APA (7th ed.) Citation

Keser, B., & Kroehnert, S. (2019). Advances in embedded and fan-out wafer-level packaging technologies. Wiley.

Chicago Style (17th ed.) Citation

Keser, Beth, and Steffen Kroehnert. Advances in Embedded and Fan-out Wafer-level Packaging Technologies. Hoboken, NJ: Wiley, 2019.

MLA (9th ed.) Citation

Keser, Beth, and Steffen Kroehnert. Advances in Embedded and Fan-out Wafer-level Packaging Technologies. Wiley, 2019.

Warning: These citations may not always be 100% accurate.