Mechanical Microsensors:
Fabrication technologies related to those which are exploited for the fabrication of integrated circuits can be used to machine mechanical structures with minimum feature sizes in the range of micrometers. The mechanical machining of silicon based on IC-technologies is known as micromachining, and t...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Berlin, Heidelberg
Springer Berlin Heidelberg
2001
|
Schriftenreihe: | Microtechnology and MEMS
|
Schlagworte: | |
Online-Zugang: | UBT01 Volltext |
Zusammenfassung: | Fabrication technologies related to those which are exploited for the fabrication of integrated circuits can be used to machine mechanical structures with minimum feature sizes in the range of micrometers. The mechanical machining of silicon based on IC-technologies is known as micromachining, and the systems made by micromachining are called MEMS (microelectromechanical systems). The present book describes how to use this technology to fabricate sensors of miniature size for mechanical quantities, such as pressure, force, flow and acceleration. The book includes a chapter with a comprehensive description of the relevant micromachining processes, and an introduction to MEMS, a field much broader than just microsensors. Most of these sensors rely on a deformation of the mechanical construction by an external load, and on a transduction mechanism to convert the deformation into a mechanical signal. The fundamental mechanics and electromechanics required for the understanding and the design of mechanical microsensors are described on a level accessible to engineers of all disciplines. Students in engineering sciences from the third year on should be able to benefit from this description. The most important mechanical sensors are described and discussed in detail with respect to fabrication issues, function and performance. Special emphasis is given to pressure sensors, force sensors, accelerometers, gyroscopes and flow sensors. Electronic interfacing, and a discussion of electronic circuits used for the sensors is also included. Finally the problem of packaging is addressed |
Beschreibung: | 1 Online-Ressource (X, 295 p) |
ISBN: | 9783662043219 |
DOI: | 10.1007/978-3-662-04321-9 |
Internformat
MARC
LEADER | 00000nmm a2200000zc 4500 | ||
---|---|---|---|
001 | BV045152099 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 180828s2001 |||| o||u| ||||||eng d | ||
020 | |a 9783662043219 |9 978-3-662-04321-9 | ||
024 | 7 | |a 10.1007/978-3-662-04321-9 |2 doi | |
035 | |a (ZDB-2-CMS)978-3-662-04321-9 | ||
035 | |a (OCoLC)1184503919 | ||
035 | |a (DE-599)BVBBV045152099 | ||
040 | |a DE-604 |b ger |e aacr | ||
041 | 0 | |a eng | |
049 | |a DE-703 | ||
082 | 0 | |a 620.115 |2 23 | |
100 | 1 | |a Elwenspoek, Miko |e Verfasser |4 aut | |
245 | 1 | 0 | |a Mechanical Microsensors |c by Miko Elwenspoek, Remco Wiegerink |
264 | 1 | |a Berlin, Heidelberg |b Springer Berlin Heidelberg |c 2001 | |
300 | |a 1 Online-Ressource (X, 295 p) | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Microtechnology and MEMS | |
520 | |a Fabrication technologies related to those which are exploited for the fabrication of integrated circuits can be used to machine mechanical structures with minimum feature sizes in the range of micrometers. The mechanical machining of silicon based on IC-technologies is known as micromachining, and the systems made by micromachining are called MEMS (microelectromechanical systems). The present book describes how to use this technology to fabricate sensors of miniature size for mechanical quantities, such as pressure, force, flow and acceleration. The book includes a chapter with a comprehensive description of the relevant micromachining processes, and an introduction to MEMS, a field much broader than just microsensors. Most of these sensors rely on a deformation of the mechanical construction by an external load, and on a transduction mechanism to convert the deformation into a mechanical signal. The fundamental mechanics and electromechanics required for the understanding and the design of mechanical microsensors are described on a level accessible to engineers of all disciplines. Students in engineering sciences from the third year on should be able to benefit from this description. The most important mechanical sensors are described and discussed in detail with respect to fabrication issues, function and performance. Special emphasis is given to pressure sensors, force sensors, accelerometers, gyroscopes and flow sensors. Electronic interfacing, and a discussion of electronic circuits used for the sensors is also included. Finally the problem of packaging is addressed | ||
650 | 4 | |a Materials Science | |
650 | 4 | |a Nanotechnology | |
650 | 4 | |a Theoretical and Applied Mechanics | |
650 | 4 | |a Measurement Science and Instrumentation | |
650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
650 | 4 | |a Control, Robotics, Mechatronics | |
650 | 4 | |a Materials science | |
650 | 4 | |a Physical measurements | |
650 | 4 | |a Measurement | |
650 | 4 | |a Mechanics | |
650 | 4 | |a Mechanics, Applied | |
650 | 4 | |a Control engineering | |
650 | 4 | |a Robotics | |
650 | 4 | |a Mechatronics | |
650 | 4 | |a Electronics | |
650 | 4 | |a Microelectronics | |
650 | 4 | |a Nanotechnology | |
650 | 0 | 7 | |a Mikromechanik |0 (DE-588)4205811-9 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Mikrosensor |0 (DE-588)4561097-6 |2 gnd |9 rswk-swf |
689 | 0 | 0 | |a Mikrosensor |0 (DE-588)4561097-6 |D s |
689 | 0 | 1 | |a Mikromechanik |0 (DE-588)4205811-9 |D s |
689 | 0 | |8 1\p |5 DE-604 | |
700 | 1 | |a Wiegerink, Remco |4 aut | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9783642087066 |
856 | 4 | 0 | |u https://doi.org/10.1007/978-3-662-04321-9 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
912 | |a ZDB-2-CMS | ||
940 | 1 | |q ZDB-2-CMS_2000/2004 | |
999 | |a oai:aleph.bib-bvb.de:BVB01-030541767 | ||
883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
966 | e | |u https://doi.org/10.1007/978-3-662-04321-9 |l UBT01 |p ZDB-2-CMS |q ZDB-2-CMS_2000/2004 |x Verlag |3 Volltext |
Datensatz im Suchindex
_version_ | 1804178825427288064 |
---|---|
any_adam_object | |
author | Elwenspoek, Miko Wiegerink, Remco |
author_facet | Elwenspoek, Miko Wiegerink, Remco |
author_role | aut aut |
author_sort | Elwenspoek, Miko |
author_variant | m e me r w rw |
building | Verbundindex |
bvnumber | BV045152099 |
collection | ZDB-2-CMS |
ctrlnum | (ZDB-2-CMS)978-3-662-04321-9 (OCoLC)1184503919 (DE-599)BVBBV045152099 |
dewey-full | 620.115 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 620 - Engineering and allied operations |
dewey-raw | 620.115 |
dewey-search | 620.115 |
dewey-sort | 3620.115 |
dewey-tens | 620 - Engineering and allied operations |
doi_str_mv | 10.1007/978-3-662-04321-9 |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03894nmm a2200661zc 4500</leader><controlfield tag="001">BV045152099</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180828s2001 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783662043219</subfield><subfield code="9">978-3-662-04321-9</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-662-04321-9</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-CMS)978-3-662-04321-9</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1184503919</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045152099</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-703</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">620.115</subfield><subfield code="2">23</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Elwenspoek, Miko</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Mechanical Microsensors</subfield><subfield code="c">by Miko Elwenspoek, Remco Wiegerink</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Berlin, Heidelberg</subfield><subfield code="b">Springer Berlin Heidelberg</subfield><subfield code="c">2001</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (X, 295 p)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Microtechnology and MEMS</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Fabrication technologies related to those which are exploited for the fabrication of integrated circuits can be used to machine mechanical structures with minimum feature sizes in the range of micrometers. The mechanical machining of silicon based on IC-technologies is known as micromachining, and the systems made by micromachining are called MEMS (microelectromechanical systems). The present book describes how to use this technology to fabricate sensors of miniature size for mechanical quantities, such as pressure, force, flow and acceleration. The book includes a chapter with a comprehensive description of the relevant micromachining processes, and an introduction to MEMS, a field much broader than just microsensors. Most of these sensors rely on a deformation of the mechanical construction by an external load, and on a transduction mechanism to convert the deformation into a mechanical signal. The fundamental mechanics and electromechanics required for the understanding and the design of mechanical microsensors are described on a level accessible to engineers of all disciplines. Students in engineering sciences from the third year on should be able to benefit from this description. The most important mechanical sensors are described and discussed in detail with respect to fabrication issues, function and performance. Special emphasis is given to pressure sensors, force sensors, accelerometers, gyroscopes and flow sensors. Electronic interfacing, and a discussion of electronic circuits used for the sensors is also included. Finally the problem of packaging is addressed</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials Science</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Theoretical and Applied Mechanics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Measurement Science and Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Control, Robotics, Mechatronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials science</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Physical measurements</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Measurement</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanics, Applied</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Control engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Robotics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechatronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikromechanik</subfield><subfield code="0">(DE-588)4205811-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikrosensor</subfield><subfield code="0">(DE-588)4561097-6</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Mikrosensor</subfield><subfield code="0">(DE-588)4561097-6</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Mikromechanik</subfield><subfield code="0">(DE-588)4205811-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wiegerink, Remco</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9783642087066</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-662-04321-9</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-CMS</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-CMS_2000/2004</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030541767</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-662-04321-9</subfield><subfield code="l">UBT01</subfield><subfield code="p">ZDB-2-CMS</subfield><subfield code="q">ZDB-2-CMS_2000/2004</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
id | DE-604.BV045152099 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T08:10:07Z |
institution | BVB |
isbn | 9783662043219 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030541767 |
oclc_num | 1184503919 |
open_access_boolean | |
owner | DE-703 |
owner_facet | DE-703 |
physical | 1 Online-Ressource (X, 295 p) |
psigel | ZDB-2-CMS ZDB-2-CMS_2000/2004 ZDB-2-CMS ZDB-2-CMS_2000/2004 |
publishDate | 2001 |
publishDateSearch | 2001 |
publishDateSort | 2001 |
publisher | Springer Berlin Heidelberg |
record_format | marc |
series2 | Microtechnology and MEMS |
spelling | Elwenspoek, Miko Verfasser aut Mechanical Microsensors by Miko Elwenspoek, Remco Wiegerink Berlin, Heidelberg Springer Berlin Heidelberg 2001 1 Online-Ressource (X, 295 p) txt rdacontent c rdamedia cr rdacarrier Microtechnology and MEMS Fabrication technologies related to those which are exploited for the fabrication of integrated circuits can be used to machine mechanical structures with minimum feature sizes in the range of micrometers. The mechanical machining of silicon based on IC-technologies is known as micromachining, and the systems made by micromachining are called MEMS (microelectromechanical systems). The present book describes how to use this technology to fabricate sensors of miniature size for mechanical quantities, such as pressure, force, flow and acceleration. The book includes a chapter with a comprehensive description of the relevant micromachining processes, and an introduction to MEMS, a field much broader than just microsensors. Most of these sensors rely on a deformation of the mechanical construction by an external load, and on a transduction mechanism to convert the deformation into a mechanical signal. The fundamental mechanics and electromechanics required for the understanding and the design of mechanical microsensors are described on a level accessible to engineers of all disciplines. Students in engineering sciences from the third year on should be able to benefit from this description. The most important mechanical sensors are described and discussed in detail with respect to fabrication issues, function and performance. Special emphasis is given to pressure sensors, force sensors, accelerometers, gyroscopes and flow sensors. Electronic interfacing, and a discussion of electronic circuits used for the sensors is also included. Finally the problem of packaging is addressed Materials Science Nanotechnology Theoretical and Applied Mechanics Measurement Science and Instrumentation Electronics and Microelectronics, Instrumentation Control, Robotics, Mechatronics Materials science Physical measurements Measurement Mechanics Mechanics, Applied Control engineering Robotics Mechatronics Electronics Microelectronics Mikromechanik (DE-588)4205811-9 gnd rswk-swf Mikrosensor (DE-588)4561097-6 gnd rswk-swf Mikrosensor (DE-588)4561097-6 s Mikromechanik (DE-588)4205811-9 s 1\p DE-604 Wiegerink, Remco aut Erscheint auch als Druck-Ausgabe 9783642087066 https://doi.org/10.1007/978-3-662-04321-9 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Elwenspoek, Miko Wiegerink, Remco Mechanical Microsensors Materials Science Nanotechnology Theoretical and Applied Mechanics Measurement Science and Instrumentation Electronics and Microelectronics, Instrumentation Control, Robotics, Mechatronics Materials science Physical measurements Measurement Mechanics Mechanics, Applied Control engineering Robotics Mechatronics Electronics Microelectronics Mikromechanik (DE-588)4205811-9 gnd Mikrosensor (DE-588)4561097-6 gnd |
subject_GND | (DE-588)4205811-9 (DE-588)4561097-6 |
title | Mechanical Microsensors |
title_auth | Mechanical Microsensors |
title_exact_search | Mechanical Microsensors |
title_full | Mechanical Microsensors by Miko Elwenspoek, Remco Wiegerink |
title_fullStr | Mechanical Microsensors by Miko Elwenspoek, Remco Wiegerink |
title_full_unstemmed | Mechanical Microsensors by Miko Elwenspoek, Remco Wiegerink |
title_short | Mechanical Microsensors |
title_sort | mechanical microsensors |
topic | Materials Science Nanotechnology Theoretical and Applied Mechanics Measurement Science and Instrumentation Electronics and Microelectronics, Instrumentation Control, Robotics, Mechatronics Materials science Physical measurements Measurement Mechanics Mechanics, Applied Control engineering Robotics Mechatronics Electronics Microelectronics Mikromechanik (DE-588)4205811-9 gnd Mikrosensor (DE-588)4561097-6 gnd |
topic_facet | Materials Science Nanotechnology Theoretical and Applied Mechanics Measurement Science and Instrumentation Electronics and Microelectronics, Instrumentation Control, Robotics, Mechatronics Materials science Physical measurements Measurement Mechanics Mechanics, Applied Control engineering Robotics Mechatronics Electronics Microelectronics Mikromechanik Mikrosensor |
url | https://doi.org/10.1007/978-3-662-04321-9 |
work_keys_str_mv | AT elwenspoekmiko mechanicalmicrosensors AT wiegerinkremco mechanicalmicrosensors |