Plasma etching processes for interconnect realization in VLSI:
This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions
Gespeichert in:
Weitere Verfasser: | |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
London
ISTE Press
2015
|
Schlagworte: | |
Online-Zugang: | FLA01 Volltext |
Zusammenfassung: | This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions |
Beschreibung: | Includes bibliographical references and index |
Beschreibung: | 1 online resource |
ISBN: | 9780081005903 0081005903 |
Internformat
MARC
LEADER | 00000nmm a2200000zc 4500 | ||
---|---|---|---|
001 | BV046126812 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 190827s2015 |||| o||u| ||||||eng d | ||
020 | |a 9780081005903 |9 978-0-08-100590-3 | ||
020 | |a 0081005903 |9 0-08-100590-3 | ||
035 | |a (ZDB-33-ESD)ocn907467284 | ||
035 | |a (OCoLC)907467284 | ||
035 | |a (DE-599)BVBBV046126812 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
082 | 0 | |a 621.3815 |2 23 | |
245 | 1 | 0 | |a Plasma etching processes for interconnect realization in VLSI |c edited by Nicolas Posseme |
264 | 1 | |a London |b ISTE Press |c 2015 | |
300 | |a 1 online resource | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
500 | |a Includes bibliographical references and index | ||
520 | |a This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions | ||
650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
650 | 7 | |a Integrated circuits / Very large scale integration |2 fast | |
650 | 7 | |a Molded interconnect devices |2 fast | |
650 | 7 | |a Plasma etching |2 fast | |
650 | 4 | |a Integrated circuits |x Very large scale integration | |
650 | 4 | |a Plasma etching | |
650 | 4 | |a Molded interconnect devices | |
700 | 1 | |a Posseme, Nicolas |4 edt | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 1785480154 |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9781785480157 |
856 | 4 | 0 | |u http://www.sciencedirect.com/science/book/9781785480157 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
912 | |a ZDB-33-ESD | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-031507266 | ||
966 | e | |u http://www.sciencedirect.com/science/book/9781785480157 |l FLA01 |p ZDB-33-ESD |q FLA_PDA_ESD |x Verlag |3 Volltext |
Datensatz im Suchindex
_version_ | 1804180447295438848 |
---|---|
any_adam_object | |
author2 | Posseme, Nicolas |
author2_role | edt |
author2_variant | n p np |
author_facet | Posseme, Nicolas |
building | Verbundindex |
bvnumber | BV046126812 |
collection | ZDB-33-ESD |
ctrlnum | (ZDB-33-ESD)ocn907467284 (OCoLC)907467284 (DE-599)BVBBV046126812 |
dewey-full | 621.3815 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.3815 |
dewey-search | 621.3815 |
dewey-sort | 3621.3815 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01943nmm a2200445zc 4500</leader><controlfield tag="001">BV046126812</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">190827s2015 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780081005903</subfield><subfield code="9">978-0-08-100590-3</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0081005903</subfield><subfield code="9">0-08-100590-3</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-33-ESD)ocn907467284</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)907467284</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046126812</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Plasma etching processes for interconnect realization in VLSI</subfield><subfield code="c">edited by Nicolas Posseme</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">London</subfield><subfield code="b">ISTE Press</subfield><subfield code="c">2015</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Mechanical</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Integrated circuits / Very large scale integration</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Molded interconnect devices</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Plasma etching</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Very large scale integration</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Plasma etching</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Molded interconnect devices</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Posseme, Nicolas</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">1785480154</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9781785480157</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.sciencedirect.com/science/book/9781785480157</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-33-ESD</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-031507266</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://www.sciencedirect.com/science/book/9781785480157</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-33-ESD</subfield><subfield code="q">FLA_PDA_ESD</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
id | DE-604.BV046126812 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T08:35:54Z |
institution | BVB |
isbn | 9780081005903 0081005903 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-031507266 |
oclc_num | 907467284 |
open_access_boolean | |
physical | 1 online resource |
psigel | ZDB-33-ESD ZDB-33-ESD FLA_PDA_ESD |
publishDate | 2015 |
publishDateSearch | 2015 |
publishDateSort | 2015 |
publisher | ISTE Press |
record_format | marc |
spelling | Plasma etching processes for interconnect realization in VLSI edited by Nicolas Posseme London ISTE Press 2015 1 online resource txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions TECHNOLOGY & ENGINEERING / Mechanical bisacsh Integrated circuits / Very large scale integration fast Molded interconnect devices fast Plasma etching fast Integrated circuits Very large scale integration Plasma etching Molded interconnect devices Posseme, Nicolas edt Erscheint auch als Druck-Ausgabe 1785480154 Erscheint auch als Druck-Ausgabe 9781785480157 http://www.sciencedirect.com/science/book/9781785480157 Verlag URL des Erstveröffentlichers Volltext |
spellingShingle | Plasma etching processes for interconnect realization in VLSI TECHNOLOGY & ENGINEERING / Mechanical bisacsh Integrated circuits / Very large scale integration fast Molded interconnect devices fast Plasma etching fast Integrated circuits Very large scale integration Plasma etching Molded interconnect devices |
title | Plasma etching processes for interconnect realization in VLSI |
title_auth | Plasma etching processes for interconnect realization in VLSI |
title_exact_search | Plasma etching processes for interconnect realization in VLSI |
title_full | Plasma etching processes for interconnect realization in VLSI edited by Nicolas Posseme |
title_fullStr | Plasma etching processes for interconnect realization in VLSI edited by Nicolas Posseme |
title_full_unstemmed | Plasma etching processes for interconnect realization in VLSI edited by Nicolas Posseme |
title_short | Plasma etching processes for interconnect realization in VLSI |
title_sort | plasma etching processes for interconnect realization in vlsi |
topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Integrated circuits / Very large scale integration fast Molded interconnect devices fast Plasma etching fast Integrated circuits Very large scale integration Plasma etching Molded interconnect devices |
topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Integrated circuits / Very large scale integration Molded interconnect devices Plasma etching Integrated circuits Very large scale integration |
url | http://www.sciencedirect.com/science/book/9781785480157 |
work_keys_str_mv | AT possemenicolas plasmaetchingprocessesforinterconnectrealizationinvlsi |