Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability
"Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and...
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Duxford, United Kingdom
Woodhead Publishing is an imprint of Elsevier
[2018]
|
| Schriftenreihe: | Woodhead Publishing series in electronic and optical materials
|
| Schlagworte: | |
| Online-Zugang: | FAW01 FLA01 Volltext |
| Zusammenfassung: | "Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates"-- |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | 1 online resource |
| ISBN: | 9780081020951 0081020953 |
Internformat
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Datensatz im Suchindex
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| dewey-full | 621.3815/2 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
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| dewey-search | 621.3815/2 |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV045383143 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:16:39Z |
| institution | BVB |
| isbn | 9780081020951 0081020953 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030769476 |
| oclc_num | 1038016106 |
| open_access_boolean | |
| owner | DE-1046 |
| owner_facet | DE-1046 |
| physical | 1 online resource |
| psigel | ZDB-33-ESD ZDB-33-EBS ZDB-33-ESD FAW_PDA_ESD ZDB-33-ESD FLA_PDA_ESD |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | Woodhead Publishing is an imprint of Elsevier |
| record_format | marc |
| series2 | Woodhead Publishing series in electronic and optical materials |
| spelling | Wide Bandgap Power Semiconductor Packaging Materials, Components, and Reliability edited by Katsuaki Suganuma Duxford, United Kingdom Woodhead Publishing is an imprint of Elsevier [2018] © 2018 1 online resource txt rdacontent c rdamedia cr rdacarrier Woodhead Publishing series in electronic and optical materials Includes bibliographical references and index "Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability addresses the key challenges that WBG power semiconductors face during integration, including heat resistance, heat dissipation and thermal stress, noise reduction at high frequency and discrete components, and challenges in interfacing, metallization, plating, bonding and wiring. Experts on the topic present the latest research on materials, components and methods of reliability and evaluation for WBG power semiconductors and suggest solutions to pave the way for integration. As wide bandgap (WBG) power semiconductors, SiC and GaN, are the latest promising electric conversion devices because of their excellent features, such as high breakdown voltage, high frequency capability, and high heat-resistance beyond 200 C, this book is a timely resource on the topic. Examines the key challenges of wide bandgap power semiconductor packaging at various levels, including materials, components and device performance Provides the latest research on potential solutions, with an eye towards the end goal of system integration Discusses key problems, such as thermal management, noise reduction, challenges in interconnects and substrates"-- TECHNOLOGY & ENGINEERING / Mechanical bisacsh Microelectronic packaging fast Wide gap semiconductors fast Wide gap semiconductors Microelectronic packaging Wide-bandgap Halbleiter (DE-588)4273153-7 gnd rswk-swf Halbleitergehäuse (DE-588)4143472-9 gnd rswk-swf Leistungselektronik (DE-588)4035235-3 gnd rswk-swf Wide-bandgap Halbleiter (DE-588)4273153-7 s Leistungselektronik (DE-588)4035235-3 s Halbleitergehäuse (DE-588)4143472-9 s 1\p DE-604 Erscheint auch als Druck-Ausgabe 9780081020944 Erscheint auch als Druck-Ausgabe 0081020945 https://www.sciencedirect.com/science/book/9780081020944 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Wide Bandgap Power Semiconductor Packaging Materials, Components, and Reliability TECHNOLOGY & ENGINEERING / Mechanical bisacsh Microelectronic packaging fast Wide gap semiconductors fast Wide gap semiconductors Microelectronic packaging Wide-bandgap Halbleiter (DE-588)4273153-7 gnd Halbleitergehäuse (DE-588)4143472-9 gnd Leistungselektronik (DE-588)4035235-3 gnd |
| subject_GND | (DE-588)4273153-7 (DE-588)4143472-9 (DE-588)4035235-3 |
| title | Wide Bandgap Power Semiconductor Packaging Materials, Components, and Reliability |
| title_auth | Wide Bandgap Power Semiconductor Packaging Materials, Components, and Reliability |
| title_exact_search | Wide Bandgap Power Semiconductor Packaging Materials, Components, and Reliability |
| title_full | Wide Bandgap Power Semiconductor Packaging Materials, Components, and Reliability edited by Katsuaki Suganuma |
| title_fullStr | Wide Bandgap Power Semiconductor Packaging Materials, Components, and Reliability edited by Katsuaki Suganuma |
| title_full_unstemmed | Wide Bandgap Power Semiconductor Packaging Materials, Components, and Reliability edited by Katsuaki Suganuma |
| title_short | Wide Bandgap Power Semiconductor Packaging |
| title_sort | wide bandgap power semiconductor packaging materials components and reliability |
| title_sub | Materials, Components, and Reliability |
| topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Microelectronic packaging fast Wide gap semiconductors fast Wide gap semiconductors Microelectronic packaging Wide-bandgap Halbleiter (DE-588)4273153-7 gnd Halbleitergehäuse (DE-588)4143472-9 gnd Leistungselektronik (DE-588)4035235-3 gnd |
| topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Microelectronic packaging Wide gap semiconductors Wide-bandgap Halbleiter Halbleitergehäuse Leistungselektronik |
| url | https://www.sciencedirect.com/science/book/9780081020944 |