Area Array Interconnection Handbook:
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and...
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| Weitere Verfasser: | , |
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
2001
|
| Schlagworte: | |
| Online-Zugang: | FHI01 BTU01 Volltext |
| Zusammenfassung: | Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects |
| Beschreibung: | 1 Online-Ressource (CXXXVI, 1188 p) |
| ISBN: | 9781461513896 |
| DOI: | 10.1007/978-1-4615-1389-6 |
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| 520 | |a Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects | ||
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/978-1-4615-1389-6 |
| format | Electronic eBook |
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| id | DE-604.BV045148906 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:02Z |
| institution | BVB |
| isbn | 9781461513896 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030538605 |
| oclc_num | 1050947549 |
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| physical | 1 Online-Ressource (CXXXVI, 1188 p) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_Archiv |
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| publisher | Springer US |
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| spelling | Area Array Interconnection Handbook edited by Karl J. Puttlitz, Paul A. Totta Boston, MA Springer US 2001 1 Online-Ressource (CXXXVI, 1188 p) txt rdacontent c rdamedia cr rdacarrier Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects Engineering Circuits and Systems Manufacturing, Machines, Tools Climate Change Electrical Engineering Manufacturing industries Machines Tools Electrical engineering Electronic circuits Climate change Puttlitz, Karl J. edt Totta, Paul A. edt Erscheint auch als Druck-Ausgabe 9781461355298 https://doi.org/10.1007/978-1-4615-1389-6 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Area Array Interconnection Handbook Engineering Circuits and Systems Manufacturing, Machines, Tools Climate Change Electrical Engineering Manufacturing industries Machines Tools Electrical engineering Electronic circuits Climate change |
| title | Area Array Interconnection Handbook |
| title_auth | Area Array Interconnection Handbook |
| title_exact_search | Area Array Interconnection Handbook |
| title_full | Area Array Interconnection Handbook edited by Karl J. Puttlitz, Paul A. Totta |
| title_fullStr | Area Array Interconnection Handbook edited by Karl J. Puttlitz, Paul A. Totta |
| title_full_unstemmed | Area Array Interconnection Handbook edited by Karl J. Puttlitz, Paul A. Totta |
| title_short | Area Array Interconnection Handbook |
| title_sort | area array interconnection handbook |
| topic | Engineering Circuits and Systems Manufacturing, Machines, Tools Climate Change Electrical Engineering Manufacturing industries Machines Tools Electrical engineering Electronic circuits Climate change |
| topic_facet | Engineering Circuits and Systems Manufacturing, Machines, Tools Climate Change Electrical Engineering Manufacturing industries Machines Tools Electrical engineering Electronic circuits Climate change |
| url | https://doi.org/10.1007/978-1-4615-1389-6 |
| work_keys_str_mv | AT puttlitzkarlj areaarrayinterconnectionhandbook AT tottapaula areaarrayinterconnectionhandbook |