APA (7th ed.) Citation

Siow, K. S. (2019). Die-attach materials for high temperature applications in microelectronics packaging: Materials, processes, equipment, and reliability. Springer. https://doi.org/10.1007/978-3-319-99256-3

Chicago Style (17th ed.) Citation

Siow, Kim S. Die-attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability. Cham: Springer, 2019. https://doi.org/10.1007/978-3-319-99256-3.

MLA (9th ed.) Citation

Siow, Kim S. Die-attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability. Springer, 2019. https://doi.org/10.1007/978-3-319-99256-3.