Adaptive cooling of integrated circuits using digital microfluidics:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Norwood, Mass.
Artech House
2007
|
| Schriftenreihe: | Artech House integrated microsystems series
|
| Schlagworte: | |
| Beschreibung: | Print version record. - Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 |
| Beschreibung: | 1 online resource (203 pages) illustrations |
| ISBN: | 9781596931398 1596931396 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV045342794 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 181206s2007 |||| o||u| ||||||eng d | ||
| 015 | |a GBA748294 |2 dnb | ||
| 020 | |a 9781596931398 |9 978-1-59693-139-8 | ||
| 020 | |a 1596931396 |9 1-59693-139-6 | ||
| 035 | |a (ZDB-4-ENC)ocn250588022 | ||
| 035 | |a (OCoLC)250588022 | ||
| 035 | |a (DE-599)BVBBV045342794 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 082 | 0 | |a 620.106 |2 22 | |
| 100 | 1 | |a Paik, Philip Y. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Adaptive cooling of integrated circuits using digital microfluidics |c Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
| 264 | 1 | |a Norwood, Mass. |b Artech House |c 2007 | |
| 300 | |a 1 online resource (203 pages) |b illustrations | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Artech House integrated microsystems series | |
| 500 | |a Print version record. - Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 | ||
| 505 | 8 | |a Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Material Science |2 bisacsh | |
| 650 | 7 | |a Integrated circuits / Cooling |2 fast | |
| 650 | 7 | |a Integrated circuits / Design and construction |2 fast | |
| 650 | 7 | |a Microfluidics |2 fast | |
| 650 | 7 | |a Circuits integres / Refroidissement |2 ram | |
| 650 | 7 | |a Microfluidique / Applications industrielles |2 ram | |
| 650 | 4 | |a Integrated circuits |x Cooling |a Microfluidics |a Integrated circuits |x Design and construction | |
| 700 | 1 | |a Chakrabarty, Krishnendu |e Sonstige |4 oth | |
| 700 | 1 | |a Pamula, Vamsee K. |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |a Paik, Philip Y. |t Adaptive cooling of integrated circuits using digital microfluidics |d Norwood, Mass. : Artech House, 2007 |z 9781596931381 |z 1596931388 |
| 912 | |a ZDB-4-ENC | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030729497 | ||
Datensatz im Suchindex
| _version_ | 1804179160922324992 |
|---|---|
| any_adam_object | |
| author | Paik, Philip Y. |
| author_facet | Paik, Philip Y. |
| author_role | aut |
| author_sort | Paik, Philip Y. |
| author_variant | p y p py pyp |
| building | Verbundindex |
| bvnumber | BV045342794 |
| collection | ZDB-4-ENC |
| contents | Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling |
| ctrlnum | (ZDB-4-ENC)ocn250588022 (OCoLC)250588022 (DE-599)BVBBV045342794 |
| dewey-full | 620.106 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 620 - Engineering and allied operations |
| dewey-raw | 620.106 |
| dewey-search | 620.106 |
| dewey-sort | 3620.106 |
| dewey-tens | 620 - Engineering and allied operations |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02619nmm a2200457zc 4500</leader><controlfield tag="001">BV045342794</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">181206s2007 |||| o||u| ||||||eng d</controlfield><datafield tag="015" ind1=" " ind2=" "><subfield code="a">GBA748294</subfield><subfield code="2">dnb</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781596931398</subfield><subfield code="9">978-1-59693-139-8</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1596931396</subfield><subfield code="9">1-59693-139-6</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-4-ENC)ocn250588022</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)250588022</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045342794</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">620.106</subfield><subfield code="2">22</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Paik, Philip Y.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Adaptive cooling of integrated circuits using digital microfluidics</subfield><subfield code="c">Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Norwood, Mass.</subfield><subfield code="b">Artech House</subfield><subfield code="c">2007</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (203 pages)</subfield><subfield code="b">illustrations</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Artech House integrated microsystems series</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Print version record. - Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Material Science</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Integrated circuits / Cooling</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Integrated circuits / Design and construction</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microfluidics</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Circuits integres / Refroidissement</subfield><subfield code="2">ram</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microfluidique / Applications industrielles</subfield><subfield code="2">ram</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Cooling</subfield><subfield code="a">Microfluidics</subfield><subfield code="a">Integrated circuits</subfield><subfield code="x">Design and construction</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Chakrabarty, Krishnendu</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Pamula, Vamsee K.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="a">Paik, Philip Y.</subfield><subfield code="t">Adaptive cooling of integrated circuits using digital microfluidics</subfield><subfield code="d">Norwood, Mass. : Artech House, 2007</subfield><subfield code="z">9781596931381</subfield><subfield code="z">1596931388</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-ENC</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030729497</subfield></datafield></record></collection> |
| id | DE-604.BV045342794 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:15:27Z |
| institution | BVB |
| isbn | 9781596931398 1596931396 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030729497 |
| oclc_num | 250588022 |
| open_access_boolean | |
| physical | 1 online resource (203 pages) illustrations |
| psigel | ZDB-4-ENC |
| publishDate | 2007 |
| publishDateSearch | 2007 |
| publishDateSort | 2007 |
| publisher | Artech House |
| record_format | marc |
| series2 | Artech House integrated microsystems series |
| spelling | Paik, Philip Y. Verfasser aut Adaptive cooling of integrated circuits using digital microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula Norwood, Mass. Artech House 2007 1 online resource (203 pages) illustrations txt rdacontent c rdamedia cr rdacarrier Artech House integrated microsystems series Print version record. - Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling TECHNOLOGY & ENGINEERING / Material Science bisacsh Integrated circuits / Cooling fast Integrated circuits / Design and construction fast Microfluidics fast Circuits integres / Refroidissement ram Microfluidique / Applications industrielles ram Integrated circuits Cooling Microfluidics Integrated circuits Design and construction Chakrabarty, Krishnendu Sonstige oth Pamula, Vamsee K. Sonstige oth Erscheint auch als Druck-Ausgabe Paik, Philip Y. Adaptive cooling of integrated circuits using digital microfluidics Norwood, Mass. : Artech House, 2007 9781596931381 1596931388 |
| spellingShingle | Paik, Philip Y. Adaptive cooling of integrated circuits using digital microfluidics Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling TECHNOLOGY & ENGINEERING / Material Science bisacsh Integrated circuits / Cooling fast Integrated circuits / Design and construction fast Microfluidics fast Circuits integres / Refroidissement ram Microfluidique / Applications industrielles ram Integrated circuits Cooling Microfluidics Integrated circuits Design and construction |
| title | Adaptive cooling of integrated circuits using digital microfluidics |
| title_auth | Adaptive cooling of integrated circuits using digital microfluidics |
| title_exact_search | Adaptive cooling of integrated circuits using digital microfluidics |
| title_full | Adaptive cooling of integrated circuits using digital microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
| title_fullStr | Adaptive cooling of integrated circuits using digital microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
| title_full_unstemmed | Adaptive cooling of integrated circuits using digital microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
| title_short | Adaptive cooling of integrated circuits using digital microfluidics |
| title_sort | adaptive cooling of integrated circuits using digital microfluidics |
| topic | TECHNOLOGY & ENGINEERING / Material Science bisacsh Integrated circuits / Cooling fast Integrated circuits / Design and construction fast Microfluidics fast Circuits integres / Refroidissement ram Microfluidique / Applications industrielles ram Integrated circuits Cooling Microfluidics Integrated circuits Design and construction |
| topic_facet | TECHNOLOGY & ENGINEERING / Material Science Integrated circuits / Cooling Integrated circuits / Design and construction Microfluidics Circuits integres / Refroidissement Microfluidique / Applications industrielles Integrated circuits Cooling Microfluidics Integrated circuits Design and construction |
| work_keys_str_mv | AT paikphilipy adaptivecoolingofintegratedcircuitsusingdigitalmicrofluidics AT chakrabartykrishnendu adaptivecoolingofintegratedcircuitsusingdigitalmicrofluidics AT pamulavamseek adaptivecoolingofintegratedcircuitsusingdigitalmicrofluidics |