Integrated interconnect technologies for 3D nanoelectronic systems:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Boston, Mass. ; London
Artech House
2009
|
| Schriftenreihe: | Artech House integrated microsystems series
|
| Schlagworte: | |
| Beschreibung: | Print version record |
| Beschreibung: | 1 online resource (xx, 528 pages) illustrations |
| ISBN: | 9781596932470 1596932473 |
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| 245 | 1 | 0 | |a Integrated interconnect technologies for 3D nanoelectronic systems |c Muhannad S. Bakir, James D. Meindl, editors |
| 264 | 1 | |a Boston, Mass. ; London |b Artech House |c 2009 | |
| 300 | |a 1 online resource (xx, 528 pages) |b illustrations | ||
| 336 | |b txt |2 rdacontent | ||
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| 490 | 0 | |a Artech House integrated microsystems series | |
| 500 | |a Print version record | ||
| 505 | 8 | |a This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Microelectronics |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Digital |2 bisacsh | |
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| contents | This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source |
| ctrlnum | (ZDB-4-ENC)ocn434509565 (OCoLC)434509565 (DE-599)BVBBV045343219 |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV045343219 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:15:28Z |
| institution | BVB |
| isbn | 9781596932470 1596932473 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030729923 |
| oclc_num | 434509565 |
| open_access_boolean | |
| physical | 1 online resource (xx, 528 pages) illustrations |
| psigel | ZDB-4-ENC |
| publishDate | 2009 |
| publishDateSearch | 2009 |
| publishDateSort | 2009 |
| publisher | Artech House |
| record_format | marc |
| series2 | Artech House integrated microsystems series |
| spelling | Integrated interconnect technologies for 3D nanoelectronic systems Muhannad S. Bakir, James D. Meindl, editors Boston, Mass. ; London Artech House 2009 1 online resource (xx, 528 pages) illustrations txt rdacontent c rdamedia cr rdacarrier Artech House integrated microsystems series Print version record This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast Interconnects (Integrated circuit technology) Telecommunication systems Nanoelectronics Bakir, Muhannad S. Sonstige oth Meindl, James D. 1933- Sonstige oth Erscheint auch als Druck-Ausgabe Integrated interconnect technologies for 3D nanoelectronic systems Boston, Mass. ; London : Artech House, 2009 9781596932463 1596932465 |
| spellingShingle | Integrated interconnect technologies for 3D nanoelectronic systems This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast Interconnects (Integrated circuit technology) Telecommunication systems Nanoelectronics |
| title | Integrated interconnect technologies for 3D nanoelectronic systems |
| title_auth | Integrated interconnect technologies for 3D nanoelectronic systems |
| title_exact_search | Integrated interconnect technologies for 3D nanoelectronic systems |
| title_full | Integrated interconnect technologies for 3D nanoelectronic systems Muhannad S. Bakir, James D. Meindl, editors |
| title_fullStr | Integrated interconnect technologies for 3D nanoelectronic systems Muhannad S. Bakir, James D. Meindl, editors |
| title_full_unstemmed | Integrated interconnect technologies for 3D nanoelectronic systems Muhannad S. Bakir, James D. Meindl, editors |
| title_short | Integrated interconnect technologies for 3D nanoelectronic systems |
| title_sort | integrated interconnect technologies for 3d nanoelectronic systems |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast Interconnects (Integrated circuit technology) Telecommunication systems Nanoelectronics |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics TECHNOLOGY & ENGINEERING / Electronics / Digital Interconnects (Integrated circuit technology) Nanoelectronics Telecommunication systems Interconnects (Integrated circuit technology) Telecommunication systems Nanoelectronics |
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