Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the eva...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Berlin, Heidelberg
Springer Berlin Heidelberg
2004
|
| Schlagworte: | |
| Online-Zugang: | UBT01 URL des Erstveröffentlichers |
| Zusammenfassung: | This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP. |
| Beschreibung: | 1 Online-Ressource (XXIV, 311 p) |
| ISBN: | 9783662079287 |
| DOI: | 10.1007/978-3-662-07928-7 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV045152150 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180828s2004 |||| o||u| ||||||eng d | ||
| 020 | |a 9783662079287 |9 978-3-662-07928-7 | ||
| 024 | 7 | |a 10.1007/978-3-662-07928-7 |2 doi | |
| 035 | |a (ZDB-2-CMS)978-3-662-07928-7 | ||
| 035 | |a (OCoLC)1050948417 | ||
| 035 | |a (DE-599)BVBBV045152150 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-703 | ||
| 082 | 0 | |a 660 |2 23 | |
| 100 | 1 | |a Luo, Jianfeng |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication |b From Particle Scale to Feature, Die and Wafer Scales |c by Jianfeng Luo, David A. Dornfeld |
| 264 | 1 | |a Berlin, Heidelberg |b Springer Berlin Heidelberg |c 2004 | |
| 300 | |a 1 Online-Ressource (XXIV, 311 p) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 520 | |a This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP. | ||
| 650 | 4 | |a Chemistry | |
| 650 | 4 | |a Industrial Chemistry/Chemical Engineering | |
| 650 | 4 | |a Surface and Interface Science, Thin Films | |
| 650 | 4 | |a Circuits and Systems | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Surfaces and Interfaces, Thin Films | |
| 650 | 4 | |a Physical Chemistry | |
| 650 | 4 | |a Chemistry | |
| 650 | 4 | |a Physical chemistry | |
| 650 | 4 | |a Chemical engineering | |
| 650 | 4 | |a Surfaces (Physics) | |
| 650 | 4 | |a Interfaces (Physical sciences) | |
| 650 | 4 | |a Thin films | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Electronic circuits | |
| 650 | 4 | |a Materials / Surfaces | |
| 700 | 1 | |a Dornfeld, David A. |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9783642061158 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-3-662-07928-7 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-CMS | ||
| 940 | 1 | |q ZDB-2-CMS_2000/2004 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030541818 | ||
| 966 | e | |u https://doi.org/10.1007/978-3-662-07928-7 |l UBT01 |p ZDB-2-CMS |q ZDB-2-CMS_2000/2004 |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804178825055043584 |
|---|---|
| any_adam_object | |
| author | Luo, Jianfeng Dornfeld, David A. |
| author_facet | Luo, Jianfeng Dornfeld, David A. |
| author_role | aut aut |
| author_sort | Luo, Jianfeng |
| author_variant | j l jl d a d da dad |
| building | Verbundindex |
| bvnumber | BV045152150 |
| collection | ZDB-2-CMS |
| ctrlnum | (ZDB-2-CMS)978-3-662-07928-7 (OCoLC)1050948417 (DE-599)BVBBV045152150 |
| dewey-full | 660 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 660 - Chemical engineering |
| dewey-raw | 660 |
| dewey-search | 660 |
| dewey-sort | 3660 |
| dewey-tens | 660 - Chemical engineering |
| discipline | Chemie / Pharmazie |
| doi_str_mv | 10.1007/978-3-662-07928-7 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02949nmm a2200577zc 4500</leader><controlfield tag="001">BV045152150</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180828s2004 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783662079287</subfield><subfield code="9">978-3-662-07928-7</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-662-07928-7</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-CMS)978-3-662-07928-7</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1050948417</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045152150</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">660</subfield><subfield code="2">23</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Luo, Jianfeng</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication</subfield><subfield code="b">From Particle Scale to Feature, Die and Wafer Scales</subfield><subfield code="c">by Jianfeng Luo, David A. Dornfeld</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Berlin, Heidelberg</subfield><subfield code="b">Springer Berlin Heidelberg</subfield><subfield code="c">2004</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (XXIV, 311 p)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Industrial Chemistry/Chemical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surface and Interface Science, Thin Films</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Circuits and Systems</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surfaces and Interfaces, Thin Films</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Physical Chemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Physical chemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Surfaces (Physics)</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Interfaces (Physical sciences)</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thin films</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials / Surfaces</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Dornfeld, David A.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9783642061158</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-662-07928-7</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-CMS</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-CMS_2000/2004</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030541818</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-662-07928-7</subfield><subfield code="l">UBT01</subfield><subfield code="p">ZDB-2-CMS</subfield><subfield code="q">ZDB-2-CMS_2000/2004</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV045152150 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:07Z |
| institution | BVB |
| isbn | 9783662079287 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030541818 |
| oclc_num | 1050948417 |
| open_access_boolean | |
| owner | DE-703 |
| owner_facet | DE-703 |
| physical | 1 Online-Ressource (XXIV, 311 p) |
| psigel | ZDB-2-CMS ZDB-2-CMS_2000/2004 ZDB-2-CMS ZDB-2-CMS_2000/2004 |
| publishDate | 2004 |
| publishDateSearch | 2004 |
| publishDateSort | 2004 |
| publisher | Springer Berlin Heidelberg |
| record_format | marc |
| spelling | Luo, Jianfeng Verfasser aut Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales by Jianfeng Luo, David A. Dornfeld Berlin, Heidelberg Springer Berlin Heidelberg 2004 1 Online-Ressource (XXIV, 311 p) txt rdacontent c rdamedia cr rdacarrier This book is the product of a developing research focus on CMP at Berkeley. Its focus is on the important area of process models which have not kept pace with the tremendous expansion of applications of CMP. It specifically deals with the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. The important role of the mechanical elements of the process are included in such an "integrated model". The objective of the book is to introduce some background on the overlooked mechanical aspects of the process - including pad surface topography and abrasive particles. The "integrated model" can be particularly useful as one looks towards optimization of the process, design of consumables and, importantly, looking to minimize the environmental affects of CMP. Chemistry Industrial Chemistry/Chemical Engineering Surface and Interface Science, Thin Films Circuits and Systems Electronics and Microelectronics, Instrumentation Surfaces and Interfaces, Thin Films Physical Chemistry Physical chemistry Chemical engineering Surfaces (Physics) Interfaces (Physical sciences) Thin films Electronics Microelectronics Electronic circuits Materials / Surfaces Dornfeld, David A. aut Erscheint auch als Druck-Ausgabe 9783642061158 https://doi.org/10.1007/978-3-662-07928-7 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Luo, Jianfeng Dornfeld, David A. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales Chemistry Industrial Chemistry/Chemical Engineering Surface and Interface Science, Thin Films Circuits and Systems Electronics and Microelectronics, Instrumentation Surfaces and Interfaces, Thin Films Physical Chemistry Physical chemistry Chemical engineering Surfaces (Physics) Interfaces (Physical sciences) Thin films Electronics Microelectronics Electronic circuits Materials / Surfaces |
| title | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales |
| title_auth | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales |
| title_exact_search | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales |
| title_full | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales by Jianfeng Luo, David A. Dornfeld |
| title_fullStr | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales by Jianfeng Luo, David A. Dornfeld |
| title_full_unstemmed | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication From Particle Scale to Feature, Die and Wafer Scales by Jianfeng Luo, David A. Dornfeld |
| title_short | Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication |
| title_sort | integrated modeling of chemical mechanical planarization for sub micron ic fabrication from particle scale to feature die and wafer scales |
| title_sub | From Particle Scale to Feature, Die and Wafer Scales |
| topic | Chemistry Industrial Chemistry/Chemical Engineering Surface and Interface Science, Thin Films Circuits and Systems Electronics and Microelectronics, Instrumentation Surfaces and Interfaces, Thin Films Physical Chemistry Physical chemistry Chemical engineering Surfaces (Physics) Interfaces (Physical sciences) Thin films Electronics Microelectronics Electronic circuits Materials / Surfaces |
| topic_facet | Chemistry Industrial Chemistry/Chemical Engineering Surface and Interface Science, Thin Films Circuits and Systems Electronics and Microelectronics, Instrumentation Surfaces and Interfaces, Thin Films Physical Chemistry Physical chemistry Chemical engineering Surfaces (Physics) Interfaces (Physical sciences) Thin films Electronics Microelectronics Electronic circuits Materials / Surfaces |
| url | https://doi.org/10.1007/978-3-662-07928-7 |
| work_keys_str_mv | AT luojianfeng integratedmodelingofchemicalmechanicalplanarizationforsubmicronicfabricationfromparticlescaletofeaturedieandwaferscales AT dornfelddavida integratedmodelingofchemicalmechanicalplanarizationforsubmicronicfabricationfromparticlescaletofeaturedieandwaferscales |