Encapsulation technologies for electronic applications:
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Oxford
Elsevier, William Andrew, Applied Science Publishers
[2019]
|
| Ausgabe: | Second edition |
| Schlagworte: | |
| Online-Zugang: | DE-860 Volltext |
| Zusammenfassung: | Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic |
| Beschreibung: | 1 Online-Ressource |
| ISBN: | 9780128119792 0128119799 |
Internformat
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Datensatz im Suchindex
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| author | Ardebili, Haleh Zhang, Jiawei Pecht, Michael |
| author_GND | (DE-588)1180624246 (DE-588)171714903 |
| author_facet | Ardebili, Haleh Zhang, Jiawei Pecht, Michael |
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| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | Second edition |
| format | Electronic eBook |
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| id | DE-604.BV045383574 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-31T01:10:31Z |
| institution | BVB |
| isbn | 9780128119792 0128119799 |
| language | English |
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| publishDate | 2019 |
| publishDateSearch | 2019 |
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| publisher | Elsevier, William Andrew, Applied Science Publishers |
| record_format | marc |
| spelling | Ardebili, Haleh (DE-588)1180624246 aut Encapsulation technologies for electronic applications Haleh Ardebili, Jiawei Zhang, Michael G. Pecht Second edition Oxford Elsevier, William Andrew, Applied Science Publishers [2019] 1 Online-Ressource txt rdacontent c rdamedia cr rdacarrier Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic apparatus and appliances / Plastic embedment fast Electronic apparatus and appliances Plastic embedment Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Verkapseln (DE-588)4139497-5 gnd rswk-swf Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Verkapseln (DE-588)4139497-5 s Mikroelektronik (DE-588)4039207-7 s Elektronisches Bauelement (DE-588)4014360-0 s Gehäuse (DE-588)4156307-4 s 1\p DE-604 Zhang, Jiawei aut Pecht, Michael (DE-588)171714903 aut Erscheint auch als Druck-Ausgabe, pbk 978-0-12-811978-5 https://www.sciencedirect.com/science/book/9780128119785 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Ardebili, Haleh Zhang, Jiawei Pecht, Michael Encapsulation technologies for electronic applications TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic apparatus and appliances / Plastic embedment fast Electronic apparatus and appliances Plastic embedment Mikroelektronik (DE-588)4039207-7 gnd Verkapseln (DE-588)4139497-5 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd |
| subject_GND | (DE-588)4039207-7 (DE-588)4139497-5 (DE-588)4014360-0 (DE-588)4156307-4 |
| title | Encapsulation technologies for electronic applications |
| title_auth | Encapsulation technologies for electronic applications |
| title_exact_search | Encapsulation technologies for electronic applications |
| title_full | Encapsulation technologies for electronic applications Haleh Ardebili, Jiawei Zhang, Michael G. Pecht |
| title_fullStr | Encapsulation technologies for electronic applications Haleh Ardebili, Jiawei Zhang, Michael G. Pecht |
| title_full_unstemmed | Encapsulation technologies for electronic applications Haleh Ardebili, Jiawei Zhang, Michael G. Pecht |
| title_short | Encapsulation technologies for electronic applications |
| title_sort | encapsulation technologies for electronic applications |
| topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic apparatus and appliances / Plastic embedment fast Electronic apparatus and appliances Plastic embedment Mikroelektronik (DE-588)4039207-7 gnd Verkapseln (DE-588)4139497-5 gnd Elektronisches Bauelement (DE-588)4014360-0 gnd Gehäuse (DE-588)4156307-4 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Electronic apparatus and appliances / Plastic embedment Electronic apparatus and appliances Plastic embedment Mikroelektronik Verkapseln Elektronisches Bauelement Gehäuse |
| url | https://www.sciencedirect.com/science/book/9780128119785 |
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