MEMS packaging:
"MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during ma...
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Publishing Company Pte Limited
2018
|
| Schriftenreihe: | WSPC series in advanced integration and packaging
|
| Schlagworte: | |
| Online-Zugang: | UBY01 Volltext |
| Zusammenfassung: | "MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability."-- |
| Beschreibung: | Includes bibliographical references and index Introduction to MEMS Packaging / Y C Lee, Ramesh Ramadoss and Nils Hoivik -- Silex's TSV Technology: Overview of Processes and MEMS Applications / Tomas Bauer and Thorbjörn Ebefors -- Vertical Interconnects for High-end MEMS / Maaike M Visser Taklo and Sigurd Moe -- Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost / Paul Pickering, Collin Twanow and Dean Spicer -- Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market / Steven Nasiri, Ramesh Ramadoss and Sandra Winkler -- PCB Based MEMS and Microfluidics / Ramesh Ramadoss, Antonio Luque and Carmen Aracil -- Single Wafer Encapsulation of MEMS Resonators / Janna Rodriguez and Thomas Kenny -- Heterogeneous Integration and Wafer-Level Packaging of MEMS / Masayoshi Esashi and Shuji Tanaka -- Packaging of Membrane-Based Polymer Microfluidic Systems / Yu-Chuan Su -- Wafer-Level Solder Bonding by Using Localized Induction Heating / Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang -- Localized Sealing Schemes for MEMS Packaging / Y T Cheng, Y C Su and Liwei Lin -- Microsprings for High-Density Flip-Chip Packaging / Eugene M Chow and Christopher L Chua -- MEMS Reliability / Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht |
| Beschreibung: | 1 online resource (363 pages) illustrations (some color), portraits (some color) |
| ISBN: | 9789813229365 |
Internformat
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| 490 | 0 | |a WSPC series in advanced integration and packaging | |
| 500 | |a Includes bibliographical references and index | ||
| 500 | |a Introduction to MEMS Packaging / Y C Lee, Ramesh Ramadoss and Nils Hoivik -- Silex's TSV Technology: Overview of Processes and MEMS Applications / Tomas Bauer and Thorbjörn Ebefors -- Vertical Interconnects for High-end MEMS / Maaike M Visser Taklo and Sigurd Moe -- Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost / Paul Pickering, Collin Twanow and Dean Spicer -- Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market / Steven Nasiri, Ramesh Ramadoss and Sandra Winkler -- PCB Based MEMS and Microfluidics / Ramesh Ramadoss, Antonio Luque and Carmen Aracil -- Single Wafer Encapsulation of MEMS Resonators / Janna Rodriguez and Thomas Kenny -- Heterogeneous Integration and Wafer-Level Packaging of MEMS / Masayoshi Esashi and Shuji Tanaka -- Packaging of Membrane-Based Polymer Microfluidic Systems / Yu-Chuan Su -- Wafer-Level Solder Bonding by Using Localized Induction Heating / Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang -- Localized Sealing Schemes for MEMS Packaging / Y T Cheng, Y C Su and Liwei Lin -- Microsprings for High-Density Flip-Chip Packaging / Eugene M Chow and Christopher L Chua -- MEMS Reliability / Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht | ||
| 520 | |a "MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability."-- | ||
| 650 | 4 | |a Microelectromechanical systems | |
| 650 | 4 | |a Microelectronic pakaging | |
| 650 | 4 | |a Electronic books | |
| 700 | 1 | |a Lee, Y.C. |e Sonstige |4 oth | |
| 700 | 1 | |a Cheng, Yu-Ting |e Sonstige |4 oth | |
| 700 | 1 | |a Ramadoss, Ramesh |e Sonstige |4 oth | |
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| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV046809735 |
| illustrated | Illustrated |
| index_date | 2024-07-03T14:58:38Z |
| indexdate | 2024-07-10T08:54:27Z |
| institution | BVB |
| isbn | 9789813229365 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032218324 |
| oclc_num | 1045420659 |
| open_access_boolean | |
| owner | DE-706 |
| owner_facet | DE-706 |
| physical | 1 online resource (363 pages) illustrations (some color), portraits (some color) |
| psigel | ZDB-124-WOP |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | World Scientific Publishing Company Pte Limited |
| record_format | marc |
| series2 | WSPC series in advanced integration and packaging |
| spelling | MEMS packaging editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss Singapore World Scientific Publishing Company Pte Limited 2018 1 online resource (363 pages) illustrations (some color), portraits (some color) txt rdacontent c rdamedia cr rdacarrier WSPC series in advanced integration and packaging Includes bibliographical references and index Introduction to MEMS Packaging / Y C Lee, Ramesh Ramadoss and Nils Hoivik -- Silex's TSV Technology: Overview of Processes and MEMS Applications / Tomas Bauer and Thorbjörn Ebefors -- Vertical Interconnects for High-end MEMS / Maaike M Visser Taklo and Sigurd Moe -- Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost / Paul Pickering, Collin Twanow and Dean Spicer -- Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market / Steven Nasiri, Ramesh Ramadoss and Sandra Winkler -- PCB Based MEMS and Microfluidics / Ramesh Ramadoss, Antonio Luque and Carmen Aracil -- Single Wafer Encapsulation of MEMS Resonators / Janna Rodriguez and Thomas Kenny -- Heterogeneous Integration and Wafer-Level Packaging of MEMS / Masayoshi Esashi and Shuji Tanaka -- Packaging of Membrane-Based Polymer Microfluidic Systems / Yu-Chuan Su -- Wafer-Level Solder Bonding by Using Localized Induction Heating / Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang -- Localized Sealing Schemes for MEMS Packaging / Y T Cheng, Y C Su and Liwei Lin -- Microsprings for High-Density Flip-Chip Packaging / Eugene M Chow and Christopher L Chua -- MEMS Reliability / Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht "MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability."-- Microelectromechanical systems Microelectronic pakaging Electronic books Lee, Y.C. Sonstige oth Cheng, Yu-Ting Sonstige oth Ramadoss, Ramesh Sonstige oth Erscheint auch als Druck-Ausgabe 9789813229358 http://www.worldscientific.com/worldscibooks/10.1142/10692 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | MEMS packaging Microelectromechanical systems Microelectronic pakaging Electronic books |
| title | MEMS packaging |
| title_auth | MEMS packaging |
| title_exact_search | MEMS packaging |
| title_exact_search_txtP | MEMS packaging |
| title_full | MEMS packaging editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss |
| title_fullStr | MEMS packaging editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss |
| title_full_unstemmed | MEMS packaging editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss |
| title_short | MEMS packaging |
| title_sort | mems packaging |
| topic | Microelectromechanical systems Microelectronic pakaging Electronic books |
| topic_facet | Microelectromechanical systems Microelectronic pakaging Electronic books |
| url | http://www.worldscientific.com/worldscibooks/10.1142/10692 |
| work_keys_str_mv | AT leeyc memspackaging AT chengyuting memspackaging AT ramadossramesh memspackaging |