APA-Zitierstil (7. Ausg.)

Huang, Y., Yin, Z., & Wan, X. (2019). Modeling and Application of Flexible Electronics Packaging. Springer. https://doi.org/10.1007/978-981-13-3627-0

Chicago-Zitierstil (17. Ausg.)

Huang, YongAn, Zhouping Yin, und Xiaodong Wan. Modeling and Application of Flexible Electronics Packaging. Singapore: Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.

MLA-Zitierstil (9. Ausg.)

Huang, YongAn, et al. Modeling and Application of Flexible Electronics Packaging. Springer, 2019. https://doi.org/10.1007/978-981-13-3627-0.