Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement:
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boca Raton ; London ; New York
CRC Press
[2019]
|
| Schlagworte: | |
| Online-Zugang: | TUM01 |
| Beschreibung: | Description based on publisher supplied metadata and other sources |
| Beschreibung: | 1 Online-Ressource (xiii, 226 Seiten) Illustrationen, Diagramme |
| ISBN: | 9780429680076 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV046730592 | ||
| 003 | DE-604 | ||
| 005 | 20240216 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 200522s2019 |||| o||u| ||||||eng d | ||
| 020 | |a 9780429680076 |9 978-0-429-68007-6 | ||
| 035 | |a (ZDB-30-PQE)EBC5725884 | ||
| 035 | |a (ZDB-89-EBL)EBL5725884 | ||
| 035 | |a (OCoLC)1090017816 | ||
| 035 | |a (DE-599)BVBBV046730592 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-91 | ||
| 082 | 0 | |a 621.3815 | |
| 084 | |a ZN 4940 |0 (DE-625)157423: |2 rvk | ||
| 084 | |a ELT 340 |2 stub | ||
| 084 | |a DAT 120 |2 stub | ||
| 100 | 1 | |a Ma, Yue |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |c Yue Ma and Christian Gontrand |
| 264 | 1 | |a Boca Raton ; London ; New York |b CRC Press |c [2019] | |
| 264 | 4 | |c © 2019 | |
| 300 | |a 1 Online-Ressource (xiii, 226 Seiten) |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Description based on publisher supplied metadata and other sources | ||
| 650 | 4 | |a Three-dimensional integrated circuits | |
| 700 | 1 | |a Gontrand, Christian |e Verfasser |0 (DE-588)1185986553 |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |a Ma, Yue |t Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement |d Milton : Taylor & Francis Group,c2019 |n Druck-Ausgabe, Hardcover |z 978-0-367-02343-0 |
| 912 | |a ZDB-30-PQE | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-032140661 | ||
| 966 | e | |u https://ebookcentral.proquest.com/lib/munchentech/detail.action?docID=5725884 |l TUM01 |p ZDB-30-PQE |q TUM_PDA_PQE_Kauf |x Aggregator |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804181477346246656 |
|---|---|
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author | Ma, Yue Gontrand, Christian |
| author_GND | (DE-588)1185986553 |
| author_facet | Ma, Yue Gontrand, Christian |
| author_role | aut aut |
| author_sort | Ma, Yue |
| author_variant | y m ym c g cg |
| building | Verbundindex |
| bvnumber | BV046730592 |
| classification_rvk | ZN 4940 |
| classification_tum | ELT 340 DAT 120 |
| collection | ZDB-30-PQE |
| ctrlnum | (ZDB-30-PQE)EBC5725884 (ZDB-89-EBL)EBL5725884 (OCoLC)1090017816 (DE-599)BVBBV046730592 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Informatik Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Informatik Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01686nmm a2200409zc 4500</leader><controlfield tag="001">BV046730592</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20240216 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">200522s2019 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780429680076</subfield><subfield code="9">978-0-429-68007-6</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-30-PQE)EBC5725884</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-89-EBL)EBL5725884</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1090017816</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046730592</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4940</subfield><subfield code="0">(DE-625)157423:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 340</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">DAT 120</subfield><subfield code="2">stub</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Ma, Yue</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement</subfield><subfield code="c">Yue Ma and Christian Gontrand</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boca Raton ; London ; New York</subfield><subfield code="b">CRC Press</subfield><subfield code="c">[2019]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2019</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (xiii, 226 Seiten)</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Description based on publisher supplied metadata and other sources</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Three-dimensional integrated circuits</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Gontrand, Christian</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)1185986553</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="a">Ma, Yue</subfield><subfield code="t">Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement</subfield><subfield code="d">Milton : Taylor & Francis Group,c2019</subfield><subfield code="n">Druck-Ausgabe, Hardcover</subfield><subfield code="z">978-0-367-02343-0</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-30-PQE</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032140661</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://ebookcentral.proquest.com/lib/munchentech/detail.action?docID=5725884</subfield><subfield code="l">TUM01</subfield><subfield code="p">ZDB-30-PQE</subfield><subfield code="q">TUM_PDA_PQE_Kauf</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV046730592 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T14:36:28Z |
| indexdate | 2024-07-10T08:52:17Z |
| institution | BVB |
| isbn | 9780429680076 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032140661 |
| oclc_num | 1090017816 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | 1 Online-Ressource (xiii, 226 Seiten) Illustrationen, Diagramme |
| psigel | ZDB-30-PQE ZDB-30-PQE TUM_PDA_PQE_Kauf |
| publishDate | 2019 |
| publishDateSearch | 2019 |
| publishDateSort | 2019 |
| publisher | CRC Press |
| record_format | marc |
| spelling | Ma, Yue Verfasser aut Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand Boca Raton ; London ; New York CRC Press [2019] © 2019 1 Online-Ressource (xiii, 226 Seiten) Illustrationen, Diagramme txt rdacontent c rdamedia cr rdacarrier Description based on publisher supplied metadata and other sources Three-dimensional integrated circuits Gontrand, Christian Verfasser (DE-588)1185986553 aut Erscheint auch als Ma, Yue Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement Milton : Taylor & Francis Group,c2019 Druck-Ausgabe, Hardcover 978-0-367-02343-0 |
| spellingShingle | Ma, Yue Gontrand, Christian Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Three-dimensional integrated circuits |
| title | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_auth | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_exact_search | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_exact_search_txtP | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_full | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_fullStr | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_full_unstemmed | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement Yue Ma and Christian Gontrand |
| title_short | Power, thermal, noise, and signal integrity issues on substrate/interconnects entanglement |
| title_sort | power thermal noise and signal integrity issues on substrate interconnects entanglement |
| topic | Three-dimensional integrated circuits |
| topic_facet | Three-dimensional integrated circuits |
| work_keys_str_mv | AT mayue powerthermalnoiseandsignalintegrityissuesonsubstrateinterconnectsentanglement AT gontrandchristian powerthermalnoiseandsignalintegrityissuesonsubstrateinterconnectsentanglement |