Seok, S. (2018). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Springer International Publishing. https://doi.org/10.1007/978-3-319-77872-3
Chicago-Zitierstil (17. Ausg.)Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Cham: Springer International Publishing, 2018. https://doi.org/10.1007/978-3-319-77872-3.
MLA-Zitierstil (9. Ausg.)Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. Springer International Publishing, 2018. https://doi.org/10.1007/978-3-319-77872-3.