Modeling and Application of Flexible Electronics Packaging:
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Singapore
Springer
2019
Singapore |
| Schlagworte: | |
| Online-Zugang: | DE-634 DE-1046 DE-Aug4 DE-573 DE-M347 DE-92 DE-898 DE-859 DE-860 DE-861 DE-863 DE-862 DE-523 DE-91 DE-384 DE-706 Volltext |
| Beschreibung: | 1 Online-Ressource (XVII, 287 Seiten) |
| ISBN: | 9789811336270 |
| DOI: | 10.1007/978-981-13-3627-0 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV045860223 | ||
| 003 | DE-604 | ||
| 005 | 20240822 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 190506s2019 |||| o||u| ||||||eng d | ||
| 020 | |a 9789811336270 |c Online |9 978-981-133-627-0 | ||
| 024 | 7 | |a 10.1007/978-981-13-3627-0 |2 doi | |
| 035 | |a (ZDB-2-ENG)9789811336270 | ||
| 035 | |a (OCoLC)1190357288 | ||
| 035 | |a (DE-599)BVBBV045860223 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-860 |a DE-91 |a DE-1046 |a DE-Aug4 |a DE-898 |a DE-861 |a DE-523 |a DE-859 |a DE-863 |a DE-862 |a DE-92 |a DE-384 |a DE-573 |a DE-M347 |a DE-706 |a DE-634 | ||
| 082 | 0 | |a 621.381 |2 23 | |
| 084 | |a ZN 4120 |0 (DE-625)157353: |2 rvk | ||
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 084 | |a ELT 000 |2 stub | ||
| 084 | |a MAS 000 |2 stub | ||
| 100 | 1 | |a Huang, YongAn |e Verfasser |0 (DE-588)1013088808 |4 aut | |
| 245 | 1 | 0 | |a Modeling and Application of Flexible Electronics Packaging |c by YongAn Huang, Zhouping Yin, Xiaodong Wan |
| 264 | 1 | |a Singapore |b Springer |c 2019 | |
| 264 | 1 | |a Singapore |b Springer | |
| 300 | |a 1 Online-Ressource (XVII, 287 Seiten) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Manufacturing, Machines, Tools, Processes | |
| 650 | 4 | |a Theoretical and Applied Mechanics | |
| 650 | 4 | |a Simulation and Modeling | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Manufactures | |
| 650 | 4 | |a Mechanics, applied | |
| 650 | 4 | |a Computer simulation | |
| 650 | 0 | 7 | |a Flexible Leiterplatte |0 (DE-588)4317748-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verbindungstechnik |0 (DE-588)4129183-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Dünne Schicht |0 (DE-588)4136925-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Chip |0 (DE-588)4197163-2 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Polymerelektronik |0 (DE-588)7735306-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Polymerelektronik |0 (DE-588)7735306-7 |D s |
| 689 | 0 | 1 | |a Verbindungstechnik |0 (DE-588)4129183-9 |D s |
| 689 | 0 | 2 | |a Flexible Leiterplatte |0 (DE-588)4317748-7 |D s |
| 689 | 0 | 3 | |a Chip |0 (DE-588)4197163-2 |D s |
| 689 | 0 | 4 | |a Dünne Schicht |0 (DE-588)4136925-7 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Yin, Zhouping |d 1972- |e Verfasser |0 (DE-588)1013088700 |4 aut | |
| 700 | 1 | |a Wan, Xiaodong |e Verfasser |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-981-133-626-3 |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-981-133-628-7 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-981-13-3627-0 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_2019_Fremddaten | |
| 943 | 1 | |a oai:aleph.bib-bvb.de:BVB01-031243713 | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-634 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-1046 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-Aug4 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-573 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-M347 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-92 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-898 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-859 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-860 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-861 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-863 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-862 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-523 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-91 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-384 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-981-13-3627-0 |l DE-706 |p ZDB-2-ENG |x Verlag |3 Volltext | |
Datensatz im Suchindex
| DE-BY-FWS_katkey | 722681 |
|---|---|
| _version_ | 1808141823245287424 |
| adam_text | |
| any_adam_object | |
| author | Huang, YongAn Yin, Zhouping 1972- Wan, Xiaodong |
| author_GND | (DE-588)1013088808 (DE-588)1013088700 |
| author_facet | Huang, YongAn Yin, Zhouping 1972- Wan, Xiaodong |
| author_role | aut aut aut |
| author_sort | Huang, YongAn |
| author_variant | y h yh z y zy x w xw |
| building | Verbundindex |
| bvnumber | BV045860223 |
| classification_rvk | ZN 4120 ZN 4192 |
| classification_tum | ELT 000 MAS 000 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)9789811336270 (OCoLC)1190357288 (DE-599)BVBBV045860223 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-981-13-3627-0 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>00000nmm a2200000zc 4500</leader><controlfield tag="001">BV045860223</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20240822</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">190506s2019 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789811336270</subfield><subfield code="c">Online</subfield><subfield code="9">978-981-133-627-0</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-981-13-3627-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)9789811336270</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1190357288</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045860223</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-860</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-523</subfield><subfield code="a">DE-859</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-384</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-M347</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-634</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4120</subfield><subfield code="0">(DE-625)157353:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Huang, YongAn</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)1013088808</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Modeling and Application of Flexible Electronics Packaging</subfield><subfield code="c">by YongAn Huang, Zhouping Yin, Xiaodong Wan</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">Springer</subfield><subfield code="c">2019</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">Springer</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (XVII, 287 Seiten)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing, Machines, Tools, Processes</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Theoretical and Applied Mechanics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Simulation and Modeling</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufactures</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanics, applied</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Computer simulation</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Flexible Leiterplatte</subfield><subfield code="0">(DE-588)4317748-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Dünne Schicht</subfield><subfield code="0">(DE-588)4136925-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Chip</subfield><subfield code="0">(DE-588)4197163-2</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Polymerelektronik</subfield><subfield code="0">(DE-588)7735306-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Polymerelektronik</subfield><subfield code="0">(DE-588)7735306-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Flexible Leiterplatte</subfield><subfield code="0">(DE-588)4317748-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Chip</subfield><subfield code="0">(DE-588)4197163-2</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="4"><subfield code="a">Dünne Schicht</subfield><subfield code="0">(DE-588)4136925-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Yin, Zhouping</subfield><subfield code="d">1972-</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)1013088700</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wan, Xiaodong</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-981-133-626-3</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-981-133-628-7</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2019_Fremddaten</subfield></datafield><datafield tag="943" ind1="1" ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-031243713</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-634</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-1046</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-Aug4</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-573</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-M347</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-92</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-898</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-859</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-860</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-861</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-863</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-862</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-523</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-91</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-384</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-981-13-3627-0</subfield><subfield code="l">DE-706</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV045860223 |
| illustrated | Not Illustrated |
| indexdate | 2024-08-23T04:00:17Z |
| institution | BVB |
| isbn | 9789811336270 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-031243713 |
| oclc_num | 1190357288 |
| open_access_boolean | |
| owner | DE-860 DE-91 DE-BY-TUM DE-1046 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-523 DE-859 DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-92 DE-384 DE-573 DE-M347 DE-706 DE-634 |
| owner_facet | DE-860 DE-91 DE-BY-TUM DE-1046 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-523 DE-859 DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-92 DE-384 DE-573 DE-M347 DE-706 DE-634 |
| physical | 1 Online-Ressource (XVII, 287 Seiten) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2019_Fremddaten |
| publishDate | 2019 |
| publishDateSearch | 2019 |
| publishDateSort | 2019 |
| publisher | Springer |
| record_format | marc |
| spellingShingle | Huang, YongAn Yin, Zhouping 1972- Wan, Xiaodong Modeling and Application of Flexible Electronics Packaging Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Manufacturing, Machines, Tools, Processes Theoretical and Applied Mechanics Simulation and Modeling Electronics Optical materials Manufactures Mechanics, applied Computer simulation Flexible Leiterplatte (DE-588)4317748-7 gnd Verbindungstechnik (DE-588)4129183-9 gnd Dünne Schicht (DE-588)4136925-7 gnd Chip (DE-588)4197163-2 gnd Polymerelektronik (DE-588)7735306-7 gnd |
| subject_GND | (DE-588)4317748-7 (DE-588)4129183-9 (DE-588)4136925-7 (DE-588)4197163-2 (DE-588)7735306-7 |
| title | Modeling and Application of Flexible Electronics Packaging |
| title_auth | Modeling and Application of Flexible Electronics Packaging |
| title_exact_search | Modeling and Application of Flexible Electronics Packaging |
| title_full | Modeling and Application of Flexible Electronics Packaging by YongAn Huang, Zhouping Yin, Xiaodong Wan |
| title_fullStr | Modeling and Application of Flexible Electronics Packaging by YongAn Huang, Zhouping Yin, Xiaodong Wan |
| title_full_unstemmed | Modeling and Application of Flexible Electronics Packaging by YongAn Huang, Zhouping Yin, Xiaodong Wan |
| title_short | Modeling and Application of Flexible Electronics Packaging |
| title_sort | modeling and application of flexible electronics packaging |
| topic | Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Manufacturing, Machines, Tools, Processes Theoretical and Applied Mechanics Simulation and Modeling Electronics Optical materials Manufactures Mechanics, applied Computer simulation Flexible Leiterplatte (DE-588)4317748-7 gnd Verbindungstechnik (DE-588)4129183-9 gnd Dünne Schicht (DE-588)4136925-7 gnd Chip (DE-588)4197163-2 gnd Polymerelektronik (DE-588)7735306-7 gnd |
| topic_facet | Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Manufacturing, Machines, Tools, Processes Theoretical and Applied Mechanics Simulation and Modeling Electronics Optical materials Manufactures Mechanics, applied Computer simulation Flexible Leiterplatte Verbindungstechnik Dünne Schicht Chip Polymerelektronik |
| url | https://doi.org/10.1007/978-981-13-3627-0 |
| work_keys_str_mv | AT huangyongan modelingandapplicationofflexibleelectronicspackaging AT yinzhouping modelingandapplicationofflexibleelectronicspackaging AT wanxiaodong modelingandapplicationofflexibleelectronicspackaging |