High-Frequency Characterization of Electronic Packaging:
High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in b...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
1998
|
| Schriftenreihe: | Electronic Packaging and Interconnects Series
1 |
| Schlagworte: | |
| Online-Zugang: | BTU01 Volltext |
| Zusammenfassung: | High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples |
| Beschreibung: | 1 Online-Ressource (XII, 158 p) |
| ISBN: | 9781461556237 |
| DOI: | 10.1007/978-1-4615-5623-7 |
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Datensatz im Suchindex
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| author | Martens, Luc |
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| dewey-full | 621.3 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3 |
| dewey-search | 621.3 |
| dewey-sort | 3621.3 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4615-5623-7 |
| format | Electronic eBook |
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| id | DE-604.BV045187179 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:59Z |
| institution | BVB |
| isbn | 9781461556237 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030576357 |
| oclc_num | 1053815135 |
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| physical | 1 Online-Ressource (XII, 158 p) |
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| publishDate | 1998 |
| publishDateSearch | 1998 |
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| publisher | Springer US |
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| series2 | Electronic Packaging and Interconnects Series |
| spelling | Martens, Luc Verfasser aut High-Frequency Characterization of Electronic Packaging by Luc Martens Boston, MA Springer US 1998 1 Online-Ressource (XII, 158 p) txt rdacontent c rdamedia cr rdacarrier Electronic Packaging and Interconnects Series 1 High-Frequency Characterization of Electronic Packaging will be of interest to researchers and designers of high-frequency electronic packaging. Understanding high-frequency behavior of packaging is of growing importance due to higher clock-speeds in computers and higher data transmission rates in broadband telecommunication systems. Basic knowledge of the high-frequency behavior of packaging and interconnects is, therefore, indispensable for the design of future telecommunication and computer systems. High-Frequency Characterization of Electronic Packaging gives the reader an insight into how high-frequency characterization of electronic packaging should be done and describes the problems that have to be tackled, especially in performing accurate measurements on modern IC-packages and in determination of circuit models. High-Frequency Characterization of Electronic Packaging is conceived as a comprehensive guide for the start of research and to help in performing high-frequency measurements. Important notions in high- frequency characterization such as S-parameters, calibration, probing, de-embedding and measurement-based modeling are explained. The described techniques are illustrated with several up-to-date examples Engineering Microwaves, RF and Optical Engineering Control, Robotics, Mechatronics Electrical Engineering Control engineering Robotics Mechatronics Electrical engineering Microwaves Optical engineering Erscheint auch als Druck-Ausgabe 9780792383079 https://doi.org/10.1007/978-1-4615-5623-7 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Martens, Luc High-Frequency Characterization of Electronic Packaging Engineering Microwaves, RF and Optical Engineering Control, Robotics, Mechatronics Electrical Engineering Control engineering Robotics Mechatronics Electrical engineering Microwaves Optical engineering |
| title | High-Frequency Characterization of Electronic Packaging |
| title_auth | High-Frequency Characterization of Electronic Packaging |
| title_exact_search | High-Frequency Characterization of Electronic Packaging |
| title_full | High-Frequency Characterization of Electronic Packaging by Luc Martens |
| title_fullStr | High-Frequency Characterization of Electronic Packaging by Luc Martens |
| title_full_unstemmed | High-Frequency Characterization of Electronic Packaging by Luc Martens |
| title_short | High-Frequency Characterization of Electronic Packaging |
| title_sort | high frequency characterization of electronic packaging |
| topic | Engineering Microwaves, RF and Optical Engineering Control, Robotics, Mechatronics Electrical Engineering Control engineering Robotics Mechatronics Electrical engineering Microwaves Optical engineering |
| topic_facet | Engineering Microwaves, RF and Optical Engineering Control, Robotics, Mechatronics Electrical Engineering Control engineering Robotics Mechatronics Electrical engineering Microwaves Optical engineering |
| url | https://doi.org/10.1007/978-1-4615-5623-7 |
| work_keys_str_mv | AT martensluc highfrequencycharacterizationofelectronicpackaging |