The Mechanics of Solder Alloy Wetting and Spreading:
In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing sc...
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
1993
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| Schlagworte: | |
| Online-Zugang: | BTU01 Volltext |
| Zusammenfassung: | In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing |
| Beschreibung: | 1 Online-Ressource (250 p) |
| ISBN: | 9781468414400 |
| DOI: | 10.1007/978-1-4684-1440-0 |
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| 520 | |a In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing | ||
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Datensatz im Suchindex
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4684-1440-0 |
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| id | DE-604.BV045187394 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:59Z |
| institution | BVB |
| isbn | 9781468414400 |
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| publishDate | 1993 |
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| spelling | The Mechanics of Solder Alloy Wetting and Spreading edited by F. G. Yost, F. M. Hosking, D. R. Frear Boston, MA Springer US 1993 1 Online-Ressource (250 p) txt rdacontent c rdamedia cr rdacarrier In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Yost, F. G. edt Hosking, F. M. edt Frear, D. R. edt Erscheint auch als Druck-Ausgabe 9781468414424 https://doi.org/10.1007/978-1-4684-1440-0 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | The Mechanics of Solder Alloy Wetting and Spreading Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits |
| title | The Mechanics of Solder Alloy Wetting and Spreading |
| title_auth | The Mechanics of Solder Alloy Wetting and Spreading |
| title_exact_search | The Mechanics of Solder Alloy Wetting and Spreading |
| title_full | The Mechanics of Solder Alloy Wetting and Spreading edited by F. G. Yost, F. M. Hosking, D. R. Frear |
| title_fullStr | The Mechanics of Solder Alloy Wetting and Spreading edited by F. G. Yost, F. M. Hosking, D. R. Frear |
| title_full_unstemmed | The Mechanics of Solder Alloy Wetting and Spreading edited by F. G. Yost, F. M. Hosking, D. R. Frear |
| title_short | The Mechanics of Solder Alloy Wetting and Spreading |
| title_sort | the mechanics of solder alloy wetting and spreading |
| topic | Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits |
| topic_facet | Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits |
| url | https://doi.org/10.1007/978-1-4684-1440-0 |
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