Holdings: Advances in embedded and fan-out wafer-level packaging technologies

Advances in embedded and fan-out wafer-level packaging technologies:

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Bibliographic Details
Other Authors:	Keser, Beth 1971- (Editor), Kroehnert, Steffen 1970- (Editor)
Format:	Electronic eBook
Language:	English
Published:	Hoboken, NJ Wiley 2019
Subjects:	Chip scale packaging Integrated circuits > Wafer-scale integration Wafer level packaging
Online Access:	FHI01 TUM01 Volltext Buchcover
Physical Description:	1 Online-Resource (576 Seiten)
ISBN:	9781119313977 9781119313984 9781119313991

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MARC


LEADER	00000nmm a2200000zc 4500
001	BV046418521
003	DE-604
005	20210709
007	cr\|uuu---uuuuu
008	200211s2019 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d
020			\|a 9781119313977 \|c PDF \|9 978-1-119-31397-7
020			\|a 9781119313984 \|c EPUB \|9 978-1-119-31398-4
020			\|a 9781119313991 \|9 978-1-119-31399-1
024	7		\|a 10.1002/9781119313991 \|2 doi
035			\|a (ZDB-35-WEL)8726249
035			\|a (ZDB-30-PQE)EBC5720829
035			\|a (ZDB-89-EBL)EBL5720829
035			\|a (OCoLC)1141157569
035			\|a (DE-599)BVBBV046418521
040			\|a DE-604 \|b ger \|e rda
041	0		\|a eng
049			\|a DE-573 \|a DE-91
082	0		\|a 621.39/5 \|2 23
084			\|a MAS 790 \|2 stub
245	1	0	\|a Advances in embedded and fan-out wafer-level packaging technologies \|c edited by Beth Keser and Steffen Kröhnert
264		1	\|a Hoboken, NJ \|b Wiley \|c 2019
300			\|a 1 Online-Resource (576 Seiten)
336			\|b txt \|2 rdacontent
337			\|b c \|2 rdamedia
338			\|b cr \|2 rdacarrier
650		4	\|a Chip scale packaging
650		4	\|a Integrated circuits \|x Wafer-scale integration
650	0	7	\|a Wafer level packaging \|0 (DE-588)1058582143 \|2 gnd \|9 rswk-swf
689	0	0	\|a Wafer level packaging \|0 (DE-588)1058582143 \|D s
689	0		\|8 1\p \|5 DE-604
700	1		\|a Keser, Beth \|d 1971- \|0 (DE-588)1188486934 \|4 edt
700	1		\|a Kroehnert, Steffen \|d 1970- \|0 (DE-588)1188487035 \|4 edt
776	0	8	\|i Erscheint auch als \|n Druck-Ausgabe \|z 978-1-119-31413-4 \|w (DE-604)BV045502893
856	4	0	\|u https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249 \|x Aggregator \|z URL des Erstveröffentlichers \|3 Volltext
856	4	2	\|m SWB Datenaustausch \|q application/pdf \|u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=031830992&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA \|3 Buchcover
912			\|a ZDB-35-WEL \|a ZDB-30-PQE
999			\|a oai:aleph.bib-bvb.de:BVB01-031830992
883	1		\|8 1\p \|a cgwrk \|d 20201028 \|q DE-101 \|u https://d-nb.info/provenance/plan#cgwrk
966	e		\|u https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249 \|l FHI01 \|p ZDB-35-WEL \|x Aggregator \|3 Volltext
966	e		\|u https://ebookcentral.proquest.com/lib/munchentech/detail.action?docID=5720829 \|l TUM01 \|p ZDB-30-PQE \|q TUM_PDA_PQE_Kauf \|x Aggregator \|3 Volltext

Record in the Search Index

_version_	1804180962016231424
any_adam_object	1
author2	Keser, Beth 1971- Kroehnert, Steffen 1970-
author2_role	edt edt
author2_variant	b k bk s k sk
author_GND	(DE-588)1188486934 (DE-588)1188487035
author_facet	Keser, Beth 1971- Kroehnert, Steffen 1970-
building	Verbundindex
bvnumber	BV046418521
classification_tum	MAS 790
collection	ZDB-35-WEL ZDB-30-PQE
ctrlnum	(ZDB-35-WEL)8726249 (ZDB-30-PQE)EBC5720829 (ZDB-89-EBL)EBL5720829 (OCoLC)1141157569 (DE-599)BVBBV046418521
dewey-full	621.39/5
dewey-hundreds	600 - Technology (Applied sciences)
dewey-ones	621 - Applied physics
dewey-raw	621.39/5
dewey-search	621.39/5
dewey-sort	3621.39 15
dewey-tens	620 - Engineering and allied operations
discipline	Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau
format	Electronic eBook
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02311nmm a2200505zc 4500</leader><controlfield tag="001">BV046418521</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20210709 </controlfield><controlfield tag="007">cr\|uuu---uuuuu</controlfield><controlfield tag="008">200211s2019 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119313977</subfield><subfield code="c">PDF</subfield><subfield code="9">978-1-119-31397-7</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119313984</subfield><subfield code="c">EPUB</subfield><subfield code="9">978-1-119-31398-4</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781119313991</subfield><subfield code="9">978-1-119-31399-1</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1002/9781119313991</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-35-WEL)8726249</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-30-PQE)EBC5720829</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-89-EBL)EBL5720829</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1141157569</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046418521</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-573</subfield><subfield code="a">DE-91</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.39/5</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 790</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advances in embedded and fan-out wafer-level packaging technologies</subfield><subfield code="c">edited by Beth Keser and Steffen Kröhnert</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, NJ</subfield><subfield code="b">Wiley</subfield><subfield code="c">2019</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Resource (576 Seiten)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chip scale packaging</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Wafer-scale integration</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wafer level packaging</subfield><subfield code="0">(DE-588)1058582143</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Wafer level packaging</subfield><subfield code="0">(DE-588)1058582143</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Keser, Beth</subfield><subfield code="d">1971-</subfield><subfield code="0">(DE-588)1188486934</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kroehnert, Steffen</subfield><subfield code="d">1970-</subfield><subfield code="0">(DE-588)1188487035</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-1-119-31413-4</subfield><subfield code="w">(DE-604)BV045502893</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249</subfield><subfield code="x">Aggregator</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">SWB Datenaustausch</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=031830992&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Buchcover</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-35-WEL</subfield><subfield code="a">ZDB-30-PQE</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-031830992</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-35-WEL</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://ebookcentral.proquest.com/lib/munchentech/detail.action?docID=5720829</subfield><subfield code="l">TUM01</subfield><subfield code="p">ZDB-30-PQE</subfield><subfield code="q">TUM_PDA_PQE_Kauf</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield></record></collection>
id	DE-604.BV046418521
illustrated	Not Illustrated
indexdate	2024-07-10T08:44:05Z
institution	BVB
isbn	9781119313977 9781119313984 9781119313991
language	English
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-031830992
oclc_num	1141157569
open_access_boolean
owner	DE-573 DE-91 DE-BY-TUM
owner_facet	DE-573 DE-91 DE-BY-TUM
physical	1 Online-Resource (576 Seiten)
psigel	ZDB-35-WEL ZDB-30-PQE ZDB-30-PQE TUM_PDA_PQE_Kauf
publishDate	2019
publishDateSearch	2019
publishDateSort	2019
publisher	Wiley
record_format	marc
spelling	Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser and Steffen Kröhnert Hoboken, NJ Wiley 2019 1 Online-Resource (576 Seiten) txt rdacontent c rdamedia cr rdacarrier Chip scale packaging Integrated circuits Wafer-scale integration Wafer level packaging (DE-588)1058582143 gnd rswk-swf Wafer level packaging (DE-588)1058582143 s 1\p DE-604 Keser, Beth 1971- (DE-588)1188486934 edt Kroehnert, Steffen 1970- (DE-588)1188487035 edt Erscheint auch als Druck-Ausgabe 978-1-119-31413-4 (DE-604)BV045502893 https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249 Aggregator URL des Erstveröffentlichers Volltext SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=031830992&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Buchcover 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk
spellingShingle	Advances in embedded and fan-out wafer-level packaging technologies Chip scale packaging Integrated circuits Wafer-scale integration Wafer level packaging (DE-588)1058582143 gnd
subject_GND	(DE-588)1058582143
title	Advances in embedded and fan-out wafer-level packaging technologies
title_auth	Advances in embedded and fan-out wafer-level packaging technologies
title_exact_search	Advances in embedded and fan-out wafer-level packaging technologies
title_full	Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser and Steffen Kröhnert
title_fullStr	Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser and Steffen Kröhnert
title_full_unstemmed	Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser and Steffen Kröhnert
title_short	Advances in embedded and fan-out wafer-level packaging technologies
title_sort	advances in embedded and fan out wafer level packaging technologies
topic	Chip scale packaging Integrated circuits Wafer-scale integration Wafer level packaging (DE-588)1058582143 gnd
topic_facet	Chip scale packaging Integrated circuits Wafer-scale integration Wafer level packaging
url	https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=031830992&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT keserbeth advancesinembeddedandfanoutwaferlevelpackagingtechnologies AT kroehnertsteffen advancesinembeddedandfanoutwaferlevelpackagingtechnologies

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