Illustrationen, Diagramme |
| publishDate | 2020 |
| publishDateSearch | 2020 |
| publishDateSort | 2020 |
| publisher | Springer |
| record_format | marc |
| spelling | Lau, John H. aut Assembly and reliability of lead-free solder joints John H. Lau, Ning-Cheng Lee Singapore Springer [2020] © 2020 xxi, 527 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Weichlot (DE-588)4189409-1 gnd rswk-swf Zuverlässigkeit (DE-588)4059245-5 gnd rswk-swf Bleifreies Produkt (DE-588)7640225-3 gnd rswk-swf Löten (DE-588)4036162-7 gnd rswk-swf Löten (DE-588)4036162-7 s Weichlot (DE-588)4189409-1 s Bleifreies Produkt (DE-588)7640225-3 s Zuverlässigkeit (DE-588)4059245-5 s DE-604 Lee, Ning-Cheng aut Erscheint auch als Online-Ausgabe 978-981-153-920-6 |
| spellingShingle | Lau, John H. Lee, Ning-Cheng Assembly and reliability of lead-free solder joints Weichlot (DE-588)4189409-1 gnd Zuverlässigkeit (DE-588)4059245-5 gnd Bleifreies Produkt (DE-588)7640225-3 gnd Löten (DE-588)4036162-7 gnd |
| subject_GND | (DE-588)4189409-1 (DE-588)4059245-5 (DE-588)7640225-3 (DE-588)4036162-7 |
| title | Assembly and reliability of lead-free solder joints |
| title_auth | Assembly and reliability of lead-free solder joints |
| title_exact_search | Assembly and reliability of lead-free solder joints |
| title_exact_search_txtP | Assembly and reliability of lead-free solder joints |
| title_full | Assembly and reliability of lead-free solder joints John H. Lau, Ning-Cheng Lee |
| title_fullStr | Assembly and reliability of lead-free solder joints John H. Lau, Ning-Cheng Lee |
| title_full_unstemmed | Assembly and reliability of lead-free solder joints John H. Lau, Ning-Cheng Lee |
| title_short | Assembly and reliability of lead-free solder joints |
| title_sort | assembly and reliability of lead free solder joints |
| topic | Weichlot (DE-588)4189409-1 gnd Zuverlässigkeit (DE-588)4059245-5 gnd Bleifreies Produkt (DE-588)7640225-3 gnd Löten (DE-588)4036162-7 gnd |
| topic_facet | Weichlot Zuverlässigkeit Bleifreies Produkt Löten |
| work_keys_str_mv | AT laujohnh assemblyandreliabilityofleadfreesolderjoints AT leeningcheng assemblyandreliabilityofleadfreesolderjoints |