Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the eva...
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| Main Authors: | , |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Berlin, Heidelberg
Springer Berlin Heidelberg
2004
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| Subjects: | |
| Online Access: | UBT01 Volltext |
| Summary: | This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP. |
| Physical Description: | 1 Online-Ressource (XXIV, 311 p) |
| ISBN: | 9783662079287 |
| DOI: | 10.1007/978-3-662-07928-7 |
Staff View
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| id | DE-604.BV045152150 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:07Z |
| institution | BVB |
| isbn | 9783662079287 |
| language | English |
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| physical | 1 Online-Ressource (XXIV, 311 p) |
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| publishDate | 2004 |
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| publisher | Springer Berlin Heidelberg |
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| spelling | Luo, Jianfeng Verfasser aut Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales by Jianfeng Luo, David A. Dornfeld Berlin, Heidelberg Springer Berlin Heidelberg 2004 1 Online-Ressource (XXIV, 311 p) txt rdacontent c rdamedia cr rdacarrier This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP. Chemistry Industrial Chemistry/Chemical Engineering Surface and Interface Science, Thin Films Circuits and Systems Electronics and Microelectronics, Instrumentation Surfaces and Interfaces, Thin Films Physical Chemistry Physical chemistry Chemical engineering Surfaces (Physics) Interfaces (Physical sciences) Thin films Electronics Microelectronics Electronic circuits Materials / Surfaces Dornfeld, David A. aut Erscheint auch als Druck-Ausgabe 9783642061158 https://doi.org/10.1007/978-3-662-07928-7 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Luo, Jianfeng Dornfeld, David A. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales Chemistry Industrial Chemistry/Chemical Engineering Surface and Interface Science, Thin Films Circuits and Systems Electronics and Microelectronics, Instrumentation Surfaces and Interfaces, Thin Films Physical Chemistry Physical chemistry Chemical engineering Surfaces (Physics) Interfaces (Physical sciences) Thin films Electronics Microelectronics Electronic circuits Materials / Surfaces |
| title | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales |
| title_auth | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales |
| title_exact_search | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales |
| title_full | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales by Jianfeng Luo, David A. Dornfeld |
| title_fullStr | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales by Jianfeng Luo, David A. Dornfeld |
| title_full_unstemmed | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales by Jianfeng Luo, David A. Dornfeld |
| title_short | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication |
| title_sort | integrated modeling of chemical mechanical planarization for sub micron ic fabrication from particle scale to feature die and wafer scales |
| title_sub | From Particle Scale to Feature, Die and Wafer Scales |
| topic | Chemistry Industrial Chemistry/Chemical Engineering Surface and Interface Science, Thin Films Circuits and Systems Electronics and Microelectronics, Instrumentation Surfaces and Interfaces, Thin Films Physical Chemistry Physical chemistry Chemical engineering Surfaces (Physics) Interfaces (Physical sciences) Thin films Electronics Microelectronics Electronic circuits Materials / Surfaces |
| topic_facet | Chemistry Industrial Chemistry/Chemical Engineering Surface and Interface Science, Thin Films Circuits and Systems Electronics and Microelectronics, Instrumentation Surfaces and Interfaces, Thin Films Physical Chemistry Physical chemistry Chemical engineering Surfaces (Physics) Interfaces (Physical sciences) Thin films Electronics Microelectronics Electronic circuits Materials / Surfaces |
| url | https://doi.org/10.1007/978-3-662-07928-7 |
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