Encyclopedia of thermal packaging, Set 2, Thermal packaging tools:
Gespeichert in:
Weitere Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
New Jersey
World Scientific
2014
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Schlagworte: | |
Beschreibung: | Print version record |
Beschreibung: | 1 online resource |
ISBN: | 9789814327664 9814327662 |
Internformat
MARC
LEADER | 00000nmm a2200000zc 4500 | ||
---|---|---|---|
001 | BV045345661 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 181206s2014 |||| o||u| ||||||eng d | ||
020 | |a 9789814327664 |9 978-981-4327-66-4 | ||
020 | |a 9814327662 |9 981-4327-66-2 | ||
035 | |a (ZDB-4-ENC)ocn908447640 | ||
035 | |a (OCoLC)908447640 | ||
035 | |a (DE-599)BVBBV045345661 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
082 | 0 | |a 621.381046 |2 23 | |
245 | 1 | 0 | |a Encyclopedia of thermal packaging, Set 2, Thermal packaging tools |c edited by Avram Bar-Cohen |
264 | 1 | |a New Jersey |b World Scientific |c 2014 | |
300 | |a 1 online resource | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
500 | |a Print version record | ||
505 | 8 | |a The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order (3z (Bcompact (3y (Bthermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve (3z (Bcorrect by design (3y (Bthermal packaging solutions | |
650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
650 | 7 | |a Electronic packaging |2 fast | |
650 | 7 | |a Insulation (Heat) |2 fast | |
650 | 4 | |a Electronic packaging |a Insulation (Heat) | |
700 | 1 | |a Bar-Cohen, Avram |d 1946- |4 edt | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |t Encyclopedia of thermal packaging. Set 2, Thermal packaging tools |z 9789814327602 |
912 | |a ZDB-4-ENC | ||
999 | |a oai:aleph.bib-bvb.de:BVB01-030732364 |
Datensatz im Suchindex
_version_ | 1804179166737727488 |
---|---|
any_adam_object | |
author2 | Bar-Cohen, Avram 1946- |
author2_role | edt |
author2_variant | a b c abc |
author_facet | Bar-Cohen, Avram 1946- |
building | Verbundindex |
bvnumber | BV045345661 |
collection | ZDB-4-ENC |
contents | The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order (3z (Bcompact (3y (Bthermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve (3z (Bcorrect by design (3y (Bthermal packaging solutions |
ctrlnum | (ZDB-4-ENC)ocn908447640 (OCoLC)908447640 (DE-599)BVBBV045345661 |
dewey-full | 621.381046 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381046 |
dewey-search | 621.381046 |
dewey-sort | 3621.381046 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01950nmm a2200373zc 4500</leader><controlfield tag="001">BV045345661</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">181206s2014 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789814327664</subfield><subfield code="9">978-981-4327-66-4</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9814327662</subfield><subfield code="9">981-4327-66-2</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-4-ENC)ocn908447640</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)908447640</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045345661</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381046</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Encyclopedia of thermal packaging, Set 2, Thermal packaging tools</subfield><subfield code="c">edited by Avram Bar-Cohen</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">New Jersey</subfield><subfield code="b">World Scientific</subfield><subfield code="c">2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Print version record</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order (3z (Bcompact (3y (Bthermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve (3z (Bcorrect by design (3y (Bthermal packaging solutions</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Mechanical</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Electronic packaging</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Insulation (Heat)</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield><subfield code="a">Insulation (Heat)</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Bar-Cohen, Avram</subfield><subfield code="d">1946-</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="t">Encyclopedia of thermal packaging. Set 2, Thermal packaging tools</subfield><subfield code="z">9789814327602</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-ENC</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030732364</subfield></datafield></record></collection> |
id | DE-604.BV045345661 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T08:15:33Z |
institution | BVB |
isbn | 9789814327664 9814327662 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030732364 |
oclc_num | 908447640 |
open_access_boolean | |
physical | 1 online resource |
psigel | ZDB-4-ENC |
publishDate | 2014 |
publishDateSearch | 2014 |
publishDateSort | 2014 |
publisher | World Scientific |
record_format | marc |
spelling | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools edited by Avram Bar-Cohen New Jersey World Scientific 2014 1 online resource txt rdacontent c rdamedia cr rdacarrier Print version record The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order (3z (Bcompact (3y (Bthermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve (3z (Bcorrect by design (3y (Bthermal packaging solutions TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic packaging fast Insulation (Heat) fast Electronic packaging Insulation (Heat) Bar-Cohen, Avram 1946- edt Erscheint auch als Druck-Ausgabe Encyclopedia of thermal packaging. Set 2, Thermal packaging tools 9789814327602 |
spellingShingle | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order (3z (Bcompact (3y (Bthermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve (3z (Bcorrect by design (3y (Bthermal packaging solutions TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic packaging fast Insulation (Heat) fast Electronic packaging Insulation (Heat) |
title | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools |
title_auth | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools |
title_exact_search | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools |
title_full | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools edited by Avram Bar-Cohen |
title_fullStr | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools edited by Avram Bar-Cohen |
title_full_unstemmed | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools edited by Avram Bar-Cohen |
title_short | Encyclopedia of thermal packaging, Set 2, Thermal packaging tools |
title_sort | encyclopedia of thermal packaging set 2 thermal packaging tools |
topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic packaging fast Insulation (Heat) fast Electronic packaging Insulation (Heat) |
topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Electronic packaging Insulation (Heat) Electronic packaging Insulation (Heat) |
work_keys_str_mv | AT barcohenavram encyclopediaofthermalpackagingset2thermalpackagingtools |