Lead-free solder interconnect reliability:
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Bibliographic Details
Format: Electronic eBook
Language:English
Published: Materials Park, OH ASM International 2005
Subjects:
Item Description:Print version record
Physical Description:1 online resource (x, 292 pages) illustrations
ISBN:9781615030934
161503093X

There is no print copy available.

Interlibrary loan Place Request Caution: Not in THWS collection!