Foldable Flex and Thinned Silicon Multichip Packaging Technology:
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages...
Gespeichert in:
| Weitere Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
2003
|
| Schriftenreihe: | Emerging Technology in Advanced Packaging Series
1 |
| Schlagworte: | |
| Online-Zugang: | FHI01 BTU01 URL des Erstveröffentlichers |
| Zusammenfassung: | Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means |
| Beschreibung: | 1 Online-Ressource (XIX, 347 p. 266 illus) |
| ISBN: | 9781461502319 |
| DOI: | 10.1007/978-1-4615-0231-9 |
Internformat
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| 520 | |a Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means | ||
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Datensatz im Suchindex
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| author2 | Balde, John W. |
| author2_role | edt |
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| author_facet | Balde, John W. |
| building | Verbundindex |
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| dewey-full | 670 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 670 - Manufacturing |
| dewey-raw | 670 |
| dewey-search | 670 |
| dewey-sort | 3670 |
| dewey-tens | 670 - Manufacturing |
| discipline | Werkstoffwissenschaften / Fertigungstechnik |
| doi_str_mv | 10.1007/978-1-4615-0231-9 |
| format | Electronic eBook |
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| id | DE-604.BV045148815 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:02Z |
| institution | BVB |
| isbn | 9781461502319 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030538514 |
| oclc_num | 1050933767 |
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| physical | 1 Online-Ressource (XIX, 347 p. 266 illus) |
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| publisher | Springer US |
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| series2 | Emerging Technology in Advanced Packaging Series |
| spelling | Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde Boston, MA Springer US 2003 1 Online-Ressource (XIX, 347 p. 266 illus) txt rdacontent c rdamedia cr rdacarrier Emerging Technology in Advanced Packaging Series 1 Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials Balde, John W. edt Erscheint auch als Druck-Ausgabe 9780792376767 https://doi.org/10.1007/978-1-4615-0231-9 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Foldable Flex and Thinned Silicon Multichip Packaging Technology Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
| title | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| title_auth | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| title_exact_search | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| title_full | Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde |
| title_fullStr | Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde |
| title_full_unstemmed | Foldable Flex and Thinned Silicon Multichip Packaging Technology edited by John W. Balde |
| title_short | Foldable Flex and Thinned Silicon Multichip Packaging Technology |
| title_sort | foldable flex and thinned silicon multichip packaging technology |
| topic | Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
| topic_facet | Engineering Manufacturing, Machines, Tools Theoretical and Computational Chemistry Electrical Engineering Optical and Electronic Materials Chemistry, Physical and theoretical Manufacturing industries Machines Tools Electrical engineering Optical materials Electronic materials |
| url | https://doi.org/10.1007/978-1-4615-0231-9 |
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