Verfügbarkeit: Advances in embedded and fan-out wafer-level packaging technologies

Advances in embedded and fan-out wafer-level packaging technologies:

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Bibliographische Detailangaben
Weitere Verfasser:	Keser, Beth 1971- (HerausgeberIn), Kroehnert, Steffen 1970- (HerausgeberIn)
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	Hoboken, NJ Wiley 2019
Schlagworte:	Chip scale packaging Integrated circuits > Wafer-scale integration Wafer level packaging
Online-Zugang:	FHI01 TUM01 URL des Erstveröffentlichers Buchcover
Beschreibung:	1 Online-Resource (576 Seiten)
ISBN:	9781119313977 9781119313984 9781119313991

Internformat

MARC


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Datensatz im Suchindex

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dewey-tens	620 - Engineering and allied operations
discipline	Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau
format	Electronic eBook
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isbn	9781119313977 9781119313984 9781119313991
language	English
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spelling	Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser and Steffen Kröhnert Hoboken, NJ Wiley 2019 1 Online-Resource (576 Seiten) txt rdacontent c rdamedia cr rdacarrier Chip scale packaging Integrated circuits Wafer-scale integration Wafer level packaging (DE-588)1058582143 gnd rswk-swf Wafer level packaging (DE-588)1058582143 s 1\p DE-604 Keser, Beth 1971- (DE-588)1188486934 edt Kroehnert, Steffen 1970- (DE-588)1188487035 edt Erscheint auch als Druck-Ausgabe 978-1-119-31413-4 (DE-604)BV045502893 https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249 Aggregator URL des Erstveröffentlichers Volltext SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=031830992&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Buchcover 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk
spellingShingle	Advances in embedded and fan-out wafer-level packaging technologies Chip scale packaging Integrated circuits Wafer-scale integration Wafer level packaging (DE-588)1058582143 gnd
subject_GND	(DE-588)1058582143
title	Advances in embedded and fan-out wafer-level packaging technologies
title_auth	Advances in embedded and fan-out wafer-level packaging technologies
title_exact_search	Advances in embedded and fan-out wafer-level packaging technologies
title_full	Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser and Steffen Kröhnert
title_fullStr	Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser and Steffen Kröhnert
title_full_unstemmed	Advances in embedded and fan-out wafer-level packaging technologies edited by Beth Keser and Steffen Kröhnert
title_short	Advances in embedded and fan-out wafer-level packaging technologies
title_sort	advances in embedded and fan out wafer level packaging technologies
topic	Chip scale packaging Integrated circuits Wafer-scale integration Wafer level packaging (DE-588)1058582143 gnd
topic_facet	Chip scale packaging Integrated circuits Wafer-scale integration Wafer level packaging
url	https://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=8726249 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=031830992&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT keserbeth advancesinembeddedandfanoutwaferlevelpackagingtechnologies AT kroehnertsteffen advancesinembeddedandfanoutwaferlevelpackagingtechnologies

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