Advances in CMP/polishing technologies for the manufacture of electronic devices:
CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community
Gespeichert in:
| Weitere Verfasser: | , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Oxford
William Andrew
2012
|
| Ausgabe: | 1st ed |
| Schlagworte: | |
| Online-Zugang: | FLA01 Volltext |
| Zusammenfassung: | CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community |
| Beschreibung: | Includes index |
| Beschreibung: | 1 online resource (xii, 317 pages) |
| ISBN: | 9781437778595 1437778593 |
Internformat
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| 245 | 1 | 0 | |a Advances in CMP/polishing technologies for the manufacture of electronic devices |c edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| 250 | |a 1st ed | ||
| 264 | 1 | |a Oxford |b William Andrew |c 2012 | |
| 300 | |a 1 online resource (xii, 317 pages) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes index | ||
| 520 | |a CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community | ||
| 650 | 7 | |a Electrolytic polishing |2 fast | |
| 650 | 7 | |a Grinding and polishing |2 fast | |
| 650 | 4 | |a Electrolytic polishing | |
| 650 | 4 | |a Grinding and polishing | |
| 700 | 1 | |a Doi, Toshiro |4 edt | |
| 700 | 1 | |a Marinescu, Ioan D. |4 edt | |
| 700 | 1 | |a Kurokawa, Syuhei |4 edt | |
| 856 | 4 | 0 | |u http://www.sciencedirect.com/science/book/9781437778595 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-33-ESD | ||
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Datensatz im Suchindex
| _version_ | 1804180445101817856 |
|---|---|
| any_adam_object | |
| author2 | Doi, Toshiro Marinescu, Ioan D. Kurokawa, Syuhei |
| author2_role | edt edt edt |
| author2_variant | t d td i d m id idm s k sk |
| author_facet | Doi, Toshiro Marinescu, Ioan D. Kurokawa, Syuhei |
| building | Verbundindex |
| bvnumber | BV046125718 |
| collection | ZDB-33-ESD |
| ctrlnum | (ZDB-33-ESD)ocn769153733 (OCoLC)769153733 (DE-599)BVBBV046125718 |
| dewey-full | 671.7/2 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 671 - Metalworking & primary metal products |
| dewey-raw | 671.7/2 |
| dewey-search | 671.7/2 |
| dewey-sort | 3671.7 12 |
| dewey-tens | 670 - Manufacturing |
| discipline | Werkstoffwissenschaften / Fertigungstechnik |
| edition | 1st ed |
| format | Electronic eBook |
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| id | DE-604.BV046125718 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:35:52Z |
| institution | BVB |
| isbn | 9781437778595 1437778593 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-031506171 |
| oclc_num | 769153733 |
| open_access_boolean | |
| physical | 1 online resource (xii, 317 pages) |
| psigel | ZDB-33-ESD ZDB-33-ESD FLA_PDA_ESD |
| publishDate | 2012 |
| publishDateSearch | 2012 |
| publishDateSort | 2012 |
| publisher | William Andrew |
| record_format | marc |
| spelling | Advances in CMP/polishing technologies for the manufacture of electronic devices edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa 1st ed Oxford William Andrew 2012 1 online resource (xii, 317 pages) txt rdacontent c rdamedia cr rdacarrier Includes index CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. This title presents the developments and technological innovations in the field - making R & D accessible to the wider engineering community Electrolytic polishing fast Grinding and polishing fast Electrolytic polishing Grinding and polishing Doi, Toshiro edt Marinescu, Ioan D. edt Kurokawa, Syuhei edt http://www.sciencedirect.com/science/book/9781437778595 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Advances in CMP/polishing technologies for the manufacture of electronic devices Electrolytic polishing fast Grinding and polishing fast Electrolytic polishing Grinding and polishing |
| title | Advances in CMP/polishing technologies for the manufacture of electronic devices |
| title_auth | Advances in CMP/polishing technologies for the manufacture of electronic devices |
| title_exact_search | Advances in CMP/polishing technologies for the manufacture of electronic devices |
| title_full | Advances in CMP/polishing technologies for the manufacture of electronic devices edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| title_fullStr | Advances in CMP/polishing technologies for the manufacture of electronic devices edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| title_full_unstemmed | Advances in CMP/polishing technologies for the manufacture of electronic devices edited by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa |
| title_short | Advances in CMP/polishing technologies for the manufacture of electronic devices |
| title_sort | advances in cmp polishing technologies for the manufacture of electronic devices |
| topic | Electrolytic polishing fast Grinding and polishing fast Electrolytic polishing Grinding and polishing |
| topic_facet | Electrolytic polishing Grinding and polishing |
| url | http://www.sciencedirect.com/science/book/9781437778595 |
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