Foldable Flex and Thinned Silicon Multichip Packaging Technology:
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages...
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| Other Authors: | |
|---|---|
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Boston, MA
Springer US
2003
|
| Series: | Emerging Technology in Advanced Packaging Series
1 |
| Subjects: | |
| Online Access: | FHI01 BTU01 Volltext |
| Summary: | Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means |
| Physical Description: | 1 Online-Ressource (XIX, 347 p. 266 illus) |
| ISBN: | 9781461502319 |
| DOI: | 10.1007/978-1-4615-0231-9 |
Staff View
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Record in the Search Index
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| discipline | Werkstoffwissenschaften / Fertigungstechnik |
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| id | DE-604.BV045148815 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:02Z |
| institution | BVB |
| isbn | 9781461502319 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030538514 |
| oclc_num | 1050933767 |
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| owner_facet | DE-573 DE-634 |
| physical | 1 Online-Ressource (XIX, 347 p. 266 illus) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_Archiv |
| publishDate | 2003 |
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| publisher | Springer US |
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| series2 | Emerging Technology in Advanced Packaging Series |
| spelling | Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde Boston, MA Springer US 2003 1 Online-Ressource (XIX, 347 p. 266 illus) txt rdacontent c rdamedia cr rdacarrier Emerging Technology in Advanced Packaging Series 1 Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Balde, John W. edt Erscheint auch als Druck-Ausgabe 9780792376767 https://doi.org/10.1007/978-1-4615-0231-9 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Foldable Flex and Thinned Silicon Multichip Packaging Technology Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
| title | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| title_auth | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| title_exact_search | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| title_full | Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde |
| title_fullStr | Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde |
| title_full_unstemmed | Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde |
| title_short | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| title_sort | foldable flex and thinned silicon multichip packaging technology |
| topic | Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
| topic_facet | Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
| url | https://doi.org/10.1007/978-1-4615-0231-9 |
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