Advanced packaging and manufacturing technology based on adhesion engineering: wafer-level transfer packaging and fabrication techniques using interface energy control method
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Buch |
| Sprache: | English |
| Veröffentlicht: |
Cham
Springer
[2018]
|
| Schriftenreihe: | Springer Series in Advanced Manufacturing
|
| Schlagworte: | |
| Online-Zugang: | Inhaltstext http://www.springer.com/ |
| Beschreibung: | viii, 115 Seiten Illustrationen, Diagramme |
| ISBN: | 9783319778716 |
Internformat
MARC
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| 264 | 1 | |a Cham |b Springer |c [2018] | |
| 264 | 4 | |c © 2018 | |
| 300 | |a viii, 115 Seiten |b Illustrationen, Diagramme | ||
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| 650 | 0 | 7 | |a Wafer level packaging |0 (DE-588)1058582143 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Benzocyclobutan |0 (DE-588)4775842-9 |2 gnd |9 rswk-swf |
| 653 | |a Polymer Packaging cap | ||
| 653 | |a Transfer packaging | ||
| 653 | |a MEMS packaging | ||
| 653 | |a Surface modification | ||
| 653 | |a Wafer-level | ||
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Datensatz im Suchindex
| _version_ | 1804178703198978048 |
|---|---|
| any_adam_object | |
| author | Seok, Seonho |
| author_facet | Seok, Seonho |
| author_role | aut |
| author_sort | Seok, Seonho |
| author_variant | s s ss |
| building | Verbundindex |
| bvnumber | BV045084831 |
| classification_rvk | ZN 3620 |
| ctrlnum | (OCoLC)1079405565 (DE-599)DNB1152219847 |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| id | DE-604.BV045084831 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T08:08:11Z |
| institution | BVB |
| isbn | 9783319778716 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030475732 |
| oclc_num | 1079405565 |
| open_access_boolean | |
| owner | DE-83 |
| owner_facet | DE-83 |
| physical | viii, 115 Seiten Illustrationen, Diagramme |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | Springer |
| record_format | marc |
| series2 | Springer Series in Advanced Manufacturing |
| spelling | Seok, Seonho Verfasser aut Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method Seonho Seok Cham Springer [2018] © 2018 viii, 115 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Springer Series in Advanced Manufacturing MEMS (DE-588)4824724-8 gnd rswk-swf Wafer level packaging (DE-588)1058582143 gnd rswk-swf Benzocyclobutan (DE-588)4775842-9 gnd rswk-swf Polymer Packaging cap Transfer packaging MEMS packaging Surface modification Wafer-level MEMS (DE-588)4824724-8 s Benzocyclobutan (DE-588)4775842-9 s Wafer level packaging (DE-588)1058582143 s DE-604 X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=4b7f03c8022f4da4bdd0f2934e4cf51f&prov=M&dok_var=1&dok_ext=htm Inhaltstext X:MVB http://www.springer.com/ |
| spellingShingle | Seok, Seonho Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method MEMS (DE-588)4824724-8 gnd Wafer level packaging (DE-588)1058582143 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| subject_GND | (DE-588)4824724-8 (DE-588)1058582143 (DE-588)4775842-9 |
| title | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method |
| title_auth | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method |
| title_exact_search | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method |
| title_full | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method Seonho Seok |
| title_fullStr | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method Seonho Seok |
| title_full_unstemmed | Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method Seonho Seok |
| title_short | Advanced packaging and manufacturing technology based on adhesion engineering |
| title_sort | advanced packaging and manufacturing technology based on adhesion engineering wafer level transfer packaging and fabrication techniques using interface energy control method |
| title_sub | wafer-level transfer packaging and fabrication techniques using interface energy control method |
| topic | MEMS (DE-588)4824724-8 gnd Wafer level packaging (DE-588)1058582143 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| topic_facet | MEMS Wafer level packaging Benzocyclobutan |
| url | http://deposit.dnb.de/cgi-bin/dokserv?id=4b7f03c8022f4da4bdd0f2934e4cf51f&prov=M&dok_var=1&dok_ext=htm http://www.springer.com/ |
| work_keys_str_mv | AT seokseonho advancedpackagingandmanufacturingtechnologybasedonadhesionengineeringwaferleveltransferpackagingandfabricationtechniquesusinginterfaceenergycontrolmethod |