Advances in CMP/polishing technologies for the manufacture of electronic devices:
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community
Saved in:
| Other Authors: | , , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Oxford
William Andrew
2012
|
| Edition: | 1st ed |
| Subjects: | |
| Online Access: | FLA01 Volltext |
| Summary: | CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community |
| Item Description: | Includes index |
| Physical Description: | 1 online resource (xii, 317 pages) |
| ISBN: | 9781437778595 1437778593 |
Staff View
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV046125718 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 190827s2012 |||| o||u| ||||||eng d | ||
| 020 | |a 9781437778595 |9 978-1-4377-7859-5 | ||
| 020 | |a 1437778593 |9 1-4377-7859-3 | ||
| 035 | |a (ZDB-33-ESD)ocn769153733 | ||
| 035 | |a (OCoLC)769153733 | ||
| 035 | |a (DE-599)BVBBV046125718 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 082 | 0 | |a 671.7/2 |2 23 | |
| 245 | 1 | 0 | |a Advances in CMP/polishing technologies for the manufacture of electronic devices |c edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| 250 | |a 1st ed | ||
| 264 | 1 | |a Oxford |b William Andrew |c 2012 | |
| 300 | |a 1 online resource (xii, 317 pages) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes index | ||
| 520 | |a CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community | ||
| 650 | 7 | |a Electrolytic polishing |2 fast | |
| 650 | 7 | |a Grinding and polishing |2 fast | |
| 650 | 4 | |a Electrolytic polishing | |
| 650 | 4 | |a Grinding and polishing | |
| 700 | 1 | |a Doi, Toshiro |4 edt | |
| 700 | 1 | |a Marinescu, Ioan D. |4 edt | |
| 700 | 1 | |a Kurokawa, Syuhei |4 edt | |
| 856 | 4 | 0 | |u http://www.sciencedirect.com/science/book/9781437778595 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-33-ESD | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-031506171 | ||
| 966 | e | |u http://www.sciencedirect.com/science/book/9781437778595 |l FLA01 |p ZDB-33-ESD |q FLA_PDA_ESD |x Verlag |3 Volltext | |
Record in the Search Index
| _version_ | 1804180445101817856 |
|---|---|
| any_adam_object | |
| author2 | Doi, Toshiro Marinescu, Ioan D. Kurokawa, Syuhei |
| author2_role | edt edt edt |
| author2_variant | t d td i d m id idm s k sk |
| author_facet | Doi, Toshiro Marinescu, Ioan D. Kurokawa, Syuhei |
| building | Verbundindex |
| bvnumber | BV046125718 |
| collection | ZDB-33-ESD |
| ctrlnum | (ZDB-33-ESD)ocn769153733 (OCoLC)769153733 (DE-599)BVBBV046125718 |
| dewey-full | 671.7/2 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 671 - Metalworking & primary metal products |
| dewey-raw | 671.7/2 |
| dewey-search | 671.7/2 |
| dewey-sort | 3671.7 12 |
| dewey-tens | 670 - Manufacturing |
| discipline | Werkstoffwissenschaften / Fertigungstechnik |
| edition | 1st ed |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01755nmm a2200421zc 4500</leader><controlfield tag="001">BV046125718</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">190827s2012 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781437778595</subfield><subfield code="9">978-1-4377-7859-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1437778593</subfield><subfield code="9">1-4377-7859-3</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-33-ESD)ocn769153733</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)769153733</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV046125718</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">671.7/2</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advances in CMP/polishing technologies for the manufacture of electronic devices</subfield><subfield code="c">edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">1st ed</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Oxford</subfield><subfield code="b">William Andrew</subfield><subfield code="c">2012</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (xii, 317 pages)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes index</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electrolytic polishing</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Grinding and polishing</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrolytic polishing</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Grinding and polishing</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Doi, Toshiro</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Marinescu, Ioan D.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kurokawa, Syuhei</subfield><subfield code="4">edt</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.sciencedirect.com/science/book/9781437778595</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-33-ESD</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-031506171</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://www.sciencedirect.com/science/book/9781437778595</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-33-ESD</subfield><subfield code="q">FLA_PDA_ESD</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV046125718 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:35:52Z |
| institution | BVB |
| isbn | 9781437778595 1437778593 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-031506171 |
| oclc_num | 769153733 |
| open_access_boolean | |
| physical | 1 online resource (xii, 317 pages) |
| psigel | ZDB-33-ESD ZDB-33-ESD FLA_PDA_ESD |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | William Andrew |
| record_format | marc |
| spelling | Advances in CMP/polishing technologies for the manufacture of electronic devices edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa 1st ed Oxford William Andrew 2012 1 online resource (xii, 317 pages) txt rdacontent c rdamedia cr rdacarrier Includes index CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community Electrolytic polishing fast Grinding and polishing fast Electrolytic polishing Grinding and polishing Doi, Toshiro edt Marinescu, Ioan D. edt Kurokawa, Syuhei edt http://www.sciencedirect.com/science/book/9781437778595 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Advances in CMP/polishing technologies for the manufacture of electronic devices Electrolytic polishing fast Grinding and polishing fast Electrolytic polishing Grinding and polishing |
| title | Advances in CMP/polishing technologies for the manufacture of electronic devices |
| title_auth | Advances in CMP/polishing technologies for the manufacture of electronic devices |
| title_exact_search | Advances in CMP/polishing technologies for the manufacture of electronic devices |
| title_full | Advances in CMP/polishing technologies for the manufacture of electronic devices edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| title_fullStr | Advances in CMP/polishing technologies for the manufacture of electronic devices edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| title_full_unstemmed | Advances in CMP/polishing technologies for the manufacture of electronic devices edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| title_short | Advances in CMP/polishing technologies for the manufacture of electronic devices |
| title_sort | advances in cmp polishing technologies for the manufacture of electronic devices |
| topic | Electrolytic polishing fast Grinding and polishing fast Electrolytic polishing Grinding and polishing |
| topic_facet | Electrolytic polishing Grinding and polishing |
| url | http://www.sciencedirect.com/science/book/9781437778595 |
| work_keys_str_mv | AT doitoshiro advancesincmppolishingtechnologiesforthemanufactureofelectronicdevices AT marinescuioand advancesincmppolishingtechnologiesforthemanufactureofelectronicdevices AT kurokawasyuhei advancesincmppolishingtechnologiesforthemanufactureofelectronicdevices |