Boundary-Scan Interconnect Diagnosis:
Boundary-Scan Interconnect Diagnosis explains how to synthesize digital diagnostic sequences for wire interconnects using boundary-scan, and how to assess the quality of those sequences. Its importance has to do with designing complex electronic systems using pre-designed intellectual property (IP)...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston, MA
Springer US
2001
|
| Schriftenreihe: | Frontiers in Electronic Testing
18 |
| Schlagworte: | |
| Online-Zugang: | FHI01 BTU01 Volltext |
| Zusammenfassung: | Boundary-Scan Interconnect Diagnosis explains how to synthesize digital diagnostic sequences for wire interconnects using boundary-scan, and how to assess the quality of those sequences. Its importance has to do with designing complex electronic systems using pre-designed intellectual property (IP) cores, which is becoming increasingly popular nowadays. Since tests for pre-designed cores can be supplied with the cores themselves, the only additional tests that need to be developed to test and diagnose the entire system are those for wire interconnects between the cores. Besides the trivial solutions that are often used to solve this problem, there are many more methods that enable significant optimizations of test vector length and/or diagnostic resolution. The book surveys all existing methods of this kind and proposes new ones. In the new approach circuit and interconnect faults are carefully modeled, and graph techniques are applied to solve the problem. The original feature of the new method is the fact that it can be adjusted to provide shorter test sequences and/or greater diagnostic resolution. The effectiveness of existing and proposed methods is then evaluated using real electronic assemblies and published statistical data for an actual manufacturing process from HP. |
| Beschreibung: | 1 Online-Ressource (XXI, 168 p) |
| ISBN: | 9780306479755 |
| DOI: | 10.1007/b100750 |
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| 520 | |a Boundary-Scan Interconnect Diagnosis explains how to synthesize digital diagnostic sequences for wire interconnects using boundary-scan, and how to assess the quality of those sequences. Its importance has to do with designing complex electronic systems using pre-designed intellectual property (IP) cores, which is becoming increasingly popular nowadays. Since tests for pre-designed cores can be supplied with the cores themselves, the only additional tests that need to be developed to test and diagnose the entire system are those for wire interconnects between the cores. Besides the trivial solutions that are often used to solve this problem, there are many more methods that enable significant optimizations of test vector length and/or diagnostic resolution. The book surveys all existing methods of this kind and proposes new ones. In the new approach circuit and interconnect faults are carefully modeled, and graph techniques are applied to solve the problem. The original feature of the new method is the fact that it can be adjusted to provide shorter test sequences and/or greater diagnostic resolution. The effectiveness of existing and proposed methods is then evaluated using real electronic assemblies and published statistical data for an actual manufacturing process from HP. | ||
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Datensatz im Suchindex
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| author | Sousa, José T. de Cheung, Peter Y. K. |
| author_facet | Sousa, José T. de Cheung, Peter Y. K. |
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| author_sort | Sousa, José T. de |
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| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1007/b100750 |
| format | Electronic eBook |
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| id | DE-604.BV045148527 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:10:01Z |
| institution | BVB |
| isbn | 9780306479755 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030538226 |
| oclc_num | 1050946984 |
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| physical | 1 Online-Ressource (XXI, 168 p) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_2000/2004 ZDB-2-ENG ZDB-2-ENG_Archiv |
| publishDate | 2001 |
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| publisher | Springer US |
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| series2 | Frontiers in Electronic Testing |
| spelling | Sousa, José T. de Verfasser aut Boundary-Scan Interconnect Diagnosis by José T. de Sousa, Peter Y. K. Cheung Boston, MA Springer US 2001 1 Online-Ressource (XXI, 168 p) txt rdacontent c rdamedia cr rdacarrier Frontiers in Electronic Testing 18 Boundary-Scan Interconnect Diagnosis explains how to synthesize digital diagnostic sequences for wire interconnects using boundary-scan, and how to assess the quality of those sequences. Its importance has to do with designing complex electronic systems using pre-designed intellectual property (IP) cores, which is becoming increasingly popular nowadays. Since tests for pre-designed cores can be supplied with the cores themselves, the only additional tests that need to be developed to test and diagnose the entire system are those for wire interconnects between the cores. Besides the trivial solutions that are often used to solve this problem, there are many more methods that enable significant optimizations of test vector length and/or diagnostic resolution. The book surveys all existing methods of this kind and proposes new ones. In the new approach circuit and interconnect faults are carefully modeled, and graph techniques are applied to solve the problem. The original feature of the new method is the fact that it can be adjusted to provide shorter test sequences and/or greater diagnostic resolution. The effectiveness of existing and proposed methods is then evaluated using real electronic assemblies and published statistical data for an actual manufacturing process from HP. Engineering Circuits and Systems Electrical Engineering Electrical engineering Electronic circuits Cheung, Peter Y. K. aut Erscheint auch als Druck-Ausgabe 9780792373148 https://doi.org/10.1007/b100750 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Sousa, José T. de Cheung, Peter Y. K. Boundary-Scan Interconnect Diagnosis Engineering Circuits and Systems Electrical Engineering Electrical engineering Electronic circuits |
| title | Boundary-Scan Interconnect Diagnosis |
| title_auth | Boundary-Scan Interconnect Diagnosis |
| title_exact_search | Boundary-Scan Interconnect Diagnosis |
| title_full | Boundary-Scan Interconnect Diagnosis by José T. de Sousa, Peter Y. K. Cheung |
| title_fullStr | Boundary-Scan Interconnect Diagnosis by José T. de Sousa, Peter Y. K. Cheung |
| title_full_unstemmed | Boundary-Scan Interconnect Diagnosis by José T. de Sousa, Peter Y. K. Cheung |
| title_short | Boundary-Scan Interconnect Diagnosis |
| title_sort | boundary scan interconnect diagnosis |
| topic | Engineering Circuits and Systems Electrical Engineering Electrical engineering Electronic circuits |
| topic_facet | Engineering Circuits and Systems Electrical Engineering Electrical engineering Electronic circuits |
| url | https://doi.org/10.1007/b100750 |
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