Advanced adhesives in electronics: materials, properties and applications
Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and pr...
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Cambridge
Woodhead Pub.
2011
|
| Schriftenreihe: | Woodhead Publishing in materials
|
| Schlagworte: | |
| Online-Zugang: | FLA01 Volltext |
| Zusammenfassung: | Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applicationsProvides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systemsFocuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 online resource (x, 268 p. :) ill |
| ISBN: | 9780857092892 0857092898 |
Internformat
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV046125995 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:35:53Z |
| institution | BVB |
| isbn | 9780857092892 0857092898 |
| language | English |
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| series2 | Woodhead Publishing in materials |
| spelling | Advanced adhesives in electronics materials, properties and applications edited by M.O. Alam and C. Bailey Cambridge Woodhead Pub. 2011 1 online resource (x, 268 p. :) ill txt rdacontent c rdamedia cr rdacarrier Woodhead Publishing in materials Includes bibliographical references and index Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applicationsProvides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systemsFocuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques TECHNOLOGY & ENGINEERING / Mechanical bisacsh Adhesive joints fast Adhesives fast Electronic packaging / Materials fast Electronics / Materials fast Electronics Materials Coatings Sealing compounds Elektronik (DE-588)4014346-6 gnd rswk-swf Klebstoff (DE-588)4031003-6 gnd rswk-swf Elektronik (DE-588)4014346-6 s Klebstoff (DE-588)4031003-6 s 1\p DE-604 Alam, M. O. Sonstige oth Bailey, C. Sonstige oth Erscheint auch als Druck-Ausgabe 1845695763 Erscheint auch als Druck-Ausgabe 9781845695767 http://www.sciencedirect.com/science/book/9781845695767 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Advanced adhesives in electronics materials, properties and applications TECHNOLOGY & ENGINEERING / Mechanical bisacsh Adhesive joints fast Adhesives fast Electronic packaging / Materials fast Electronics / Materials fast Electronics Materials Coatings Sealing compounds Elektronik (DE-588)4014346-6 gnd Klebstoff (DE-588)4031003-6 gnd |
| subject_GND | (DE-588)4014346-6 (DE-588)4031003-6 |
| title | Advanced adhesives in electronics materials, properties and applications |
| title_auth | Advanced adhesives in electronics materials, properties and applications |
| title_exact_search | Advanced adhesives in electronics materials, properties and applications |
| title_full | Advanced adhesives in electronics materials, properties and applications edited by M.O. Alam and C. Bailey |
| title_fullStr | Advanced adhesives in electronics materials, properties and applications edited by M.O. Alam and C. Bailey |
| title_full_unstemmed | Advanced adhesives in electronics materials, properties and applications edited by M.O. Alam and C. Bailey |
| title_short | Advanced adhesives in electronics |
| title_sort | advanced adhesives in electronics materials properties and applications |
| title_sub | materials, properties and applications |
| topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Adhesive joints fast Adhesives fast Electronic packaging / Materials fast Electronics / Materials fast Electronics Materials Coatings Sealing compounds Elektronik (DE-588)4014346-6 gnd Klebstoff (DE-588)4031003-6 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Adhesive joints Adhesives Electronic packaging / Materials Electronics / Materials Electronics Materials Coatings Sealing compounds Elektronik Klebstoff |
| url | http://www.sciencedirect.com/science/book/9781845695767 |
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