Solder Joint Reliability: Theory and Applications
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the...
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
1991
|
| Schlagworte: | |
| Online-Zugang: | BTU01 FHI01 URL des Erstveröffentlichers |
| Zusammenfassung: | Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer |
| Beschreibung: | 1 Online-Ressource (XXI, 631 p. 146 illus) |
| ISBN: | 9781461539100 |
| DOI: | 10.1007/978-1-4615-3910-0 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV045185206 | ||
| 003 | DE-604 | ||
| 005 | 20221216 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180912s1991 |||| o||u| ||||||eng d | ||
| 020 | |a 9781461539100 |9 978-1-4615-3910-0 | ||
| 024 | 7 | |a 10.1007/978-1-4615-3910-0 |2 doi | |
| 035 | |a (ZDB-2-ENG)978-1-4615-3910-0 | ||
| 035 | |a (OCoLC)1184376440 | ||
| 035 | |a (DE-599)BVBBV045185206 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-634 |a DE-573 | ||
| 082 | 0 | |a 621.3815 |2 23 | |
| 245 | 1 | 0 | |a Solder Joint Reliability |b Theory and Applications |c edited by John H. Lau |
| 264 | 1 | |a Boston, MA |b Springer US |c 1991 | |
| 300 | |a 1 Online-Ressource (XXI, 631 p. 146 illus) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 520 | |a Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer | ||
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Circuits and Systems | |
| 650 | 4 | |a Control Structures and Microprogramming | |
| 650 | 4 | |a Manufacturing, Machines, Tools | |
| 650 | 4 | |a Electrical Engineering | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Microprogramming | |
| 650 | 4 | |a Manufacturing industries | |
| 650 | 4 | |a Machines | |
| 650 | 4 | |a Tools | |
| 650 | 4 | |a Electrical engineering | |
| 650 | 4 | |a Electronic circuits | |
| 650 | 0 | 7 | |a Lötverbindung |0 (DE-588)4195776-3 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Lötverbindung |0 (DE-588)4195776-3 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Lau, John H. |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9781461367437 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-1-4615-3910-0 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_Archiv | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030574384 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u https://doi.org/10.1007/978-1-4615-3910-0 |l BTU01 |p ZDB-2-ENG |q ZDB-2-ENG_Archiv |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-1-4615-3910-0 |l FHI01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804178874803683328 |
|---|---|
| any_adam_object | |
| author2 | Lau, John H. |
| author2_role | edt |
| author2_variant | j h l jh jhl |
| author_facet | Lau, John H. |
| building | Verbundindex |
| bvnumber | BV045185206 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)978-1-4615-3910-0 (OCoLC)1184376440 (DE-599)BVBBV045185206 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4615-3910-0 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03322nmm a2200565zc 4500</leader><controlfield tag="001">BV045185206</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20221216 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180912s1991 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781461539100</subfield><subfield code="9">978-1-4615-3910-0</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-1-4615-3910-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-1-4615-3910-0</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1184376440</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045185206</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-634</subfield><subfield code="a">DE-573</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">23</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Solder Joint Reliability</subfield><subfield code="b">Theory and Applications</subfield><subfield code="c">edited by John H. Lau</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boston, MA</subfield><subfield code="b">Springer US</subfield><subfield code="c">1991</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (XXI, 631 p. 146 illus)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Circuits and Systems</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Control Structures and Microprogramming</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing, Machines, Tools</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microprogramming</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing industries</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Machines</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Tools</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Lötverbindung</subfield><subfield code="0">(DE-588)4195776-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Lötverbindung</subfield><subfield code="0">(DE-588)4195776-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lau, John H.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9781461367437</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-1-4615-3910-0</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_Archiv</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030574384</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4615-3910-0</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="q">ZDB-2-ENG_Archiv</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-1-4615-3910-0</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV045185206 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:55Z |
| institution | BVB |
| isbn | 9781461539100 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030574384 |
| oclc_num | 1184376440 |
| open_access_boolean | |
| owner | DE-634 DE-573 |
| owner_facet | DE-634 DE-573 |
| physical | 1 Online-Ressource (XXI, 631 p. 146 illus) |
| psigel | ZDB-2-ENG ZDB-2-ENG_Archiv ZDB-2-ENG ZDB-2-ENG_Archiv |
| publishDate | 1991 |
| publishDateSearch | 1991 |
| publishDateSort | 1991 |
| publisher | Springer US |
| record_format | marc |
| spelling | Solder Joint Reliability Theory and Applications edited by John H. Lau Boston, MA Springer US 1991 1 Online-Ressource (XXI, 631 p. 146 illus) txt rdacontent c rdamedia cr rdacarrier Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Lötverbindung (DE-588)4195776-3 gnd rswk-swf Lötverbindung (DE-588)4195776-3 s 1\p DE-604 Lau, John H. edt Erscheint auch als Druck-Ausgabe 9781461367437 https://doi.org/10.1007/978-1-4615-3910-0 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Solder Joint Reliability Theory and Applications Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Lötverbindung (DE-588)4195776-3 gnd |
| subject_GND | (DE-588)4195776-3 |
| title | Solder Joint Reliability Theory and Applications |
| title_auth | Solder Joint Reliability Theory and Applications |
| title_exact_search | Solder Joint Reliability Theory and Applications |
| title_full | Solder Joint Reliability Theory and Applications edited by John H. Lau |
| title_fullStr | Solder Joint Reliability Theory and Applications edited by John H. Lau |
| title_full_unstemmed | Solder Joint Reliability Theory and Applications edited by John H. Lau |
| title_short | Solder Joint Reliability |
| title_sort | solder joint reliability theory and applications |
| title_sub | Theory and Applications |
| topic | Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Lötverbindung (DE-588)4195776-3 gnd |
| topic_facet | Engineering Circuits and Systems Control Structures and Microprogramming Manufacturing, Machines, Tools Electrical Engineering Microprogramming Manufacturing industries Machines Tools Electrical engineering Electronic circuits Lötverbindung |
| url | https://doi.org/10.1007/978-1-4615-3910-0 |
| work_keys_str_mv | AT laujohnh solderjointreliabilitytheoryandapplications |