Reflow soldering: apparatus and heat transfer processes
Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convec...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Amsterdam
Elsevier
[2020]
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| Schlagworte: | |
| Zusammenfassung: | Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. - Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles- Analyses and compares the different reflow ovens- Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality- Introduces Vapor Phase Soldering (VPS) technology |
| Beschreibung: | Approx. 150 illustrations (30 in full color) 1. Introduction to Surface Mounting Technology 2. Infrared ovens 3. Convection ovens 4. Vapor Phase Soldering (VPS) ovens 5. Special reflow ovens 6. Numerical simulation of reflow ovens |
| Beschreibung: | viii, 285 Seiten Illustrationen, Diagramme 229 mm |
| ISBN: | 9780128185056 |
Internformat
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| 500 | |a 1. Introduction to Surface Mounting Technology 2. Infrared ovens 3. Convection ovens 4. Vapor Phase Soldering (VPS) ovens 5. Special reflow ovens 6. Numerical simulation of reflow ovens | ||
| 520 | |a Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. - Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles- Analyses and compares the different reflow ovens- Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality- Introduces Vapor Phase Soldering (VPS) technology | ||
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| 700 | 1 | |a Géczy, Attila |e Verfasser |4 aut | |
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| index_date | 2024-07-03T14:47:00Z |
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| institution | BVB |
| isbn | 9780128185056 |
| language | English |
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| physical | viii, 285 Seiten Illustrationen, Diagramme 229 mm |
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| spelling | Illés, Balázs Verfasser aut Reflow soldering apparatus and heat transfer processes Balázs Illés (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary), Olivér Krammer (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary), Attila Géczy (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary) Amsterdam Elsevier [2020] viii, 285 Seiten Illustrationen, Diagramme 229 mm txt rdacontent n rdamedia nc rdacarrier Approx. 150 illustrations (30 in full color) 1. Introduction to Surface Mounting Technology 2. Infrared ovens 3. Convection ovens 4. Vapor Phase Soldering (VPS) ovens 5. Special reflow ovens 6. Numerical simulation of reflow ovens Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. - Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles- Analyses and compares the different reflow ovens- Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality- Introduces Vapor Phase Soldering (VPS) technology bicssc Reflow-Löten (DE-588)4273607-9 gnd rswk-swf Reflow-Löten (DE-588)4273607-9 s DE-604 Krammer, Olivér Verfasser aut Géczy, Attila Verfasser aut |
| spellingShingle | Illés, Balázs Krammer, Olivér Géczy, Attila Reflow soldering apparatus and heat transfer processes bicssc Reflow-Löten (DE-588)4273607-9 gnd |
| subject_GND | (DE-588)4273607-9 |
| title | Reflow soldering apparatus and heat transfer processes |
| title_auth | Reflow soldering apparatus and heat transfer processes |
| title_exact_search | Reflow soldering apparatus and heat transfer processes |
| title_exact_search_txtP | Reflow soldering apparatus and heat transfer processes |
| title_full | Reflow soldering apparatus and heat transfer processes Balázs Illés (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary), Olivér Krammer (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary), Attila Géczy (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary) |
| title_fullStr | Reflow soldering apparatus and heat transfer processes Balázs Illés (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary), Olivér Krammer (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary), Attila Géczy (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary) |
| title_full_unstemmed | Reflow soldering apparatus and heat transfer processes Balázs Illés (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary), Olivér Krammer (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary), Attila Géczy (Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary) |
| title_short | Reflow soldering |
| title_sort | reflow soldering apparatus and heat transfer processes |
| title_sub | apparatus and heat transfer processes |
| topic | bicssc Reflow-Löten (DE-588)4273607-9 gnd |
| topic_facet | bicssc Reflow-Löten |
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