Solder materials:
"This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the impo...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Publishing Company Pte Limited
2018
|
| Schriftenreihe: | WSPC series in advanced integration and packaging
|
| Schlagworte: | |
| Online-Zugang: | UBY01 Volltext |
| Zusammenfassung: | "This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials."--Publisher's website |
| Beschreibung: | Includes bibliographical references and index Solder products and soldering process -- Solder alloys -- Physical metallurgy of solder alloys -- Solderability and soldering reaction -- Solid state reactions of solder joints induced by thermal energy -- Solid state interactions induced by electromigration -- Mechanical properties -- Reliability of solder joints |
| Beschreibung: | 1 online resource (388 pages) illustrations (some color) |
| ISBN: | 9789813238206 |
Internformat
MARC
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| 024 | 7 | |a 10.1142/10921 |2 doi | |
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| 035 | |a (OCoLC)1100119021 | ||
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| 264 | 1 | |a Singapore |b World Scientific Publishing Company Pte Limited |c 2018 | |
| 300 | |a 1 online resource (388 pages) |b illustrations (some color) | ||
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| 490 | 0 | |a WSPC series in advanced integration and packaging | |
| 500 | |a Includes bibliographical references and index | ||
| 500 | |a Solder products and soldering process -- Solder alloys -- Physical metallurgy of solder alloys -- Solderability and soldering reaction -- Solid state reactions of solder joints induced by thermal energy -- Solid state interactions induced by electromigration -- Mechanical properties -- Reliability of solder joints | ||
| 520 | |a "This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials."--Publisher's website | ||
| 650 | 4 | |a Solder and soldering | |
| 650 | 4 | |a Welded joints | |
| 650 | 4 | |a Electronic books | |
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Datensatz im Suchindex
| _version_ | 1804181615427977216 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author | Lin, Kwang-Lung |
| author_facet | Lin, Kwang-Lung |
| author_role | aut |
| author_sort | Lin, Kwang-Lung |
| author_variant | k l l kll |
| building | Verbundindex |
| bvnumber | BV046810381 |
| collection | ZDB-124-WOP |
| ctrlnum | (ZDB-124-WOP)00010921 (OCoLC)1100119021 (DE-599)BVBBV046810381 |
| dewey-full | 671.56 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 671 - Metalworking & primary metal products |
| dewey-raw | 671.56 |
| dewey-search | 671.56 |
| dewey-sort | 3671.56 |
| dewey-tens | 670 - Manufacturing |
| discipline | Werkstoffwissenschaften / Fertigungstechnik |
| discipline_str_mv | Werkstoffwissenschaften / Fertigungstechnik |
| format | Electronic eBook |
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| id | DE-604.BV046810381 |
| illustrated | Illustrated |
| index_date | 2024-07-03T14:58:47Z |
| indexdate | 2024-07-10T08:54:28Z |
| institution | BVB |
| isbn | 9789813238206 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032218953 |
| oclc_num | 1100119021 |
| open_access_boolean | |
| owner | DE-706 |
| owner_facet | DE-706 |
| physical | 1 online resource (388 pages) illustrations (some color) |
| psigel | ZDB-124-WOP |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | World Scientific Publishing Company Pte Limited |
| record_format | marc |
| series2 | WSPC series in advanced integration and packaging |
| spelling | Lin, Kwang-Lung aut Solder materials Kwang-Lung Lin Singapore World Scientific Publishing Company Pte Limited 2018 1 online resource (388 pages) illustrations (some color) txt rdacontent c rdamedia cr rdacarrier WSPC series in advanced integration and packaging Includes bibliographical references and index Solder products and soldering process -- Solder alloys -- Physical metallurgy of solder alloys -- Solderability and soldering reaction -- Solid state reactions of solder joints induced by thermal energy -- Solid state interactions induced by electromigration -- Mechanical properties -- Reliability of solder joints "This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials."--Publisher's website Solder and soldering Welded joints Electronic books Weichlot (DE-588)4189409-1 gnd rswk-swf Stoffeigenschaft (DE-588)4192147-1 gnd rswk-swf Weichlot (DE-588)4189409-1 s Stoffeigenschaft (DE-588)4192147-1 s DE-604 Erscheint auch als Druck-Ausgabe 9789813237605 http://www.worldscientific.com/worldscibooks/10.1142/10921 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Lin, Kwang-Lung Solder materials Solder and soldering Welded joints Electronic books Weichlot (DE-588)4189409-1 gnd Stoffeigenschaft (DE-588)4192147-1 gnd |
| subject_GND | (DE-588)4189409-1 (DE-588)4192147-1 |
| title | Solder materials |
| title_auth | Solder materials |
| title_exact_search | Solder materials |
| title_exact_search_txtP | Solder materials |
| title_full | Solder materials Kwang-Lung Lin |
| title_fullStr | Solder materials Kwang-Lung Lin |
| title_full_unstemmed | Solder materials Kwang-Lung Lin |
| title_short | Solder materials |
| title_sort | solder materials |
| topic | Solder and soldering Welded joints Electronic books Weichlot (DE-588)4189409-1 gnd Stoffeigenschaft (DE-588)4192147-1 gnd |
| topic_facet | Solder and soldering Welded joints Electronic books Weichlot Stoffeigenschaft |
| url | http://www.worldscientific.com/worldscibooks/10.1142/10921 |
| work_keys_str_mv | AT linkwanglung soldermaterials |