Silicon-on-insulator (SOI) technology: manufacture and applications
Silicon-on-insulator (SOI) is a semiconductor wafer technology that produces higher performing, lower power devices than traditional bulk silicon techniques. SOI works by placing a thin, insulating layer, such as silicon oxide between a thin layer of silicon and the silicon substrate. This process h...
Gespeichert in:
Format: | Elektronisch E-Book |
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Sprache: | English |
Veröffentlicht: |
Cambridge, UK Waltham, MA
Woodhead Pub.
2014
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Schriftenreihe: | Woodhead Publishing series in electronic and optical materials
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Schlagworte: | |
Online-Zugang: | FLA01 URL des Erstveröffentlichers |
Zusammenfassung: | Silicon-on-insulator (SOI) is a semiconductor wafer technology that produces higher performing, lower power devices than traditional bulk silicon techniques. SOI works by placing a thin, insulating layer, such as silicon oxide between a thin layer of silicon and the silicon substrate. This process helps reduce junction capacitance, resulting in higher speed and lower power consumption. SOI chips can be as much as 15 percent faster and use 20 percent less power than today's silicon complementary metal-oxide semiconductor (CMOS)-based chips. Part one covers SOI transistors and circuits, manufact |
Beschreibung: | Includes bibliographical references and index |
Beschreibung: | 1 online resource illustrations |
ISBN: | 9780857099259 0857099256 1306949130 9781306949132 0857095269 9780857095268 |
Internformat
MARC
LEADER | 00000nmm a2200000zc 4500 | ||
---|---|---|---|
001 | BV046126603 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 190827s2014 |||| o||u| ||||||eng d | ||
020 | |a 9780857099259 |9 978-0-85709-925-9 | ||
020 | |a 0857099256 |9 0-85709-925-6 | ||
020 | |a 1306949130 |9 1-306-94913-0 | ||
020 | |a 9781306949132 |9 978-1-306-94913-2 | ||
020 | |a 0857095269 |9 0-85709-526-9 | ||
020 | |a 9780857095268 |9 978-0-85709-526-8 | ||
035 | |a (ZDB-33-ESD)ocn888415348 | ||
035 | |a (OCoLC)888415348 | ||
035 | |a (DE-599)BVBBV046126603 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
082 | 0 | |a 621.4 | |
084 | |a ZN 4152 |0 (DE-625)157361: |2 rvk | ||
245 | 1 | 0 | |a Silicon-on-insulator (SOI) technology |b manufacture and applications |c edited by Oleg Kononchuk, Bich-Yen Nguyen |
264 | 1 | |a Cambridge, UK |a Waltham, MA |b Woodhead Pub. |c 2014 | |
300 | |a 1 online resource |b illustrations | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Woodhead Publishing series in electronic and optical materials | |
500 | |a Includes bibliographical references and index | ||
520 | |a Silicon-on-insulator (SOI) is a semiconductor wafer technology that produces higher performing, lower power devices than traditional bulk silicon techniques. SOI works by placing a thin, insulating layer, such as silicon oxide between a thin layer of silicon and the silicon substrate. This process helps reduce junction capacitance, resulting in higher speed and lower power consumption. SOI chips can be as much as 15 percent faster and use 20 percent less power than today's silicon complementary metal-oxide semiconductor (CMOS)-based chips. Part one covers SOI transistors and circuits, manufact | ||
650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
650 | 7 | |a Silicon-on-insulator technology |2 fast | |
650 | 4 | |a Silicon-on-insulator technology | |
650 | 4 | |a Silicon-on-insulator technology | |
650 | 0 | 7 | |a CMOS |0 (DE-588)4010319-5 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Halbleitersubstrat |0 (DE-588)4158813-7 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a SOI-Technik |0 (DE-588)4128029-5 |2 gnd |9 rswk-swf |
655 | 7 | |8 1\p |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
689 | 0 | 0 | |a SOI-Technik |0 (DE-588)4128029-5 |D s |
689 | 0 | 1 | |a Halbleitersubstrat |0 (DE-588)4158813-7 |D s |
689 | 0 | 2 | |a CMOS |0 (DE-588)4010319-5 |D s |
689 | 0 | |8 2\p |5 DE-604 | |
700 | 1 | |a Kononchuk, Oleg |e Sonstige |4 oth | |
700 | 1 | |a Nguyen, Bich-Yen |e Sonstige |4 oth | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9780857095268 |
856 | 4 | 0 | |u http://www.sciencedirect.com/science/book/9780857095268 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
912 | |a ZDB-33-ESD | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-031507057 | ||
883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
883 | 1 | |8 2\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
966 | e | |u http://www.sciencedirect.com/science/book/9780857095268 |l FLA01 |p ZDB-33-ESD |q FLA_PDA_ESD |x Verlag |3 Volltext |
Datensatz im Suchindex
_version_ | 1804180446850842624 |
---|---|
any_adam_object | |
building | Verbundindex |
bvnumber | BV046126603 |
classification_rvk | ZN 4152 |
collection | ZDB-33-ESD |
ctrlnum | (ZDB-33-ESD)ocn888415348 (OCoLC)888415348 (DE-599)BVBBV046126603 |
dewey-full | 621.4 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.4 |
dewey-search | 621.4 |
dewey-sort | 3621.4 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03077nmm a2200601zc 4500</leader><controlfield tag="001">BV046126603</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">190827s2014 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780857099259</subfield><subfield code="9">978-0-85709-925-9</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0857099256</subfield><subfield code="9">0-85709-925-6</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1306949130</subfield><subfield code="9">1-306-94913-0</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781306949132</subfield><subfield code="9">978-1-306-94913-2</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0857095269</subfield><subfield code="9">0-85709-526-9</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780857095268</subfield><subfield code="9">978-0-85709-526-8</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-33-ESD)ocn888415348</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)888415348</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046126603</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.4</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4152</subfield><subfield code="0">(DE-625)157361:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Silicon-on-insulator (SOI) technology</subfield><subfield code="b">manufacture and applications</subfield><subfield code="c">edited by Oleg Kononchuk, Bich-Yen Nguyen</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cambridge, UK</subfield><subfield code="a">Waltham, MA</subfield><subfield code="b">Woodhead Pub.</subfield><subfield code="c">2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource</subfield><subfield code="b">illustrations</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Woodhead Publishing series in electronic and optical materials</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Silicon-on-insulator (SOI) is a semiconductor wafer technology that produces higher performing, lower power devices than traditional bulk silicon techniques. SOI works by placing a thin, insulating layer, such as silicon oxide between a thin layer of silicon and the silicon substrate. This process helps reduce junction capacitance, resulting in higher speed and lower power consumption. SOI chips can be as much as 15 percent faster and use 20 percent less power than today's silicon complementary metal-oxide semiconductor (CMOS)-based chips. Part one covers SOI transistors and circuits, manufact</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Mechanical</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Silicon-on-insulator technology</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Silicon-on-insulator technology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Silicon-on-insulator technology</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">CMOS</subfield><subfield code="0">(DE-588)4010319-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Halbleitersubstrat</subfield><subfield code="0">(DE-588)4158813-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">SOI-Technik</subfield><subfield code="0">(DE-588)4128029-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="8">1\p</subfield><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">SOI-Technik</subfield><subfield code="0">(DE-588)4128029-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Halbleitersubstrat</subfield><subfield code="0">(DE-588)4158813-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">CMOS</subfield><subfield code="0">(DE-588)4010319-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">2\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kononchuk, Oleg</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nguyen, Bich-Yen</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9780857095268</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.sciencedirect.com/science/book/9780857095268</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-33-ESD</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-031507057</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://www.sciencedirect.com/science/book/9780857095268</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-33-ESD</subfield><subfield code="q">FLA_PDA_ESD</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
genre | 1\p (DE-588)1071861417 Konferenzschrift gnd-content |
genre_facet | Konferenzschrift |
id | DE-604.BV046126603 |
illustrated | Illustrated |
indexdate | 2024-07-10T08:35:54Z |
institution | BVB |
isbn | 9780857099259 0857099256 1306949130 9781306949132 0857095269 9780857095268 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-031507057 |
oclc_num | 888415348 |
open_access_boolean | |
physical | 1 online resource illustrations |
psigel | ZDB-33-ESD ZDB-33-ESD FLA_PDA_ESD |
publishDate | 2014 |
publishDateSearch | 2014 |
publishDateSort | 2014 |
publisher | Woodhead Pub. |
record_format | marc |
series2 | Woodhead Publishing series in electronic and optical materials |
spelling | Silicon-on-insulator (SOI) technology manufacture and applications edited by Oleg Kononchuk, Bich-Yen Nguyen Cambridge, UK Waltham, MA Woodhead Pub. 2014 1 online resource illustrations txt rdacontent c rdamedia cr rdacarrier Woodhead Publishing series in electronic and optical materials Includes bibliographical references and index Silicon-on-insulator (SOI) is a semiconductor wafer technology that produces higher performing, lower power devices than traditional bulk silicon techniques. SOI works by placing a thin, insulating layer, such as silicon oxide between a thin layer of silicon and the silicon substrate. This process helps reduce junction capacitance, resulting in higher speed and lower power consumption. SOI chips can be as much as 15 percent faster and use 20 percent less power than today's silicon complementary metal-oxide semiconductor (CMOS)-based chips. Part one covers SOI transistors and circuits, manufact TECHNOLOGY & ENGINEERING / Mechanical bisacsh Silicon-on-insulator technology fast Silicon-on-insulator technology CMOS (DE-588)4010319-5 gnd rswk-swf Halbleitersubstrat (DE-588)4158813-7 gnd rswk-swf SOI-Technik (DE-588)4128029-5 gnd rswk-swf 1\p (DE-588)1071861417 Konferenzschrift gnd-content SOI-Technik (DE-588)4128029-5 s Halbleitersubstrat (DE-588)4158813-7 s CMOS (DE-588)4010319-5 s 2\p DE-604 Kononchuk, Oleg Sonstige oth Nguyen, Bich-Yen Sonstige oth Erscheint auch als Druck-Ausgabe 9780857095268 http://www.sciencedirect.com/science/book/9780857095268 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Silicon-on-insulator (SOI) technology manufacture and applications TECHNOLOGY & ENGINEERING / Mechanical bisacsh Silicon-on-insulator technology fast Silicon-on-insulator technology CMOS (DE-588)4010319-5 gnd Halbleitersubstrat (DE-588)4158813-7 gnd SOI-Technik (DE-588)4128029-5 gnd |
subject_GND | (DE-588)4010319-5 (DE-588)4158813-7 (DE-588)4128029-5 (DE-588)1071861417 |
title | Silicon-on-insulator (SOI) technology manufacture and applications |
title_auth | Silicon-on-insulator (SOI) technology manufacture and applications |
title_exact_search | Silicon-on-insulator (SOI) technology manufacture and applications |
title_full | Silicon-on-insulator (SOI) technology manufacture and applications edited by Oleg Kononchuk, Bich-Yen Nguyen |
title_fullStr | Silicon-on-insulator (SOI) technology manufacture and applications edited by Oleg Kononchuk, Bich-Yen Nguyen |
title_full_unstemmed | Silicon-on-insulator (SOI) technology manufacture and applications edited by Oleg Kononchuk, Bich-Yen Nguyen |
title_short | Silicon-on-insulator (SOI) technology |
title_sort | silicon on insulator soi technology manufacture and applications |
title_sub | manufacture and applications |
topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Silicon-on-insulator technology fast Silicon-on-insulator technology CMOS (DE-588)4010319-5 gnd Halbleitersubstrat (DE-588)4158813-7 gnd SOI-Technik (DE-588)4128029-5 gnd |
topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Silicon-on-insulator technology CMOS Halbleitersubstrat SOI-Technik Konferenzschrift |
url | http://www.sciencedirect.com/science/book/9780857095268 |
work_keys_str_mv | AT kononchukoleg silicononinsulatorsoitechnologymanufactureandapplications AT nguyenbichyen silicononinsulatorsoitechnologymanufactureandapplications |