APA (7th ed.) Citation

(2018). Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. Woodhead Publishing is an imprint of Elsevier.

Chicago Style (17th ed.) Citation

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. Duxford, United Kingdom: Woodhead Publishing is an imprint of Elsevier, 2018.

MLA (9th ed.) Citation

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability. Woodhead Publishing is an imprint of Elsevier, 2018.