Conceptual Design of Multichip Modules and Systems:
Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and deci...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
1994
|
| Schriftenreihe: | The Springer International Series in Engineering and Computer Science
250 |
| Schlagworte: | |
| Online-Zugang: | BTU01 URL des Erstveröffentlichers |
| Zusammenfassung: | Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis |
| Beschreibung: | 1 Online-Ressource (XVI, 260 p) |
| ISBN: | 9781475748413 |
| DOI: | 10.1007/978-1-4757-4841-3 |
Internformat
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| 520 | |a Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis | ||
| 650 | 4 | |a Engineering | |
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Datensatz im Suchindex
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| author | Sandborn, Peter A. Moreno, Hector |
| author_facet | Sandborn, Peter A. Moreno, Hector |
| author_role | aut aut |
| author_sort | Sandborn, Peter A. |
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| bvnumber | BV045186230 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)978-1-4757-4841-3 (OCoLC)1053696773 (DE-599)BVBBV045186230 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4757-4841-3 |
| format | Electronic eBook |
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| id | DE-604.BV045186230 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:57Z |
| institution | BVB |
| isbn | 9781475748413 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030575407 |
| oclc_num | 1053696773 |
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| owner | DE-634 |
| owner_facet | DE-634 |
| physical | 1 Online-Ressource (XVI, 260 p) |
| psigel | ZDB-2-ENG ZDB-2-ENG_Archiv ZDB-2-ENG ZDB-2-ENG_Archiv |
| publishDate | 1994 |
| publishDateSearch | 1994 |
| publishDateSort | 1994 |
| publisher | Springer US |
| record_format | marc |
| series2 | The Springer International Series in Engineering and Computer Science |
| spelling | Sandborn, Peter A. Verfasser aut Conceptual Design of Multichip Modules and Systems by Peter A. Sandborn, Hector Moreno Boston, MA Springer US 1994 1 Online-Ressource (XVI, 260 p) txt rdacontent c rdamedia cr rdacarrier The Springer International Series in Engineering and Computer Science 250 Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis Engineering Circuits and Systems Electrical Engineering Electrical engineering Electronic circuits Multichiptechnik (DE-588)4267925-4 gnd rswk-swf Multichiptechnik (DE-588)4267925-4 s 1\p DE-604 Moreno, Hector aut Erscheint auch als Druck-Ausgabe 9781441951373 https://doi.org/10.1007/978-1-4757-4841-3 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Sandborn, Peter A. Moreno, Hector Conceptual Design of Multichip Modules and Systems Engineering Circuits and Systems Electrical Engineering Electrical engineering Electronic circuits Multichiptechnik (DE-588)4267925-4 gnd |
| subject_GND | (DE-588)4267925-4 |
| title | Conceptual Design of Multichip Modules and Systems |
| title_auth | Conceptual Design of Multichip Modules and Systems |
| title_exact_search | Conceptual Design of Multichip Modules and Systems |
| title_full | Conceptual Design of Multichip Modules and Systems by Peter A. Sandborn, Hector Moreno |
| title_fullStr | Conceptual Design of Multichip Modules and Systems by Peter A. Sandborn, Hector Moreno |
| title_full_unstemmed | Conceptual Design of Multichip Modules and Systems by Peter A. Sandborn, Hector Moreno |
| title_short | Conceptual Design of Multichip Modules and Systems |
| title_sort | conceptual design of multichip modules and systems |
| topic | Engineering Circuits and Systems Electrical Engineering Electrical engineering Electronic circuits Multichiptechnik (DE-588)4267925-4 gnd |
| topic_facet | Engineering Circuits and Systems Electrical Engineering Electrical engineering Electronic circuits Multichiptechnik |
| url | https://doi.org/10.1007/978-1-4757-4841-3 |
| work_keys_str_mv | AT sandbornpetera conceptualdesignofmultichipmodulesandsystems AT morenohector conceptualdesignofmultichipmodulesandsystems |