Electronic packaging interconnect technology: Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan
Gespeichert in:
| Körperschaft: | |
|---|---|
| Weitere Verfasser: | |
| Format: | Elektronisch Tagungsbericht E-Book |
| Sprache: | English |
| Veröffentlicht: |
Zurich, Switzerland
Trans Tech Publications Ltd
[2018]
|
| Schriftenreihe: | Solid state phenomena
Volume 273 |
| Schlagworte: | |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 Online-Ressource Illustrationen |
| ISBN: | 9781523127788 |
Internformat
MARC
| LEADER | 00000nmm a2200000 cb4500 | ||
|---|---|---|---|
| 001 | BV046661937 | ||
| 003 | DE-604 | ||
| 006 | a |||| 10||| | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 200408s2018 sz |||| o||u| ||||||eng d | ||
| 020 | |a 9781523127788 |9 978-1-5231-2778-8 | ||
| 035 | |a (OCoLC)1150807644 | ||
| 035 | |a (DE-599)BVBBV046661937 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 044 | |a sz |c XA-CH | ||
| 050 | 0 | |a TK7870.15 | |
| 084 | |a 50.94 |2 bkl | ||
| 084 | |a 53.52 |2 bkl | ||
| 111 | 2 | |a Electronic Packaging Interconnect Technology Symposium |d 2017 |c Fukuoka |j Verfasser |0 (DE-588)1161824340 |4 aut | |
| 245 | 1 | 0 | |a Electronic packaging interconnect technology |b Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan |c edited by Kazuhiro Nogita [und 4 andere] |
| 264 | 1 | |a Zurich, Switzerland |b Trans Tech Publications Ltd |c [2018] | |
| 300 | |a 1 Online-Ressource |b Illustrationen | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Solid state phenomena |v Volume 273 | |
| 500 | |a Includes bibliographical references and index | ||
| 650 | 0 | 7 | |a Schaltungsentwurf |0 (DE-588)4179389-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verbindungstechnik |0 (DE-588)4129183-9 |2 gnd |9 rswk-swf |
| 653 | 0 | |a Electronic packaging / Congresses | |
| 653 | 0 | |a Electronic packaging / Materials / Congresses | |
| 653 | 0 | |a Electronic packaging / Materials / Congresses | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 689 | 0 | 0 | |a Verbindungstechnik |0 (DE-588)4129183-9 |D s |
| 689 | 0 | 1 | |a Schaltungsentwurf |0 (DE-588)4179389-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Nogita, Kazuhiro |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-3-0357-1324-4 |
| 912 | |a ZDB-10-ESC | ||
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-032073012 | |
Datensatz im Suchindex
| _version_ | 1806055031763369984 |
|---|---|
| adam_text | |
| adam_txt | |
| any_adam_object | |
| any_adam_object_boolean | |
| author2 | Nogita, Kazuhiro |
| author2_role | edt |
| author2_variant | k n kn |
| author_corporate | Electronic Packaging Interconnect Technology Symposium Fukuoka |
| author_corporate_role | aut |
| author_facet | Nogita, Kazuhiro Electronic Packaging Interconnect Technology Symposium Fukuoka |
| author_sort | Electronic Packaging Interconnect Technology Symposium Fukuoka |
| building | Verbundindex |
| bvnumber | BV046661937 |
| callnumber-first | T - Technology |
| callnumber-label | TK7870 |
| callnumber-raw | TK7870.15 |
| callnumber-search | TK7870.15 |
| callnumber-sort | TK 47870.15 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| collection | ZDB-10-ESC |
| ctrlnum | (OCoLC)1150807644 (DE-599)BVBBV046661937 |
| format | Electronic Conference Proceeding eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>00000nmm a2200000 cb4500</leader><controlfield tag="001">BV046661937</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="006">a |||| 10|||</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">200408s2018 sz |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781523127788</subfield><subfield code="9">978-1-5231-2778-8</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1150807644</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046661937</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">sz</subfield><subfield code="c">XA-CH</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7870.15</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">50.94</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">53.52</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="111" ind1="2" ind2=" "><subfield code="a">Electronic Packaging Interconnect Technology Symposium</subfield><subfield code="d">2017</subfield><subfield code="c">Fukuoka</subfield><subfield code="j">Verfasser</subfield><subfield code="0">(DE-588)1161824340</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Electronic packaging interconnect technology</subfield><subfield code="b">Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan</subfield><subfield code="c">edited by Kazuhiro Nogita [und 4 andere]</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Zurich, Switzerland</subfield><subfield code="b">Trans Tech Publications Ltd</subfield><subfield code="c">[2018]</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource</subfield><subfield code="b">Illustrationen</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Solid state phenomena</subfield><subfield code="v">Volume 273</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Schaltungsentwurf</subfield><subfield code="0">(DE-588)4179389-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electronic packaging / Congresses</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electronic packaging / Materials / Congresses</subfield></datafield><datafield tag="653" ind1=" " ind2="0"><subfield code="a">Electronic packaging / Materials / Congresses</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Schaltungsentwurf</subfield><subfield code="0">(DE-588)4179389-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nogita, Kazuhiro</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-0357-1324-4</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-10-ESC</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-032073012</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV046661937 |
| illustrated | Not Illustrated |
| index_date | 2024-07-03T14:19:49Z |
| indexdate | 2024-07-31T01:11:37Z |
| institution | BVB |
| institution_GND | (DE-588)1161824340 |
| isbn | 9781523127788 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-032073012 |
| oclc_num | 1150807644 |
| open_access_boolean | |
| owner | DE-91 DE-BY-TUM |
| owner_facet | DE-91 DE-BY-TUM |
| physical | 1 Online-Ressource Illustrationen |
| psigel | ZDB-10-ESC |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | Trans Tech Publications Ltd |
| record_format | marc |
| series2 | Solid state phenomena |
| spelling | Electronic Packaging Interconnect Technology Symposium 2017 Fukuoka Verfasser (DE-588)1161824340 aut Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan edited by Kazuhiro Nogita [und 4 andere] Zurich, Switzerland Trans Tech Publications Ltd [2018] 1 Online-Ressource Illustrationen txt rdacontent c rdamedia cr rdacarrier Solid state phenomena Volume 273 Includes bibliographical references and index Schaltungsentwurf (DE-588)4179389-4 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Electronic packaging / Congresses Electronic packaging / Materials / Congresses (DE-588)1071861417 Konferenzschrift gnd-content Verbindungstechnik (DE-588)4129183-9 s Schaltungsentwurf (DE-588)4179389-4 s DE-604 Nogita, Kazuhiro edt Erscheint auch als Druck-Ausgabe 978-3-0357-1324-4 |
| spellingShingle | Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan Schaltungsentwurf (DE-588)4179389-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd |
| subject_GND | (DE-588)4179389-4 (DE-588)4129183-9 (DE-588)1071861417 |
| title | Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan |
| title_auth | Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan |
| title_exact_search | Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan |
| title_exact_search_txtP | Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan |
| title_full | Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan edited by Kazuhiro Nogita [und 4 andere] |
| title_fullStr | Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan edited by Kazuhiro Nogita [und 4 andere] |
| title_full_unstemmed | Electronic packaging interconnect technology Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan edited by Kazuhiro Nogita [und 4 andere] |
| title_short | Electronic packaging interconnect technology |
| title_sort | electronic packaging interconnect technology electronic packaging interconnect technology symposium epits 2017 selected peer reviewed papers from the electronic packaging interconnect technology symposium epits 2017 november 1 2 2017 fukuoka japan |
| title_sub | Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan |
| topic | Schaltungsentwurf (DE-588)4179389-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd |
| topic_facet | Schaltungsentwurf Verbindungstechnik Konferenzschrift |
| work_keys_str_mv | AT electronicpackaginginterconnecttechnologysymposiumfukuoka electronicpackaginginterconnecttechnologyelectronicpackaginginterconnecttechnologysymposiumepits2017selectedpeerreviewedpapersfromtheelectronicpackaginginterconnecttechnologysymposiumepits2017november122017fukuokajapan AT nogitakazuhiro electronicpackaginginterconnecttechnologyelectronicpackaginginterconnecttechnologysymposiumepits2017selectedpeerreviewedpapersfromtheelectronicpackaginginterconnecttechnologysymposiumepits2017november122017fukuokajapan |