Electronic packaging interconnect technology: Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
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Bibliographic Details
Corporate Author: Electronic Packaging Interconnect Technology Symposium Fukuoka (Author)
Other Authors: Nogita, Kazuhiro (Editor)
Format: Electronic Conference Proceeding eBook
Language:English
Published: Zurich, Switzerland Trans Tech Publications Ltd [2018]
Series:Solid state phenomena Volume 273
Subjects:
Item Description:Includes bibliographical references and index
Physical Description:1 Online-Ressource Illustrationen
ISBN:9781523127788

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