APA (7th ed.) Citation

Balde, J. W. (2003). Foldable Flex and Thinned Silicon Multichip Packaging Technology. Springer US. https://doi.org/10.1007/978-1-4615-0231-9

Chicago Style (17th ed.) Citation

Balde, John W. Foldable Flex and Thinned Silicon Multichip Packaging Technology. Boston, MA: Springer US, 2003. https://doi.org/10.1007/978-1-4615-0231-9.

MLA (9th ed.) Citation

Balde, John W. Foldable Flex and Thinned Silicon Multichip Packaging Technology. Springer US, 2003. https://doi.org/10.1007/978-1-4615-0231-9.