3D integration in VLSI circuits: implementation technologies and applications
Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to pro...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Boca Raton, FL
CRC Press/Taylor & Francis Group
[2018]
|
| Schriftenreihe: | Devices, circuits, & systems
|
| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Zusammenfassung: | Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe... |
| Beschreibung: | Includes bibliographical references and index |
| Beschreibung: | xv, 217 Seiten Illustrationen |
| ISBN: | 9781138710399 |
Internformat
MARC
| LEADER | 00000nam a2200000 c 4500 | ||
|---|---|---|---|
| 001 | BV045241611 | ||
| 003 | DE-604 | ||
| 005 | 20181130 | ||
| 007 | t | ||
| 008 | 181019s2018 xxua||| |||| 00||| eng d | ||
| 010 | |a 018010530 | ||
| 020 | |a 9781138710399 |9 978-1-138-71039-9 | ||
| 035 | |a (OCoLC)1042813329 | ||
| 035 | |a (DE-599)BVBBV045241611 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 044 | |a xxu |c US | ||
| 049 | |a DE-83 | ||
| 050 | 0 | |a TK7874.893 | |
| 082 | 0 | |a 621.39/5 |2 23 | |
| 084 | |a ZN 4952 |0 (DE-625)157425: |2 rvk | ||
| 084 | |a ZN 4904 |0 (DE-625)157419: |2 rvk | ||
| 245 | 1 | 0 | |a 3D integration in VLSI circuits |b implementation technologies and applications |c edited by Katsuyuki Sakuma |
| 264 | 1 | |a Boca Raton, FL |b CRC Press/Taylor & Francis Group |c [2018] | |
| 264 | 4 | |c © 2018 | |
| 300 | |a xv, 217 Seiten |b Illustrationen | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b n |2 rdamedia | ||
| 338 | |b nc |2 rdacarrier | ||
| 490 | 0 | |a Devices, circuits, & systems | |
| 500 | |a Includes bibliographical references and index | ||
| 520 | |a Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe... | ||
| 650 | 4 | |a Three-dimensional integrated circuits | |
| 650 | 4 | |a Integrated circuits |x Very large scale integration | |
| 650 | 0 | 7 | |a Dreidimensionale Integration |0 (DE-588)4218841-6 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a VLSI |0 (DE-588)4117388-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Field programmable gate array |0 (DE-588)4347749-5 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a VLSI |0 (DE-588)4117388-0 |D s |
| 689 | 0 | 1 | |a Field programmable gate array |0 (DE-588)4347749-5 |D s |
| 689 | 0 | 2 | |a Dreidimensionale Integration |0 (DE-588)4218841-6 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Sakuma, Katsuyuki |4 aut | |
| 856 | 4 | 2 | |m LoC Fremddatenuebernahme |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=030629811&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030629811 | ||
Datensatz im Suchindex
| _version_ | 1804178978297085952 |
|---|---|
| adam_text | 3D INTEGRATION IN VLSI CIRCUITS
/
: 2018
TABLE OF CONTENTS / INHALTSVERZEICHNIS
3D INTEGRATION: TECHNOLOGY AND DESIGN / P. FRANZON
3D SIP FOR ASIC AND 3D DRAM INTEGRATION / L. LI
A NEW CLASS OF HIGH-CAPACITY, RESOURCE-RICH FPGAS ENABLED BY 3D-IC
STACKED SILICON INTERCONNECT TECHNOLOGY (SSIT) / S. RAMALINGAM, HENLEY
LIU, MYONGSEOB KIM, BOON ANG, WOON-SEONG KWON, TOM LEE, SUSAN WU,
JONATHAN CHANG, EPHREM WU, XIN WU, AND LIAM MADDEN
CHALLENGES IN 3D / M. KOYANAGI, T. FUKUSHIMA, AND T. TANAKA
WAFER-LEVEL THREE-DIMENSIONAL INTEGRATION (3DI) USING BUMPLESS
INTERCONNECTS AND ULTRA-THINNING / T. OHBA
3DI STACKING TECHNOLOGIES FOR HIGH VOLUME MANUFACTURING BY USE OF WAFER
LEVEL OXIDE BONDING INTEGRATION / S. SKORDAS, K. SAKUMA, K. WINSTEL, AND
C. KOTHANDARAMAN
TOWARD 3D HIGH DENSITY / S. CHERAMY, A. JOUVE, C. FENOUILLET-BERANGER,
P. VIVET, AND L. DI CIOCCIO
NOVEL PLATFORMS AND APPLICATIONS USING 3D AND HETEROGENEOUS INTEGRATION
TECHNOLOGIES / K-N. CHEN, TING-YANG YU, YU-CHEN HU, CHENG-HSIEN LU
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
|
| any_adam_object | 1 |
| author | Sakuma, Katsuyuki |
| author_facet | Sakuma, Katsuyuki |
| author_role | aut |
| author_sort | Sakuma, Katsuyuki |
| author_variant | k s ks |
| building | Verbundindex |
| bvnumber | BV045241611 |
| callnumber-first | T - Technology |
| callnumber-label | TK7874 |
| callnumber-raw | TK7874.893 |
| callnumber-search | TK7874.893 |
| callnumber-sort | TK 47874.893 |
| callnumber-subject | TK - Electrical and Nuclear Engineering |
| classification_rvk | ZN 4952 ZN 4904 |
| ctrlnum | (OCoLC)1042813329 (DE-599)BVBBV045241611 |
| dewey-full | 621.39/5 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.39/5 |
| dewey-search | 621.39/5 |
| dewey-sort | 3621.39 15 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02798nam a2200493 c 4500</leader><controlfield tag="001">BV045241611</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20181130 </controlfield><controlfield tag="007">t</controlfield><controlfield tag="008">181019s2018 xxua||| |||| 00||| eng d</controlfield><datafield tag="010" ind1=" " ind2=" "><subfield code="a">018010530</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781138710399</subfield><subfield code="9">978-1-138-71039-9</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1042813329</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045241611</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="044" ind1=" " ind2=" "><subfield code="a">xxu</subfield><subfield code="c">US</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-83</subfield></datafield><datafield tag="050" ind1=" " ind2="0"><subfield code="a">TK7874.893</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.39/5</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4952</subfield><subfield code="0">(DE-625)157425:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4904</subfield><subfield code="0">(DE-625)157419:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">3D integration in VLSI circuits</subfield><subfield code="b">implementation technologies and applications</subfield><subfield code="c">edited by Katsuyuki Sakuma</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boca Raton, FL</subfield><subfield code="b">CRC Press/Taylor & Francis Group</subfield><subfield code="c">[2018]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2018</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xv, 217 Seiten</subfield><subfield code="b">Illustrationen</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Devices, circuits, & systems</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe...</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Three-dimensional integrated circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Very large scale integration</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Dreidimensionale Integration</subfield><subfield code="0">(DE-588)4218841-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Field programmable gate array</subfield><subfield code="0">(DE-588)4347749-5</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">VLSI</subfield><subfield code="0">(DE-588)4117388-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Field programmable gate array</subfield><subfield code="0">(DE-588)4347749-5</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Dreidimensionale Integration</subfield><subfield code="0">(DE-588)4218841-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Sakuma, Katsuyuki</subfield><subfield code="4">aut</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">LoC Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=030629811&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030629811</subfield></datafield></record></collection> |
| id | DE-604.BV045241611 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:12:33Z |
| institution | BVB |
| isbn | 9781138710399 |
| language | English |
| lccn | 018010530 |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030629811 |
| oclc_num | 1042813329 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | xv, 217 Seiten Illustrationen |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | CRC Press/Taylor & Francis Group |
| record_format | marc |
| series2 | Devices, circuits, & systems |
| spelling | 3D integration in VLSI circuits implementation technologies and applications edited by Katsuyuki Sakuma Boca Raton, FL CRC Press/Taylor & Francis Group [2018] © 2018 xv, 217 Seiten Illustrationen txt rdacontent n rdamedia nc rdacarrier Devices, circuits, & systems Includes bibliographical references and index Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world's leading scientists and experts from academia, research institutes, and industry from around the globe... Three-dimensional integrated circuits Integrated circuits Very large scale integration Dreidimensionale Integration (DE-588)4218841-6 gnd rswk-swf VLSI (DE-588)4117388-0 gnd rswk-swf Field programmable gate array (DE-588)4347749-5 gnd rswk-swf VLSI (DE-588)4117388-0 s Field programmable gate array (DE-588)4347749-5 s Dreidimensionale Integration (DE-588)4218841-6 s DE-604 Sakuma, Katsuyuki aut LoC Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=030629811&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Sakuma, Katsuyuki 3D integration in VLSI circuits implementation technologies and applications Three-dimensional integrated circuits Integrated circuits Very large scale integration Dreidimensionale Integration (DE-588)4218841-6 gnd VLSI (DE-588)4117388-0 gnd Field programmable gate array (DE-588)4347749-5 gnd |
| subject_GND | (DE-588)4218841-6 (DE-588)4117388-0 (DE-588)4347749-5 |
| title | 3D integration in VLSI circuits implementation technologies and applications |
| title_auth | 3D integration in VLSI circuits implementation technologies and applications |
| title_exact_search | 3D integration in VLSI circuits implementation technologies and applications |
| title_full | 3D integration in VLSI circuits implementation technologies and applications edited by Katsuyuki Sakuma |
| title_fullStr | 3D integration in VLSI circuits implementation technologies and applications edited by Katsuyuki Sakuma |
| title_full_unstemmed | 3D integration in VLSI circuits implementation technologies and applications edited by Katsuyuki Sakuma |
| title_short | 3D integration in VLSI circuits |
| title_sort | 3d integration in vlsi circuits implementation technologies and applications |
| title_sub | implementation technologies and applications |
| topic | Three-dimensional integrated circuits Integrated circuits Very large scale integration Dreidimensionale Integration (DE-588)4218841-6 gnd VLSI (DE-588)4117388-0 gnd Field programmable gate array (DE-588)4347749-5 gnd |
| topic_facet | Three-dimensional integrated circuits Integrated circuits Very large scale integration Dreidimensionale Integration VLSI Field programmable gate array |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=030629811&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT sakumakatsuyuki 3dintegrationinvlsicircuitsimplementationtechnologiesandapplications |