Assembly and Reliability of Lead-Free Solder Joints:
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Singapore
Springer Singapore
2020
Singapore Springer |
| Ausgabe: | 1st ed. 2020 |
| Schlagworte: | |
| Online-Zugang: | BTU01 FAB01 FAW01 FHA01 FHD01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 Volltext |
| Beschreibung: | 1 Online-Ressource (XXI, 527 p. 598 illus., 347 illus. in color) |
| ISBN: | 9789811539206 |
| DOI: | 10.1007/978-981-15-3920-6 |
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| author | Lau, John H. Lee, Ning-Cheng |
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| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| discipline_str_mv | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-981-15-3920-6 |
| edition | 1st ed. 2020 |
| format | Electronic eBook |
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| id | DE-604.BV046747277 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T14:41:05Z |
| indexdate | 2024-08-01T15:20:38Z |
| institution | BVB |
| isbn | 9789811539206 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032157065 |
| oclc_num | 1197333964 |
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| physical | 1 Online-Ressource (XXI, 527 p. 598 illus., 347 illus. in color) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2020_Fremddaten |
| publishDate | 2020 |
| publishDateSearch | 2020 |
| publishDateSort | 2020 |
| publisher | Springer Singapore Springer |
| record_format | marc |
| spellingShingle | Lau, John H. Lee, Ning-Cheng Assembly and Reliability of Lead-Free Solder Joints Electronics and Microelectronics, Instrumentation Circuits and Systems Electronics Microelectronics Electronic circuits Löten (DE-588)4036162-7 gnd Zuverlässigkeit (DE-588)4059245-5 gnd Weichlot (DE-588)4189409-1 gnd Bleifreies Produkt (DE-588)7640225-3 gnd |
| subject_GND | (DE-588)4036162-7 (DE-588)4059245-5 (DE-588)4189409-1 (DE-588)7640225-3 |
| title | Assembly and Reliability of Lead-Free Solder Joints |
| title_auth | Assembly and Reliability of Lead-Free Solder Joints |
| title_exact_search | Assembly and Reliability of Lead-Free Solder Joints |
| title_exact_search_txtP | Assembly and Reliability of Lead-Free Solder Joints |
| title_full | Assembly and Reliability of Lead-Free Solder Joints by John H. Lau, Ning-Cheng Lee |
| title_fullStr | Assembly and Reliability of Lead-Free Solder Joints by John H. Lau, Ning-Cheng Lee |
| title_full_unstemmed | Assembly and Reliability of Lead-Free Solder Joints by John H. Lau, Ning-Cheng Lee |
| title_short | Assembly and Reliability of Lead-Free Solder Joints |
| title_sort | assembly and reliability of lead free solder joints |
| topic | Electronics and Microelectronics, Instrumentation Circuits and Systems Electronics Microelectronics Electronic circuits Löten (DE-588)4036162-7 gnd Zuverlässigkeit (DE-588)4059245-5 gnd Weichlot (DE-588)4189409-1 gnd Bleifreies Produkt (DE-588)7640225-3 gnd |
| topic_facet | Electronics and Microelectronics, Instrumentation Circuits and Systems Electronics Microelectronics Electronic circuits Löten Zuverlässigkeit Weichlot Bleifreies Produkt |
| url | https://doi.org/10.1007/978-981-15-3920-6 |
| work_keys_str_mv | AT laujohnh assemblyandreliabilityofleadfreesolderjoints AT leeningcheng assemblyandreliabilityofleadfreesolderjoints |