Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Prasad, Shankara K. (VerfasserIn)
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	Boston, MA Springer US 2004
Schlagworte:	Engineering Manufacturing, Machines, Tools Electronics and Microelectronics, Instrumentation Circuits and Systems Optical and Electronic Materials Manufacturing industries Machines Tools Electronics Microelectronics Electronic circuits Optical materials Electronic materials
Online-Zugang:	FHI01 BTU01 Volltext
Zusammenfassung:	Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way
Beschreibung:	1 Online-Ressource (XXIX, 669 p)
ISBN:	9781402077630
DOI:	10.1007/b105273