Advanced packaging and manufacturing technology based on adhesion engineering: wafer-level transfer packaging and fabrication techniques using interface energy control method
Saved in:
| Main Author: | |
|---|---|
| Format: | Book |
| Language: | English |
| Published: |
Cham
Springer
[2018]
|
| Series: | Springer Series in Advanced Manufacturing
|
| Subjects: | |
| Online Access: | Inhaltstext http://www.springer.com/ |
| Physical Description: | viii, 115 Seiten Illustrationen, Diagramme |
| ISBN: | 9783319778716 |
Staff View
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Record in the Search Index
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| author_facet | Seok, Seonho |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| id | DE-604.BV045084831 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:08:11Z |
| institution | BVB |
| isbn | 9783319778716 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030475732 |
| oclc_num | 1079405565 |
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| owner | DE-83 |
| owner_facet | DE-83 |
| physical | viii, 115 Seiten Illustrationen, Diagramme |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | Springer |
| record_format | marc |
| series2 | Springer Series in Advanced Manufacturing |
| spelling | Seok, Seonho Verfasser aut Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method Seonho Seok Cham Springer [2018] © 2018 viii, 115 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Springer Series in Advanced Manufacturing MEMS (DE-588)4824724-8 gnd rswk-swf Wafer level packaging (DE-588)1058582143 gnd rswk-swf Benzocyclobutan (DE-588)4775842-9 gnd rswk-swf Polymer Packaging cap Transfer packaging MEMS packaging Surface modification Wafer-level MEMS (DE-588)4824724-8 s Benzocyclobutan (DE-588)4775842-9 s Wafer level packaging (DE-588)1058582143 s DE-604 X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=4b7f03c8022f4da4bdd0f2934e4cf51f&prov=M&dok_var=1&dok_ext=htm Inhaltstext X:MVB http://www.springer.com/ |
| spellingShingle | Seok, Seonho Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method MEMS (DE-588)4824724-8 gnd Wafer level packaging (DE-588)1058582143 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| subject_GND | (DE-588)4824724-8 (DE-588)1058582143 (DE-588)4775842-9 |
| title | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method |
| title_auth | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method |
| title_exact_search | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method |
| title_full | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method Seonho Seok |
| title_fullStr | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method Seonho Seok |
| title_full_unstemmed | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method Seonho Seok |
| title_short | Advanced packaging and manufacturing technology based on adhesion engineering |
| title_sort | advanced packaging and manufacturing technology based on adhesion engineering wafer level transfer packaging and fabrication techniques using interface energy control method |
| title_sub | wafer-level transfer packaging and fabrication techniques using interface energy control method |
| topic | MEMS (DE-588)4824724-8 gnd Wafer level packaging (DE-588)1058582143 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| topic_facet | MEMS Wafer level packaging Benzocyclobutan |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=4b7f03c8022f4da4bdd0f2934e4cf51f&prov=M&dok_var=1&dok_ext=htm http://www.springer.com/ |
| work_keys_str_mv | AT seokseonho advancedpackagingandmanufacturingtechnologybasedonadhesionengineeringwaferleveltransferpackagingandfabricationtechniquesusinginterfaceenergycontrolmethod |