Tribology of abrasive machining processes:

Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundame...

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Bibliographische Detailangaben
Format: Elektronisch E-Book
Sprache:English
Veröffentlicht: Norwich, NY William Andrew Pub. © 2004
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Online-Zugang:FLA01
URL des Erstveröffentlichers
Zusammenfassung:Recent and radically improved machining processes, from high wheel speeds to nanotechnology, have turned a spotlight on abrasive machining processes as a fertile area for further advancements. Written for researchers, students, engineers and technicians in manufacturing, this book presents a fundamental rethinking of important tribological elements of abrasive machining processes and their effects on process efficiency and product quality. Newer processes such as chemical mechanical polishing (CMP) and silicon wafer dicing can be better understood as tribological processes. Understanding the tribological principles of abrasive processes is crucial to discovering improvements in accuracy, production rate, and surface quality of products spanning all industries, from machine parts to ball bearings to contact lens to semiconductors
Beschreibung:Includes bibliographical references and index
Beschreibung:1 online resource (xxvii, 724 pages) illustrations
ISBN:0815514905
9780815514909
9780815519386
0815519389

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