Die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment, and reliability
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cham
Springer
[2019]
|
| Schlagworte: | |
| Online-Zugang: | BTU01 FHN01 TUM01 Volltext |
| Beschreibung: | 1 Online-Ressource (xx, 279 Seiten) Illustrationen, Diagramme |
| ISBN: | 9783319992563 |
| DOI: | 10.1007/978-3-319-99256-3 |
Internformat
MARC
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| 245 | 1 | 0 | |a Die-attach materials for high temperature applications in microelectronics packaging |b materials, processes, equipment, and reliability |c Kim S. Siow, editor |
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| 650 | 4 | |a Materials Engineering | |
| 650 | 4 | |a Quality Control, Reliability, Safety and Risk | |
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Datensatz im Suchindex
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|---|---|
| any_adam_object | |
| author2 | Siow, Kim S. |
| author2_role | edt |
| author2_variant | k s s ks kss |
| author_facet | Siow, Kim S. |
| building | Verbundindex |
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| ctrlnum | (ZDB-2-CMS)9783319992563 (OCoLC)1189289090 (DE-599)BVBBV045948400 |
| dewey-full | 620.11295 620.11297 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 620 - Engineering and allied operations |
| dewey-raw | 620.11295 620.11297 |
| dewey-search | 620.11295 620.11297 |
| dewey-sort | 3620.11295 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Chemie |
| doi_str_mv | 10.1007/978-3-319-99256-3 |
| format | Electronic eBook |
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| id | DE-604.BV045948400 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:31:16Z |
| institution | BVB |
| isbn | 9783319992563 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-031330531 |
| oclc_num | 1189289090 |
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| physical | 1 Online-Ressource (xx, 279 Seiten) Illustrationen, Diagramme |
| psigel | ZDB-2-CMS ZDB-2-CMS_2019 |
| publishDate | 2019 |
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| publisher | Springer |
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| spelling | Die-attach materials for high temperature applications in microelectronics packaging materials, processes, equipment, and reliability Kim S. Siow, editor Cham Springer [2019] 1 Online-Ressource (xx, 279 Seiten) Illustrationen, Diagramme txt rdacontent c rdamedia cr rdacarrier Optical and Electronic Materials Electronics and Microelectronics, Instrumentation Metallic Materials Characterization and Evaluation of Materials Materials Engineering Quality Control, Reliability, Safety and Risk Optical materials Electronics Materials Surfaces (Physics) System safety Siow, Kim S. edt Erscheint auch als Druck-Ausgabe 978-3-319-99255-6 Erscheint auch als Druck-Ausgabe 978-3-319-99257-0 https://doi.org/10.1007/978-3-319-99256-3 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Die-attach materials for high temperature applications in microelectronics packaging materials, processes, equipment, and reliability Optical and Electronic Materials Electronics and Microelectronics, Instrumentation Metallic Materials Characterization and Evaluation of Materials Materials Engineering Quality Control, Reliability, Safety and Risk Optical materials Electronics Materials Surfaces (Physics) System safety |
| title | Die-attach materials for high temperature applications in microelectronics packaging materials, processes, equipment, and reliability |
| title_auth | Die-attach materials for high temperature applications in microelectronics packaging materials, processes, equipment, and reliability |
| title_exact_search | Die-attach materials for high temperature applications in microelectronics packaging materials, processes, equipment, and reliability |
| title_full | Die-attach materials for high temperature applications in microelectronics packaging materials, processes, equipment, and reliability Kim S. Siow, editor |
| title_fullStr | Die-attach materials for high temperature applications in microelectronics packaging materials, processes, equipment, and reliability Kim S. Siow, editor |
| title_full_unstemmed | Die-attach materials for high temperature applications in microelectronics packaging materials, processes, equipment, and reliability Kim S. Siow, editor |
| title_short | Die-attach materials for high temperature applications in microelectronics packaging |
| title_sort | die attach materials for high temperature applications in microelectronics packaging materials processes equipment and reliability |
| title_sub | materials, processes, equipment, and reliability |
| topic | Optical and Electronic Materials Electronics and Microelectronics, Instrumentation Metallic Materials Characterization and Evaluation of Materials Materials Engineering Quality Control, Reliability, Safety and Risk Optical materials Electronics Materials Surfaces (Physics) System safety |
| topic_facet | Optical and Electronic Materials Electronics and Microelectronics, Instrumentation Metallic Materials Characterization and Evaluation of Materials Materials Engineering Quality Control, Reliability, Safety and Risk Optical materials Electronics Materials Surfaces (Physics) System safety |
| url | https://doi.org/10.1007/978-3-319-99256-3 |
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