APA (7th ed.) Citation

Luo, J., & Dornfeld, D. A. (2004). Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales. Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-662-07928-7

Chicago Style (17th ed.) Citation

Luo, Jianfeng, and David A. Dornfeld. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales. Berlin, Heidelberg: Springer Berlin Heidelberg, 2004. https://doi.org/10.1007/978-3-662-07928-7.

MLA (9th ed.) Citation

Luo, Jianfeng, and David A. Dornfeld. Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales. Springer Berlin Heidelberg, 2004. https://doi.org/10.1007/978-3-662-07928-7.