Thermal management of microelectronic equipment: heat transfer theory, analysis methods and design practices
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide ra...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Schriftenreihe: | ASME Press book series on electronic packaging
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| Schlagworte: | |
| Online-Zugang: | Volltext |
| Zusammenfassung: | With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies |
| Beschreibung: | Includes bibliographical references and index 1. Introduction -- 2. Conduction -- 3. Convection -- 4. Radiation -- 5. Pool boiling -- 6. Flow boiling -- 7. Condensation -- 8. Extended surfaces -- 9. Thermal interface resistance -- 10. Components and printed circuit boards -- 11. Direct air cooling and fans -- 12. Natural and mixed convection -- 13. Heat exchangers and cold plates -- 14. Advanced cooling technologies I: single-phase liquid cooling -- 15. Advanced cooling technologies II: two-phase flow cooling -- 16. Heat pipes -- 17. Thermoelectric coolers. - System requirements: Adobe Acrobat Reader. - Mode of access: World Wide Web |
| Beschreibung: | 1 Online-Ressource (xxi, 414 Seiten) ill., digital file |
Internformat
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| 264 | 0 | |a New York, New York |b American Society Of Mechanical Engineers |c 2002 | |
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| 500 | |a Includes bibliographical references and index | ||
| 500 | |a 1. Introduction -- 2. Conduction -- 3. Convection -- 4. Radiation -- 5. Pool boiling -- 6. Flow boiling -- 7. Condensation -- 8. Extended surfaces -- 9. Thermal interface resistance -- 10. Components and printed circuit boards -- 11. Direct air cooling and fans -- 12. Natural and mixed convection -- 13. Heat exchangers and cold plates -- 14. Advanced cooling technologies I: single-phase liquid cooling -- 15. Advanced cooling technologies II: two-phase flow cooling -- 16. Heat pipes -- 17. Thermoelectric coolers. - System requirements: Adobe Acrobat Reader. - Mode of access: World Wide Web | ||
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Datensatz im Suchindex
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| author | Yeh, L.-T.YYq(Lian-Tuu) 1944- |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/04 |
| dewey-search | 621.381/04 |
| dewey-sort | 3621.381 14 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| discipline_str_mv | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| spelling | Yeh, L.-T.YYq(Lian-Tuu) 1944- Verfasser aut Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices L.T. Yeh, R.C. Chu New York, New York American Society Of Mechanical Engineers 2002 1 Online-Ressource (xxi, 414 Seiten) ill., digital file txt rdacontent c rdamedia cr rdacarrier ASME Press book series on electronic packaging Includes bibliographical references and index 1. Introduction -- 2. Conduction -- 3. Convection -- 4. Radiation -- 5. Pool boiling -- 6. Flow boiling -- 7. Condensation -- 8. Extended surfaces -- 9. Thermal interface resistance -- 10. Components and printed circuit boards -- 11. Direct air cooling and fans -- 12. Natural and mixed convection -- 13. Heat exchangers and cold plates -- 14. Advanced cooling technologies I: single-phase liquid cooling -- 15. Advanced cooling technologies II: two-phase flow cooling -- 16. Heat pipes -- 17. Thermoelectric coolers. - System requirements: Adobe Acrobat Reader. - Mode of access: World Wide Web With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies Electronic apparatus and appliances / Cooling Electronic apparatus and appliances / Thermal properties Heat / Transmission Kühlung (DE-588)4132435-3 gnd rswk-swf Wärmeabgabe (DE-588)4188840-6 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Electronic books Mikroelektronik (DE-588)4039207-7 s Kühlung (DE-588)4132435-3 s Elektronisches Bauelement (DE-588)4014360-0 s Wärmeabgabe (DE-588)4188840-6 s DE-604 Chu, R. C.YYq(Richard C.) 1933- Sonstige oth American Society of Mechanical Engineers Sonstige oth Erscheint auch als Druck-Ausgabe 0791801683 https://asmedigitalcollection.asme.org/ebooks/book/125/Thermal-Management-of-Microelectronic-Equipment Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Yeh, L.-T.YYq(Lian-Tuu) 1944- Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices Electronic apparatus and appliances / Cooling Electronic apparatus and appliances / Thermal properties Heat / Transmission Kühlung (DE-588)4132435-3 gnd Wärmeabgabe (DE-588)4188840-6 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4132435-3 (DE-588)4188840-6 (DE-588)4014360-0 (DE-588)4039207-7 |
| title | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices |
| title_auth | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices |
| title_exact_search | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices |
| title_exact_search_txtP | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices |
| title_full | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices L.T. Yeh, R.C. Chu |
| title_fullStr | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices L.T. Yeh, R.C. Chu |
| title_full_unstemmed | Thermal management of microelectronic equipment heat transfer theory, analysis methods and design practices L.T. Yeh, R.C. Chu |
| title_short | Thermal management of microelectronic equipment |
| title_sort | thermal management of microelectronic equipment heat transfer theory analysis methods and design practices |
| title_sub | heat transfer theory, analysis methods and design practices |
| topic | Electronic apparatus and appliances / Cooling Electronic apparatus and appliances / Thermal properties Heat / Transmission Kühlung (DE-588)4132435-3 gnd Wärmeabgabe (DE-588)4188840-6 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electronic apparatus and appliances / Cooling Electronic apparatus and appliances / Thermal properties Heat / Transmission Kühlung Wärmeabgabe Elektronisches Bauelement Mikroelektronik |
| url | https://asmedigitalcollection.asme.org/ebooks/book/125/Thermal-Management-of-Microelectronic-Equipment |
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