Electronic Packaging Interconnect Technology Symposium Fukuoka & Nogita, K. (2018). Electronic packaging interconnect technology: Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : selected, peer reviewed papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan. Trans Tech Publications Ltd.
Chicago-Zitierstil (17. Ausg.)Electronic Packaging Interconnect Technology Symposium Fukuoka und Kazuhiro Nogita. Electronic Packaging Interconnect Technology: Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, Peer Reviewed Papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan. Zurich, Switzerland: Trans Tech Publications Ltd, 2018.
MLA-Zitierstil (9. Ausg.)Electronic Packaging Interconnect Technology Symposium Fukuoka und Kazuhiro Nogita. Electronic Packaging Interconnect Technology: Electronic Packaging Interconnect Technology Symposium (EPITS 2017) : Selected, Peer Reviewed Papers from the Electronic Packaging Interconnect Technology Symposium (EPITS 2017), November 1-2, 2017, Fukuoka, Japan. Trans Tech Publications Ltd, 2018.