Encapsulation technologies for electronic applications:
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Oxford ; Cambridge
William Andrew, Elsevier
[2019]
|
| Ausgabe: | Second edition |
| Schriftenreihe: | Materials and processes for electronic applications
|
| Schlagworte: | |
| Beschreibung: | x, 498 Seiten Illustrationen, Diagramme |
| ISBN: | 9780128119785 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV045326083 | ||
| 003 | DE-604 | ||
| 005 | 20190515 | ||
| 007 | t | ||
| 008 | 181128s2019 a||| |||| 00||| eng d | ||
| 020 | |a 9780128119785 |9 978-0-12-811978-5 | ||
| 035 | |a (OCoLC)1083884575 | ||
| 035 | |a (DE-599)BVBBV045326083 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-91G |a DE-83 | ||
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 084 | |a ELT 296f |2 stub | ||
| 100 | 1 | |a Ardebili, Haleh |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Encapsulation technologies for electronic applications |c Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) |
| 250 | |a Second edition | ||
| 264 | 1 | |a Oxford ; Cambridge |b William Andrew, Elsevier |c [2019] | |
| 264 | 4 | |c © 2019 | |
| 300 | |a x, 498 Seiten |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Materials and processes for electronic applications | |
| 650 | 4 | |a Electronic apparatus and appliances / Plastic embedment | |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Verkapseln |0 (DE-588)4139497-5 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Verkapseln |0 (DE-588)4139497-5 |D s |
| 689 | 0 | 1 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | 2 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 3 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Zhang, Jiawei |e Verfasser |4 aut | |
| 700 | 1 | |a Pecht, Michael |e Verfasser |0 (DE-588)171714903 |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe |z 978-0-12-811979-2 |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030713001 | ||
Datensatz im Suchindex
| _version_ | 1804179129971507200 |
|---|---|
| any_adam_object | |
| author | Ardebili, Haleh Zhang, Jiawei Pecht, Michael |
| author_GND | (DE-588)171714903 |
| author_facet | Ardebili, Haleh Zhang, Jiawei Pecht, Michael |
| author_role | aut aut aut |
| author_sort | Ardebili, Haleh |
| author_variant | h a ha j z jz m p mp |
| building | Verbundindex |
| bvnumber | BV045326083 |
| classification_rvk | ZN 4192 |
| classification_tum | ELT 296f |
| ctrlnum | (OCoLC)1083884575 (DE-599)BVBBV045326083 |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik |
| edition | Second edition |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01919nam a2200469 c 4500</leader><controlfield tag="001">BV045326083</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20190515 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">181128s2019 a||| |||| 00||| eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780128119785</subfield><subfield code="9">978-0-12-811978-5</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1083884575</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045326083</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91G</subfield><subfield code="a">DE-83</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 296f</subfield><subfield code="2">stub</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Ardebili, Haleh</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Encapsulation technologies for electronic applications</subfield><subfield code="c">Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States)</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">Second edition</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Oxford ; Cambridge</subfield><subfield code="b">William Andrew, Elsevier</subfield><subfield code="c">[2019]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2019</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">x, 498 Seiten</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Materials and processes for electronic applications</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic apparatus and appliances / Plastic embedment</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verkapseln</subfield><subfield code="0">(DE-588)4139497-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Verkapseln</subfield><subfield code="0">(DE-588)4139497-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zhang, Jiawei</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Pecht, Michael</subfield><subfield code="e">Verfasser</subfield><subfield code="0">(DE-588)171714903</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Online-Ausgabe</subfield><subfield code="z">978-0-12-811979-2</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030713001</subfield></datafield></record></collection> |
| id | DE-604.BV045326083 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:14:58Z |
| institution | BVB |
| isbn | 9780128119785 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030713001 |
| oclc_num | 1083884575 |
| open_access_boolean | |
| owner | DE-91G DE-BY-TUM DE-83 |
| owner_facet | DE-91G DE-BY-TUM DE-83 |
| physical | x, 498 Seiten Illustrationen, Diagramme |
| publishDate | 2019 |
| publishDateSearch | 2019 |
| publishDateSort | 2019 |
| publisher | William Andrew, Elsevier |
| record_format | marc |
| series2 | Materials and processes for electronic applications |
| spelling | Ardebili, Haleh Verfasser aut Encapsulation technologies for electronic applications Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) Second edition Oxford ; Cambridge William Andrew, Elsevier [2019] © 2019 x, 498 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Materials and processes for electronic applications Electronic apparatus and appliances / Plastic embedment Elektronisches Bauelement (DE-588)4014360-0 gnd rswk-swf Verkapseln (DE-588)4139497-5 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Verkapseln (DE-588)4139497-5 s Mikroelektronik (DE-588)4039207-7 s Elektronisches Bauelement (DE-588)4014360-0 s Gehäuse (DE-588)4156307-4 s DE-604 Zhang, Jiawei Verfasser aut Pecht, Michael Verfasser (DE-588)171714903 aut Erscheint auch als Online-Ausgabe 978-0-12-811979-2 |
| spellingShingle | Ardebili, Haleh Zhang, Jiawei Pecht, Michael Encapsulation technologies for electronic applications Electronic apparatus and appliances / Plastic embedment Elektronisches Bauelement (DE-588)4014360-0 gnd Verkapseln (DE-588)4139497-5 gnd Gehäuse (DE-588)4156307-4 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4139497-5 (DE-588)4156307-4 (DE-588)4039207-7 |
| title | Encapsulation technologies for electronic applications |
| title_auth | Encapsulation technologies for electronic applications |
| title_exact_search | Encapsulation technologies for electronic applications |
| title_full | Encapsulation technologies for electronic applications Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) |
| title_fullStr | Encapsulation technologies for electronic applications Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) |
| title_full_unstemmed | Encapsulation technologies for electronic applications Haleh Ardebili (University of Houston, Houston, TX, United States), Jiawei Zhang (Qualcomm, San Diego, CA, United States), Michael G. Pecht (CALCE, University of Maryland, College Park, MD, United States) |
| title_short | Encapsulation technologies for electronic applications |
| title_sort | encapsulation technologies for electronic applications |
| topic | Electronic apparatus and appliances / Plastic embedment Elektronisches Bauelement (DE-588)4014360-0 gnd Verkapseln (DE-588)4139497-5 gnd Gehäuse (DE-588)4156307-4 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electronic apparatus and appliances / Plastic embedment Elektronisches Bauelement Verkapseln Gehäuse Mikroelektronik |
| work_keys_str_mv | AT ardebilihaleh encapsulationtechnologiesforelectronicapplications AT zhangjiawei encapsulationtechnologiesforelectronicapplications AT pechtmichael encapsulationtechnologiesforelectronicapplications |