Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cham
Springer International Publishing
2018
|
| Schriftenreihe: | Springer Series in Advanced Manufacturing
|
| Schlagworte: | |
| Online-Zugang: | BTU01 FAW01 FHA01 FHI01 FHM01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 HTW01 TUM01 UBY01 Volltext |
| Beschreibung: | 1 Online-Ressource (VIII, 115 p. 106 illus) |
| ISBN: | 9783319778723 |
| ISSN: | 1860-5168 |
| DOI: | 10.1007/978-3-319-77872-3 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV044935013 | ||
| 003 | DE-604 | ||
| 005 | 20180719 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180508s2018 |||| o||u| ||||||eng d | ||
| 020 | |a 9783319778723 |c Online |9 978-3-319-77872-3 | ||
| 024 | 7 | |a 10.1007/978-3-319-77872-3 |2 doi | |
| 035 | |a (ZDB-2-ENG)9783319778723 | ||
| 035 | |a (OCoLC)1035446362 | ||
| 035 | |a (DE-599)BVBBV044935013 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-860 |a DE-91 |a DE-1046 |a DE-Aug4 |a DE-898 |a DE-861 |a DE-523 |a DE-859 |a DE-863 |a DE-862 |a DE-92 |a DE-573 |a DE-M347 |a DE-706 |a DE-634 | ||
| 082 | 0 | |a 670 |2 23 | |
| 084 | |a ZN 3620 |0 (DE-625)157329: |2 rvk | ||
| 084 | |a MAS 000 |2 stub | ||
| 084 | |a ELT 000 |2 stub | ||
| 100 | 1 | |a Seok, Seonho |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering |b Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |c by Seonho Seok |
| 264 | 1 | |a Cham |b Springer International Publishing |c 2018 | |
| 300 | |a 1 Online-Ressource (VIII, 115 p. 106 illus) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Springer Series in Advanced Manufacturing |x 1860-5168 | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Nanotechnology | |
| 650 | 4 | |a Manufacturing industries | |
| 650 | 4 | |a Machines | |
| 650 | 4 | |a Tools | |
| 650 | 4 | |a Tribology | |
| 650 | 4 | |a Corrosion and anti-corrosives | |
| 650 | 4 | |a Coatings | |
| 650 | 4 | |a Materials science | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Manufacturing, Machines, Tools | |
| 650 | 4 | |a Nanotechnology | |
| 650 | 4 | |a Nanotechnology and Microengineering | |
| 650 | 4 | |a Characterization and Evaluation of Materials | |
| 650 | 4 | |a Tribology, Corrosion and Coatings | |
| 650 | 0 | 7 | |a Wafer level packaging |0 (DE-588)1058582143 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a MEMS |0 (DE-588)4824724-8 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Benzocyclobutan |0 (DE-588)4775842-9 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a MEMS |0 (DE-588)4824724-8 |D s |
| 689 | 0 | 1 | |a Benzocyclobutan |0 (DE-588)4775842-9 |D s |
| 689 | 0 | 2 | |a Wafer level packaging |0 (DE-588)1058582143 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-3-319-77871-6 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-3-319-77872-3 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_2018 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030328008 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l BTU01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FAW01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FHA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FHI01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FHM01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FHN01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FHR01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FKE01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FLA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FRO01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FWS01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l FWS02 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l HTW01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l TUM01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-77872-3 |l UBY01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
Datensatz im Suchindex
| DE-BY-FWS_katkey | 688186 |
|---|---|
| _version_ | 1824554693860261889 |
| any_adam_object | |
| author | Seok, Seonho |
| author_facet | Seok, Seonho |
| author_role | aut |
| author_sort | Seok, Seonho |
| author_variant | s s ss |
| building | Verbundindex |
| bvnumber | BV044935013 |
| classification_rvk | ZN 3620 |
| classification_tum | MAS 000 ELT 000 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)9783319778723 (OCoLC)1035446362 (DE-599)BVBBV044935013 |
| dewey-full | 670 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 670 - Manufacturing |
| dewey-raw | 670 |
| dewey-search | 670 |
| dewey-sort | 3670 |
| dewey-tens | 670 - Manufacturing |
| discipline | Elektrotechnik Werkstoffwissenschaften / Fertigungstechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-3-319-77872-3 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03958nmm a2200841zc 4500</leader><controlfield tag="001">BV044935013</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20180719 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180508s2018 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783319778723</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-319-77872-3</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-319-77872-3</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)9783319778723</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1035446362</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044935013</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-860</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-523</subfield><subfield code="a">DE-859</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-M347</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-634</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">670</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 3620</subfield><subfield code="0">(DE-625)157329:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Seok, Seonho</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering</subfield><subfield code="b">Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method</subfield><subfield code="c">by Seonho Seok</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer International Publishing</subfield><subfield code="c">2018</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (VIII, 115 p. 106 illus)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Springer Series in Advanced Manufacturing</subfield><subfield code="x">1860-5168</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing industries</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Machines</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Tools</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Tribology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Corrosion and anti-corrosives</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Coatings</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Materials science</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Manufacturing, Machines, Tools</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology and Microengineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Characterization and Evaluation of Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Tribology, Corrosion and Coatings</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Wafer level packaging</subfield><subfield code="0">(DE-588)1058582143</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Benzocyclobutan</subfield><subfield code="0">(DE-588)4775842-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">MEMS</subfield><subfield code="0">(DE-588)4824724-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Benzocyclobutan</subfield><subfield code="0">(DE-588)4775842-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Wafer level packaging</subfield><subfield code="0">(DE-588)1058582143</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-319-77871-6</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2018</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030328008</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FHM01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FRO01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">FWS02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">HTW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">TUM01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-77872-3</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV044935013 |
| illustrated | Not Illustrated |
| indexdate | 2025-02-20T06:55:50Z |
| institution | BVB |
| isbn | 9783319778723 |
| issn | 1860-5168 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030328008 |
| oclc_num | 1035446362 |
| open_access_boolean | |
| owner | DE-860 DE-91 DE-BY-TUM DE-1046 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-523 DE-859 DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-92 DE-573 DE-M347 DE-706 DE-634 |
| owner_facet | DE-860 DE-91 DE-BY-TUM DE-1046 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-523 DE-859 DE-863 DE-BY-FWS DE-862 DE-BY-FWS DE-92 DE-573 DE-M347 DE-706 DE-634 |
| physical | 1 Online-Ressource (VIII, 115 p. 106 illus) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2018 |
| publishDate | 2018 |
| publishDateSearch | 2018 |
| publishDateSort | 2018 |
| publisher | Springer International Publishing |
| record_format | marc |
| series2 | Springer Series in Advanced Manufacturing |
| spellingShingle | Seok, Seonho Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method Engineering Nanotechnology Manufacturing industries Machines Tools Tribology Corrosion and anti-corrosives Coatings Materials science Manufacturing, Machines, Tools Nanotechnology and Microengineering Characterization and Evaluation of Materials Tribology, Corrosion and Coatings Wafer level packaging (DE-588)1058582143 gnd MEMS (DE-588)4824724-8 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| subject_GND | (DE-588)1058582143 (DE-588)4824724-8 (DE-588)4775842-9 |
| title | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_auth | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_exact_search | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| title_full | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method by Seonho Seok |
| title_fullStr | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method by Seonho Seok |
| title_full_unstemmed | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method by Seonho Seok |
| title_short | Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering |
| title_sort | advanced packaging and manufacturing technology based on adhesion engineering wafer level transfer packaging and fabrication techniques using interface energy control method |
| title_sub | Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method |
| topic | Engineering Nanotechnology Manufacturing industries Machines Tools Tribology Corrosion and anti-corrosives Coatings Materials science Manufacturing, Machines, Tools Nanotechnology and Microengineering Characterization and Evaluation of Materials Tribology, Corrosion and Coatings Wafer level packaging (DE-588)1058582143 gnd MEMS (DE-588)4824724-8 gnd Benzocyclobutan (DE-588)4775842-9 gnd |
| topic_facet | Engineering Nanotechnology Manufacturing industries Machines Tools Tribology Corrosion and anti-corrosives Coatings Materials science Manufacturing, Machines, Tools Nanotechnology and Microengineering Characterization and Evaluation of Materials Tribology, Corrosion and Coatings Wafer level packaging MEMS Benzocyclobutan |
| url | https://doi.org/10.1007/978-3-319-77872-3 |
| work_keys_str_mv | AT seokseonho advancedpackagingandmanufacturingtechnologybasedonadhesionengineeringwaferleveltransferpackagingandfabricationtechniquesusinginterfaceenergycontrolmethod |